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TW200640324A - Improved printed circuit board structure for high frequency signal - Google Patents

Improved printed circuit board structure for high frequency signal

Info

Publication number
TW200640324A
TW200640324A TW094115541A TW94115541A TW200640324A TW 200640324 A TW200640324 A TW 200640324A TW 094115541 A TW094115541 A TW 094115541A TW 94115541 A TW94115541 A TW 94115541A TW 200640324 A TW200640324 A TW 200640324A
Authority
TW
Taiwan
Prior art keywords
signal transmission
high frequency
transmission lines
circuit board
printed circuit
Prior art date
Application number
TW094115541A
Other languages
Chinese (zh)
Other versions
TWI291848B (en
Inventor
Shou-Kuo Hsu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW94115541A priority Critical patent/TWI291848B/en
Publication of TW200640324A publication Critical patent/TW200640324A/en
Application granted granted Critical
Publication of TWI291848B publication Critical patent/TWI291848B/en

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

An improved printed circuit board structure for high frequency signal has a plurality of signal transmission lines, a first ground plain that is near the signal transmission lines, and a second ground plain that is far from the signal transmission lines. Each of the signal transmission lines includes a pair of difference signal lines. Under conditions of fixed-width of each difference signal line and fixed-distance between the pair of difference signal lines, the signal transmission lines are made to reference the second ground plain thereby increasing the impedance of signal transmission lines to meet with the impedance requirement in high frequency signal transmission.
TW94115541A 2005-05-13 2005-05-13 Improved printed circuit board structure for high frequency signal TWI291848B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94115541A TWI291848B (en) 2005-05-13 2005-05-13 Improved printed circuit board structure for high frequency signal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94115541A TWI291848B (en) 2005-05-13 2005-05-13 Improved printed circuit board structure for high frequency signal

Publications (2)

Publication Number Publication Date
TW200640324A true TW200640324A (en) 2006-11-16
TWI291848B TWI291848B (en) 2007-12-21

Family

ID=39461300

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94115541A TWI291848B (en) 2005-05-13 2005-05-13 Improved printed circuit board structure for high frequency signal

Country Status (1)

Country Link
TW (1) TWI291848B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113709961A (en) * 2020-05-22 2021-11-26 北京小米移动软件有限公司 Circuit board and terminal equipment
CN115023026A (en) * 2021-10-27 2022-09-06 荣耀终端有限公司 Circuit boards and electronics

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6235787B2 (en) * 2013-03-29 2017-11-22 東レ・デュポン株式会社 Coverlay for high frequency circuit boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113709961A (en) * 2020-05-22 2021-11-26 北京小米移动软件有限公司 Circuit board and terminal equipment
CN115023026A (en) * 2021-10-27 2022-09-06 荣耀终端有限公司 Circuit boards and electronics

Also Published As

Publication number Publication date
TWI291848B (en) 2007-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees