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TW200643126A - Conductive inks and manufacturing method thereof - Google Patents

Conductive inks and manufacturing method thereof

Info

Publication number
TW200643126A
TW200643126A TW095109413A TW95109413A TW200643126A TW 200643126 A TW200643126 A TW 200643126A TW 095109413 A TW095109413 A TW 095109413A TW 95109413 A TW95109413 A TW 95109413A TW 200643126 A TW200643126 A TW 200643126A
Authority
TW
Taiwan
Prior art keywords
manufacturing
conductive inks
metal
additive
preparing
Prior art date
Application number
TW095109413A
Other languages
Chinese (zh)
Other versions
TWI326297B (en
Inventor
Kwang-Choon Chung
Hyun-Nam Cho
Myoung-Seon Gong
Yi-Sup Han
Jeong-Bin Park
Dong Hun Nam
Seong Yong Uhm
Young Kwan Seo
Nam Bu Cho
Original Assignee
Inktec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050023013A external-priority patent/KR100658492B1/en
Priority claimed from KR1020050031090A external-priority patent/KR100667958B1/en
Priority claimed from KR1020050034371A external-priority patent/KR100727451B1/en
Application filed by Inktec Co Ltd filed Critical Inktec Co Ltd
Publication of TW200643126A publication Critical patent/TW200643126A/en
Application granted granted Critical
Publication of TWI326297B publication Critical patent/TWI326297B/en

Links

Landscapes

  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)

Abstract

The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.
TW95109413A 2005-03-21 2006-03-20 Conductive ink composition and preparing method thereof TWI326297B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020050023013A KR100658492B1 (en) 2005-03-21 2005-03-21 Conductive ink composition and thin film forming method using same
KR1020050031090A KR100667958B1 (en) 2005-04-14 2005-04-14 Silver ink composition
KR1020050034371A KR100727451B1 (en) 2005-04-26 2005-04-26 Metal ink composition

Publications (2)

Publication Number Publication Date
TW200643126A true TW200643126A (en) 2006-12-16
TWI326297B TWI326297B (en) 2010-06-21

Family

ID=45074330

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95109413A TWI326297B (en) 2005-03-21 2006-03-20 Conductive ink composition and preparing method thereof

Country Status (1)

Country Link
TW (1) TWI326297B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491328B (en) * 2012-02-03 2015-07-01 Empire Technology Dev Llc Printable electronics substrate
TWI496846B (en) * 2012-11-26 2015-08-21 Hanwha Chemical Corp Ink composition and anti-static film using them
TWI514944B (en) * 2010-04-01 2015-12-21 Inktec Co Ltd Double-layer printed circuit board and preparation method thereof
CN109827918A (en) * 2019-04-03 2019-05-31 广西壮族自治区冶金产品质量检验站 The measuring method of silicone content in tin-doped indium oxide powder
TWI755431B (en) * 2016-10-14 2022-02-21 美商Ｃ３奈米有限公司 Stabilized sparse metal conductive films

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101260956B1 (en) * 2011-02-25 2013-05-06 한화케미칼 주식회사 Composition of Conductive Ink for Offset or Reverse­offset Printing
US20140020751A1 (en) * 2011-04-07 2014-01-23 Su-Hee Lee Ag paste composition for forming electrode and preparation method thereof
TWI524825B (en) 2012-10-29 2016-03-01 財團法人工業技術研究院 Method of transferring carbon conductive film
WO2021101885A1 (en) 2019-11-18 2021-05-27 C3Nano Inc. Coatings and processing of transparent conductive films for stabilization of sparse metal conductive layers

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI514944B (en) * 2010-04-01 2015-12-21 Inktec Co Ltd Double-layer printed circuit board and preparation method thereof
TWI491328B (en) * 2012-02-03 2015-07-01 Empire Technology Dev Llc Printable electronics substrate
TWI496846B (en) * 2012-11-26 2015-08-21 Hanwha Chemical Corp Ink composition and anti-static film using them
TWI755431B (en) * 2016-10-14 2022-02-21 美商Ｃ３奈米有限公司 Stabilized sparse metal conductive films
CN109827918A (en) * 2019-04-03 2019-05-31 广西壮族自治区冶金产品质量检验站 The measuring method of silicone content in tin-doped indium oxide powder

Also Published As

Publication number Publication date
TWI326297B (en) 2010-06-21

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