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TW200641914A - Coated fine particle and their manufacturing method, and conductive fine particle - Google Patents

Coated fine particle and their manufacturing method, and conductive fine particle

Info

Publication number
TW200641914A
TW200641914A TW095109861A TW95109861A TW200641914A TW 200641914 A TW200641914 A TW 200641914A TW 095109861 A TW095109861 A TW 095109861A TW 95109861 A TW95109861 A TW 95109861A TW 200641914 A TW200641914 A TW 200641914A
Authority
TW
Taiwan
Prior art keywords
fine particle
coated
manufacturing
core
conductive
Prior art date
Application number
TW095109861A
Other languages
Chinese (zh)
Other versions
TWI356425B (en
Inventor
Tsuyoshi Yamashita
Mitsuo Kushino
Mamiko Kurosawa
Original Assignee
Nippon Catalytic Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Catalytic Chem Ind filed Critical Nippon Catalytic Chem Ind
Publication of TW200641914A publication Critical patent/TW200641914A/en
Application granted granted Critical
Publication of TWI356425B publication Critical patent/TWI356425B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F18/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09D161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C09D161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09D161/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09D161/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C09D161/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Paints Or Removers (AREA)
  • Non-Insulated Conductors (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemically Coating (AREA)

Abstract

The present invention provides a coated fine particle that is flexible and excellent in elasticity and has good adhesion to metals, a manufacturing method thereof, and conductive fine particle having the polymer coated fine particle as a core fine particle. The coated fine particle comprises a core fine particle containing an organic material or an organic and inorganic composite material and a polymer coated layer on a surface of the core fine particle formed by ring-opening reaction and/or polycondensation reaction on the surface of the core fine particle.
TW095109861A 2005-03-24 2006-03-22 Coated fine particle and their manufacturing metho TWI356425B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005086718 2005-03-24

Publications (2)

Publication Number Publication Date
TW200641914A true TW200641914A (en) 2006-12-01
TWI356425B TWI356425B (en) 2012-01-11

Family

ID=37023902

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109861A TWI356425B (en) 2005-03-24 2006-03-22 Coated fine particle and their manufacturing metho

Country Status (5)

Country Link
JP (1) JP4950662B2 (en)
KR (1) KR100893550B1 (en)
CN (1) CN101146838B (en)
TW (1) TWI356425B (en)
WO (1) WO2006101263A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403414B (en) * 2009-07-31 2013-08-01 Cheng Kou Bin Inorganic slurry, complex foam, and method for preparing thereof
TWI757796B (en) * 2020-07-10 2022-03-11 大陸商業成科技（成都）有限公司 Healing particle and method for thermoforming

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4528178B2 (en) * 2005-03-28 2010-08-18 積水化成品工業株式会社 Method for producing surface-coated crosslinked polymer particles
JP2007217486A (en) * 2006-02-15 2007-08-30 Arakawa Chem Ind Co Ltd Manufacturing method of fine polymer particle and fine polymer particle
JP2008218714A (en) * 2007-03-05 2008-09-18 Bridgestone Corp Light-permeable electromagnetic wave shielding material and its production process, fine particle having extremely thin film of noble metal and its production process
CN101205266B (en) * 2007-12-13 2010-06-02 厦门大学 A kind of preparation method of conductive polymer nanomaterial with spherical shell structure
CN100500700C (en) * 2007-12-13 2009-06-17 厦门大学 A method for preparing conductive polymer microspheres with monodisperse particle size and core-shell structure
KR20160137589A (en) * 2008-09-25 2016-11-30 우베 에쿠시모 가부시키가이샤 Method for forming metal coating film, and electrically conductive particle
JP5419625B2 (en) * 2009-10-06 2014-02-19 株式会社日本触媒 Core-shell particle, light diffusing agent, and light diffusing medium
JP5700194B2 (en) * 2010-07-01 2015-04-15 住友ベークライト株式会社 Method for producing flat conductive particles
JP5657971B2 (en) * 2010-09-22 2015-01-21 株式会社日本触媒 Method for producing amino resin crosslinked particles
JP6046414B2 (en) * 2011-08-29 2016-12-14 株式会社日本触媒 Resin fine particles, toner additive, and electrostatic image developing toner
CN102558410B (en) * 2012-01-20 2013-10-30 齐齐哈尔大学 Preparation method of self-assembled three-dimensional ordered polystyrene colloidal crystal
CN104684970B (en) * 2013-01-24 2018-01-30 积水化学工业株式会社 Substrate particles, conductive particles, conductive materials, and bonded structures
JP6505391B2 (en) * 2014-08-18 2019-04-24 積水化学工業株式会社 Bonding material for electronic device and ceramic package
WO2020095796A1 (en) * 2018-11-07 2020-05-14 日本化学工業株式会社 Coated particle, electrically conductive material comprising same, and method of manufacturing coated particle
CN109342392B (en) * 2018-11-09 2021-09-17 中国科学院烟台海岸带研究所 Surface-enhanced Raman scattering nano probe taking polystyrene as coating shell material and preparation method thereof
TW202236310A (en) * 2020-12-17 2022-09-16 日商積水化學工業股份有限公司 Conductive particle, socket, conductive material, and connecting structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0617374B2 (en) * 1984-10-11 1994-03-09 株式会社日本触媒 Method for producing aqueous resin dispersion
JPS6391130A (en) * 1986-10-06 1988-04-21 Nippon Shokubai Kagaku Kogyo Co Ltd Reactive surfactant
US5503932A (en) * 1993-11-17 1996-04-02 Nippon Shokubai Co., Ltd. Organic-inorganic composite particles and production process therefor
DE10160328A1 (en) * 2001-12-07 2003-06-18 Merck Patent Gmbh Microparticulate material
JP4022177B2 (en) * 2002-06-19 2007-12-12 株式会社日本触媒 Organic inorganic composite fine particles and uses thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403414B (en) * 2009-07-31 2013-08-01 Cheng Kou Bin Inorganic slurry, complex foam, and method for preparing thereof
TWI757796B (en) * 2020-07-10 2022-03-11 大陸商業成科技（成都）有限公司 Healing particle and method for thermoforming

Also Published As

Publication number Publication date
TWI356425B (en) 2012-01-11
KR20070121769A (en) 2007-12-27
JP2008533212A (en) 2008-08-21
KR100893550B1 (en) 2009-04-17
CN101146838A (en) 2008-03-19
CN101146838B (en) 2010-12-01
JP4950662B2 (en) 2012-06-13
WO2006101263A1 (en) 2006-09-28

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees