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TW200641366A - Apparatus, program, and method for substrate inspection - Google Patents

Apparatus, program, and method for substrate inspection

Info

Publication number
TW200641366A
TW200641366A TW095101837A TW95101837A TW200641366A TW 200641366 A TW200641366 A TW 200641366A TW 095101837 A TW095101837 A TW 095101837A TW 95101837 A TW95101837 A TW 95101837A TW 200641366 A TW200641366 A TW 200641366A
Authority
TW
Taiwan
Prior art keywords
measuring
section
substrate
resistance value
inspection
Prior art date
Application number
TW095101837A
Other languages
Chinese (zh)
Other versions
TWI390222B (en
Inventor
Kiyoshi Numata
Munehiro Yamashita
Harumi Kadota
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW200641366A publication Critical patent/TW200641366A/en
Application granted granted Critical
Publication of TWI390222B publication Critical patent/TWI390222B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

In a substrate inspecting apparatus, a CPU (811) for a control section is provided with a reference resistance measuring section (811a) for measuring a reference resistance value, which is a resistance value within a measuring point set, with respect to a previously selected reference substrate; a threshold value setting section (811c) for setting a threshold value for each measuring set; an inspection resistance measuring section (811d) for measuring, as an inspection resistance value, the resistance value within the measuring point set of the substrate to be inspected; and a judging section (811e) for judging conformity of the inspection resistance value, based on the threshold value, for each measuring point set. Thus, continuity inspection of the substrate to be inspected can be accurately inspected.
TW095101837A 2005-01-18 2006-01-18 Substrate detection device and substrate detection method TWI390222B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005010780A JP4959942B2 (en) 2005-01-18 2005-01-18 Substrate inspection apparatus, substrate inspection program, and substrate inspection method

Publications (2)

Publication Number Publication Date
TW200641366A true TW200641366A (en) 2006-12-01
TWI390222B TWI390222B (en) 2013-03-21

Family

ID=36692212

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101837A TWI390222B (en) 2005-01-18 2006-01-18 Substrate detection device and substrate detection method

Country Status (4)

Country Link
JP (1) JP4959942B2 (en)
KR (1) KR101135440B1 (en)
TW (1) TWI390222B (en)
WO (1) WO2006077823A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102879646A (en) * 2011-07-15 2013-01-16 日本电产理德株式会社 Base plate inspection device and base plate inspection method
TWI481882B (en) * 2013-04-12 2015-04-21 Giga Byte Tech Co Ltd Eletrical circuit board testing system and testing method thereof

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101363884B (en) 2007-08-10 2010-10-06 富葵精密组件(深圳)有限公司 Method for testing circuit board
KR101474770B1 (en) * 2008-05-20 2014-12-22 삼성전자 주식회사 A printed circuit board
JP5461268B2 (en) * 2010-03-29 2014-04-02 日置電機株式会社 Board inspection system
JP5672783B2 (en) * 2010-06-11 2015-02-18 富士通株式会社 Measuring apparatus, measuring program and measuring method
JP6414389B2 (en) * 2014-04-21 2018-10-31 日本電産リード株式会社 Inspection jig, substrate inspection apparatus, and substrate inspection method
TWI834728B (en) * 2018-11-09 2024-03-11 日商日本電產理德股份有限公司 Inspection instruction information generation device, substrate inspection system, inspection instruction information generation method and inspection instruction information generation program
WO2020202832A1 (en) * 2019-03-29 2020-10-08 日本電産リード株式会社 Measurement method and inspection device
KR102772445B1 (en) * 2020-03-02 2025-02-25 주식회사 엘지에너지솔루션 A detecting device of welding defect
KR102449983B1 (en) * 2020-10-28 2022-10-04 주식회사 에머릭스 Printed assembly circuit board assembly inspection device
KR102425162B1 (en) * 2020-10-28 2022-07-27 주식회사 에머릭스 Substrate inspection device
KR102382569B1 (en) * 2020-10-28 2022-04-01 주식회사 에머릭스 Method for inspecting printed assembly circuit board assembly using printed circuit board assembly inspection device
CN114167259A (en) * 2021-12-07 2022-03-11 华东光电集成器件研究所 Method for programming and testing on-off of through holes of multi-piece substrate
KR102690177B1 (en) * 2021-12-13 2024-08-05 주식회사엔피엑스 Substrate inspecting device using artificial intelligence
KR102793979B1 (en) * 2023-02-01 2025-04-15 스피닉스 주식회사 Inspection apparatus and method for printed circuit board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697254B2 (en) * 1987-12-15 1994-11-30 日置電機株式会社 Circuit board inspection method
JPH0758313B2 (en) * 1988-04-28 1995-06-21 日置電機株式会社 Circuit board inspection method
JPH07109429B2 (en) * 1990-04-05 1995-11-22 日置電機株式会社 Method of creating component connection state data of mounting board in circuit board inspection apparatus
JP3241777B2 (en) * 1991-12-10 2001-12-25 日置電機株式会社 Open test equipment for in-circuit tester
JPH0674990A (en) * 1992-08-27 1994-03-18 Fujitsu Ltd Wiring short detection method
JPH10104301A (en) * 1996-09-30 1998-04-24 Ibiden Co Ltd Method for inspecting package substrate
JPH10111337A (en) * 1996-10-08 1998-04-28 Fujitsu Ltd How to create wiring test data for printed wiring boards
JPH10142281A (en) * 1996-11-08 1998-05-29 Hioki Ee Corp Circuit board inspection method
JP3784479B2 (en) * 1996-12-05 2006-06-14 日置電機株式会社 Circuit board inspection method
JP2001330642A (en) * 2000-05-19 2001-11-30 Mitsubishi Electric Corp Short circuit analysis and identification device for rotating machine coil
JP2003215193A (en) * 2002-01-29 2003-07-30 Mitsubishi Electric Corp Electrode inspecting method, inspecting device, program, and recording medium

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102879646A (en) * 2011-07-15 2013-01-16 日本电产理德株式会社 Base plate inspection device and base plate inspection method
TWI465732B (en) * 2011-07-15 2014-12-21 Nidec Read Corp Substrate inspecting apparatus and substrate inspecting method
CN102879646B (en) * 2011-07-15 2015-03-25 日本电产理德株式会社 Base plate inspection device and base plate inspection method
TWI481882B (en) * 2013-04-12 2015-04-21 Giga Byte Tech Co Ltd Eletrical circuit board testing system and testing method thereof

Also Published As

Publication number Publication date
TWI390222B (en) 2013-03-21
WO2006077823A1 (en) 2006-07-27
KR101135440B1 (en) 2012-05-25
JP2006200946A (en) 2006-08-03
JP4959942B2 (en) 2012-06-27
KR20070097058A (en) 2007-10-02

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