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TW200643227A - The insoluble anode electroplating system and the processing method of the same - Google Patents

The insoluble anode electroplating system and the processing method of the same

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Publication number
TW200643227A
TW200643227A TW094118148A TW94118148A TW200643227A TW 200643227 A TW200643227 A TW 200643227A TW 094118148 A TW094118148 A TW 094118148A TW 94118148 A TW94118148 A TW 94118148A TW 200643227 A TW200643227 A TW 200643227A
Authority
TW
Taiwan
Prior art keywords
insoluble anode
processing method
anode
same
electroplating
Prior art date
Application number
TW094118148A
Other languages
Chinese (zh)
Inventor
wen-feng Zheng
zu-de Xiong
Jian-Cheng Li
Original Assignee
Boardtek Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boardtek Electronics Corp filed Critical Boardtek Electronics Corp
Priority to TW094118148A priority Critical patent/TW200643227A/en
Publication of TW200643227A publication Critical patent/TW200643227A/en

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  • Separation Using Semi-Permeable Membranes (AREA)

Abstract

An insoluble anode electroplating system and processing method of the same is disclosed. It is characterized by placing the semi-permeable membrance between the plating sheet of cathode and the insoluble anode in the electroplating tank. The membrane is used to prevent contacting of additives in the electroplating tank with oxygen or free radicals produced by the anode. With this method, consumption of additives can be reduced. It can also prevent direct contact of trace metal impurities in the electroplating solution from the insoluble anode to increases lifetime of the anode.
TW094118148A 2005-06-02 2005-06-02 The insoluble anode electroplating system and the processing method of the same TW200643227A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094118148A TW200643227A (en) 2005-06-02 2005-06-02 The insoluble anode electroplating system and the processing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094118148A TW200643227A (en) 2005-06-02 2005-06-02 The insoluble anode electroplating system and the processing method of the same

Publications (1)

Publication Number Publication Date
TW200643227A true TW200643227A (en) 2006-12-16

Family

ID=57810099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118148A TW200643227A (en) 2005-06-02 2005-06-02 The insoluble anode electroplating system and the processing method of the same

Country Status (1)

Country Link
TW (1) TW200643227A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105019008A (en) * 2014-04-30 2015-11-04 先丰通讯股份有限公司 Electroplating device
CN113604841A (en) * 2021-07-22 2021-11-05 田成 Method for extracting and recovering valuable metal from waste liquid by non-inert anode plate
CN114059137A (en) * 2021-12-15 2022-02-18 重庆立道新材料科技有限公司 Insoluble anode electroplating device
CN115558974A (en) * 2022-09-26 2023-01-03 深圳崇达多层线路板有限公司 A new electroplating device
CN116024634A (en) * 2022-09-26 2023-04-28 深圳崇达多层线路板有限公司 Electroplating device and application
TWI887661B (en) * 2023-05-25 2025-06-21 國立清華大學 Electrode set and device for tissue transparentizing

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105019008A (en) * 2014-04-30 2015-11-04 先丰通讯股份有限公司 Electroplating device
CN105019008B (en) * 2014-04-30 2017-04-19 先丰通讯股份有限公司 Electroplating device
CN113604841A (en) * 2021-07-22 2021-11-05 田成 Method for extracting and recovering valuable metal from waste liquid by non-inert anode plate
CN114059137A (en) * 2021-12-15 2022-02-18 重庆立道新材料科技有限公司 Insoluble anode electroplating device
CN115558974A (en) * 2022-09-26 2023-01-03 深圳崇达多层线路板有限公司 A new electroplating device
CN116024634A (en) * 2022-09-26 2023-04-28 深圳崇达多层线路板有限公司 Electroplating device and application
TWI887661B (en) * 2023-05-25 2025-06-21 國立清華大學 Electrode set and device for tissue transparentizing

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