TW200644299A - Group III-V nitride semiconductor laminated substrate, method of producing the same and semiconductor device - Google Patents
Group III-V nitride semiconductor laminated substrate, method of producing the same and semiconductor deviceInfo
- Publication number
- TW200644299A TW200644299A TW095116014A TW95116014A TW200644299A TW 200644299 A TW200644299 A TW 200644299A TW 095116014 A TW095116014 A TW 095116014A TW 95116014 A TW95116014 A TW 95116014A TW 200644299 A TW200644299 A TW 200644299A
- Authority
- TW
- Taiwan
- Prior art keywords
- group iii
- nitride semiconductor
- laminated substrate
- producing
- same
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 9
- 150000004767 nitrides Chemical class 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 title abstract 3
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
- H01L21/02642—Mask materials other than SiO2 or SiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Led Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Semiconductor Lasers (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005146346 | 2005-05-19 | ||
| JP2005256022A JP5023318B2 (ja) | 2005-05-19 | 2005-09-05 | 3−5族窒化物半導体積層基板、3−5族窒化物半導体自立基板の製造方法、及び半導体素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200644299A true TW200644299A (en) | 2006-12-16 |
Family
ID=37431118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095116014A TW200644299A (en) | 2005-05-19 | 2006-05-05 | Group III-V nitride semiconductor laminated substrate, method of producing the same and semiconductor device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8053811B2 (zh) |
| JP (1) | JP5023318B2 (zh) |
| KR (1) | KR20080003913A (zh) |
| DE (1) | DE112006001279T5 (zh) |
| GB (1) | GB2440484A (zh) |
| TW (1) | TW200644299A (zh) |
| WO (1) | WO2006123540A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642117B (zh) * | 2014-02-05 | 2018-11-21 | 日商迪思科股份有限公司 | Lifting method |
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| JP5023318B2 (ja) * | 2005-05-19 | 2012-09-12 | 国立大学法人三重大学 | 3−5族窒化物半導体積層基板、3−5族窒化物半導体自立基板の製造方法、及び半導体素子 |
| JP2007001855A (ja) * | 2005-05-27 | 2007-01-11 | Sumitomo Chemical Co Ltd | 3−5族窒化物半導体積層基板、3−5族窒化物半導体自立基板の製造方法、及び半導体素子 |
| JP2008172040A (ja) * | 2007-01-12 | 2008-07-24 | Sony Corp | 半導体発光素子、半導体発光素子の製造方法、バックライト、ディスプレイおよび電子機器 |
| US8362503B2 (en) * | 2007-03-09 | 2013-01-29 | Cree, Inc. | Thick nitride semiconductor structures with interlayer structures |
| US7825432B2 (en) | 2007-03-09 | 2010-11-02 | Cree, Inc. | Nitride semiconductor structures with interlayer structures |
| JP2008270431A (ja) * | 2007-04-18 | 2008-11-06 | Sony Corp | 発光ダイオードの製造方法、半導体装置の製造方法、電子装置の製造方法および窒化物系iii−v族化合物半導体基板の製造方法 |
| WO2009120986A2 (en) * | 2008-03-27 | 2009-10-01 | Nitek, Inc. | Mixed source growth apparatus and method of fabricating iii-nitride ultraviolet emitters |
| US8581283B2 (en) | 2008-04-28 | 2013-11-12 | Advanced Optoelectronic Technology, Inc. | Photoelectric device having group III nitride semiconductor |
| TWI447783B (zh) * | 2008-04-28 | 2014-08-01 | Advanced Optoelectronic Tech | 三族氮化合物半導體發光元件之製造方法及其結構 |
| US20100025727A1 (en) * | 2008-08-04 | 2010-02-04 | Benjamin Allen Haskell | Enhanced spontaneous separation method for production of free-standing nitride thin films, substrates, and heterostructures |
| US20120094434A1 (en) * | 2008-08-04 | 2012-04-19 | Benjamin Allen Haskell | Enhanced spontaneous separation method for production of free-standing nitride thin films, substrates, and heterostructures |
| US8481411B2 (en) | 2009-06-10 | 2013-07-09 | Seoul Opto Device Co., Ltd. | Method of manufacturing a semiconductor substrate having a cavity |
| JP5647497B2 (ja) * | 2010-02-10 | 2014-12-24 | ソウル バイオシス カンパニー リミテッドSeoul Viosys Co.,Ltd. | 半導体基板、その製造方法、半導体デバイス及びその製造方法 |
| US8860183B2 (en) * | 2009-06-10 | 2014-10-14 | Seoul Viosys Co., Ltd. | Semiconductor substrate, semiconductor device, and manufacturing methods thereof |
| EP2472604B1 (en) * | 2009-08-26 | 2020-09-09 | Seoul Viosys Co., Ltd | Method for manufacturing a light-emitting device |
| JP5570838B2 (ja) * | 2010-02-10 | 2014-08-13 | ソウル バイオシス カンパニー リミテッド | 半導体基板、その製造方法、半導体デバイス及びその製造方法 |
| KR101673955B1 (ko) * | 2010-07-02 | 2016-11-08 | 삼성전자주식회사 | 반도체 발광소자 및 이를 제조하는 방법 |
| CN101962804B (zh) * | 2010-10-30 | 2012-05-02 | 北京大学 | 基于外延材料应力控制的GaN厚膜自分离方法 |
| KR102192130B1 (ko) | 2012-03-21 | 2020-12-17 | 프라이베르게르 컴파운드 마터리얼스 게엠베하 | Iii-n 단결정 |
| DE102012204553B4 (de) * | 2012-03-21 | 2021-12-30 | Freiberger Compound Materials Gmbh | Verfahren zur Herstellung eines Templats, so hergestelltes Templat, dessen Verwendung, Verfahren zur Herstellung von III-N-Einkristallen, Verfahren zur Herstellung von III-N-Kristallwafern, deren Verwendung und Verwendung von Maskenmaterialien |
| JP2013209271A (ja) * | 2012-03-30 | 2013-10-10 | Mitsubishi Chemicals Corp | 周期表第13族金属窒化物半導体基板の製造方法、および、当該製造方法に用いられる下地基板 |
| KR101593213B1 (ko) * | 2012-05-10 | 2016-02-18 | 서울바이오시스 주식회사 | 반도체 기판 제조 방법 및 발광 소자 제조 방법 |
| KR102013770B1 (ko) * | 2012-08-30 | 2019-08-23 | 에스케이하이닉스 주식회사 | 반도체 소자 및 그 제조 방법 |
| US20140158976A1 (en) * | 2012-12-06 | 2014-06-12 | Sansaptak DASGUPTA | Iii-n semiconductor-on-silicon structures and techniques |
| JP6346457B2 (ja) * | 2013-03-08 | 2018-06-20 | 国立大学法人山口大学 | 窒化ガリウム結晶自立基板の製造方法 |
| JP2014237570A (ja) * | 2013-06-10 | 2014-12-18 | 日本電信電話株式会社 | 窒化物半導体基板の製造方法 |
| CN104638068B (zh) * | 2013-11-07 | 2018-08-24 | 上海蓝光科技有限公司 | 一种用于ⅲ-ⅴ族氮化物生长的衬底结构及其制备方法 |
| US9490119B2 (en) | 2014-05-21 | 2016-11-08 | Palo Alto Research Center Incorporated | Fabrication of thin-film devices using selective area epitaxy |
| US10364510B2 (en) * | 2015-11-25 | 2019-07-30 | Sciocs Company Limited | Substrate for crystal growth having a plurality of group III nitride seed crystals arranged in a disc shape |
| CN110301033B (zh) * | 2017-02-16 | 2023-06-09 | 信越化学工业株式会社 | 化合物半导体层叠基板及其制造方法以及半导体元件 |
| JP2019134101A (ja) | 2018-01-31 | 2019-08-08 | 京セラ株式会社 | 半導体素子の製造方法 |
| US12065760B2 (en) | 2018-12-26 | 2024-08-20 | Kyocera Corporation | Method of manufacturing semiconductor element, semiconductor element, and substrate |
| JP7298111B2 (ja) | 2019-06-07 | 2023-06-27 | 日亜化学工業株式会社 | 発光素子及びその製造方法 |
| JP7345286B2 (ja) * | 2019-06-11 | 2023-09-15 | 株式会社小糸製作所 | 半導体成長用基板、半導体素子、半導体発光素子および半導体素子製造方法 |
| US11476118B2 (en) * | 2020-02-25 | 2022-10-18 | Microsoft Technology Licensing, Llc | Method for manufacturing nanowires |
| JP2023171128A (ja) * | 2022-05-20 | 2023-12-01 | 京セラ株式会社 | 半導体基板、テンプレート基板、半導体基板の製造方法および製造装置、半導体デバイスの製造方法および製造装置、半導体デバイス |
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| US6346720B1 (en) * | 1995-02-03 | 2002-02-12 | Sumitomo Chemical Company, Limited | Layered group III-V compound semiconductor, method of manufacturing the same, and light emitting element |
| US6617235B2 (en) * | 1995-03-30 | 2003-09-09 | Sumitomo Chemical Company, Limited | Method of manufacturing Group III-V compound semiconductor |
| EP0874405A3 (en) * | 1997-03-25 | 2004-09-15 | Mitsubishi Cable Industries, Ltd. | GaN group crystal base member having low dislocation density, use thereof and manufacturing methods thereof |
| JP3289682B2 (ja) * | 1998-08-17 | 2002-06-10 | 株式会社村田製作所 | 半導体発光素子 |
| US6228538B1 (en) * | 1998-08-28 | 2001-05-08 | Micron Technology, Inc. | Mask forming methods and field emission display emitter mask forming methods |
| JP4337132B2 (ja) * | 1998-09-16 | 2009-09-30 | 日亜化学工業株式会社 | 窒化物半導体基板及びそれを用いた窒化物半導体素子 |
| JP3463736B2 (ja) * | 1998-09-25 | 2003-11-05 | 株式会社村田製作所 | 半導体発光素子、およびその発光強度の調整方法 |
| JP3668031B2 (ja) | 1999-01-29 | 2005-07-06 | 三洋電機株式会社 | 窒化物系半導体発光素子の製造方法 |
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| JP3662806B2 (ja) * | 2000-03-29 | 2005-06-22 | 日本電気株式会社 | 窒化物系半導体層の製造方法 |
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| JP4867064B2 (ja) * | 2000-11-17 | 2012-02-01 | 住友化学株式会社 | 発光素子用3−5族化合物半導体およびその製造方法 |
| JP4963763B2 (ja) * | 2000-12-21 | 2012-06-27 | 日本碍子株式会社 | 半導体素子 |
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| JP2003077847A (ja) * | 2001-09-06 | 2003-03-14 | Sumitomo Chem Co Ltd | 3−5族化合物半導体の製造方法 |
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| JP2004273661A (ja) * | 2003-03-07 | 2004-09-30 | Sumitomo Chem Co Ltd | 窒化ガリウム単結晶基板の製造方法 |
| JP2005101475A (ja) * | 2003-08-28 | 2005-04-14 | Hitachi Cable Ltd | Iii−v族窒化物系半導体基板及びその製造方法 |
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| JP5023318B2 (ja) * | 2005-05-19 | 2012-09-12 | 国立大学法人三重大学 | 3−5族窒化物半導体積層基板、3−5族窒化物半導体自立基板の製造方法、及び半導体素子 |
| US20090278233A1 (en) * | 2007-07-26 | 2009-11-12 | Pinnington Thomas Henry | Bonded intermediate substrate and method of making same |
| TW201013752A (en) * | 2008-09-16 | 2010-04-01 | Univ Nat Central | Manufacturing method of single-crystalline substrate containing gallium nitride |
| US8507304B2 (en) * | 2009-07-17 | 2013-08-13 | Applied Materials, Inc. | Method of forming a group III-nitride crystalline film on a patterned substrate by hydride vapor phase epitaxy (HVPE) |
-
2005
- 2005-09-05 JP JP2005256022A patent/JP5023318B2/ja not_active Expired - Lifetime
-
2006
- 2006-05-02 US US11/920,563 patent/US8053811B2/en not_active Expired - Fee Related
- 2006-05-02 WO PCT/JP2006/309166 patent/WO2006123540A1/ja not_active Ceased
- 2006-05-02 KR KR1020077027108A patent/KR20080003913A/ko not_active Ceased
- 2006-05-02 DE DE112006001279T patent/DE112006001279T5/de not_active Withdrawn
- 2006-05-05 TW TW095116014A patent/TW200644299A/zh unknown
-
2007
- 2007-11-16 GB GB0722572A patent/GB2440484A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642117B (zh) * | 2014-02-05 | 2018-11-21 | 日商迪思科股份有限公司 | Lifting method |
Also Published As
| Publication number | Publication date |
|---|---|
| US8053811B2 (en) | 2011-11-08 |
| JP2006347863A (ja) | 2006-12-28 |
| JP5023318B2 (ja) | 2012-09-12 |
| GB2440484A (en) | 2008-01-30 |
| WO2006123540A1 (ja) | 2006-11-23 |
| KR20080003913A (ko) | 2008-01-08 |
| US20090085165A1 (en) | 2009-04-02 |
| GB0722572D0 (en) | 2007-12-27 |
| DE112006001279T5 (de) | 2009-02-26 |
| GB2440484A8 (en) | 2008-02-29 |
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