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TW200632062A - Solvent-free silicone adhesive composition - Google Patents

Solvent-free silicone adhesive composition

Info

Publication number
TW200632062A
TW200632062A TW094143184A TW94143184A TW200632062A TW 200632062 A TW200632062 A TW 200632062A TW 094143184 A TW094143184 A TW 094143184A TW 94143184 A TW94143184 A TW 94143184A TW 200632062 A TW200632062 A TW 200632062A
Authority
TW
Taiwan
Prior art keywords
adhesive composition
silicone adhesive
solvent
free silicone
molecule
Prior art date
Application number
TW094143184A
Other languages
Chinese (zh)
Other versions
TWI374173B (en
Inventor
Shunji Aoki
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200632062A publication Critical patent/TW200632062A/en
Application granted granted Critical
Publication of TWI374173B publication Critical patent/TWI374173B/zh

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

To provide a silicone adhesive composition which does not contain an organic solvent, can prevent the absorption of ultraviolet rays and the like, the contamination of electronic/electric parts, affections to human bodies, and irritation to the skins, with left/evaporated substances, has a controlled adhesive force, and can easily be repeeled without deforming or breaking an adherend. This solvent-free silicone adhesive composition comprises (A) a polydiorganosiloxane having at least two alkenyl group-containing organic groups in the molecule and having branches, (B) a polyorganohydrosiloxane having at least two SiH groups in the molecule, (C) a polyorganosiloxane comprising R13 SiO0.5 units and SiO2 units and having an R13 SiO0.5 unit/SiO2 unit molar ratio of 0.6 to 1.7 (R1 is a 1 to 10C monovalent hydrocarbon group), and (D) a platinum-based catalyst.
TW094143184A 2004-12-08 2005-12-07 Solvent-free silicone adhesive composition TW200632062A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004355880A JP4761020B2 (en) 2004-12-08 2004-12-08 Solvent-free silicone adhesive composition

Publications (2)

Publication Number Publication Date
TW200632062A true TW200632062A (en) 2006-09-16
TWI374173B TWI374173B (en) 2012-10-11

Family

ID=36663305

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143184A TW200632062A (en) 2004-12-08 2005-12-07 Solvent-free silicone adhesive composition

Country Status (2)

Country Link
JP (1) JP4761020B2 (en)
TW (1) TW200632062A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479003B (en) * 2007-03-05 2015-04-01 Shinetsu Chemical Co Solventless silicone release agent composition for film, and release film using same
CN113302255A (en) * 2018-12-13 2021-08-24 陶氏东丽株式会社 Silicone pressure-sensitive adhesive composition and use thereof

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI440682B (en) * 2007-03-30 2014-06-11 Shinetsu Chemical Co Solventless silicone pressure-sensitive adhesive composition
JP5060873B2 (en) * 2007-08-24 2012-10-31 東レ・ダウコーニング株式会社 Silicone pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet
JP5292835B2 (en) * 2008-02-01 2013-09-18 大日本印刷株式会社 Sign film
JP5234064B2 (en) 2010-08-23 2013-07-10 信越化学工業株式会社 Solvent-free addition-type silicone adhesive composition and adhesive article
KR101267776B1 (en) * 2010-11-10 2013-05-24 (주)엘지하우시스 Silicon pressure-sensitive adhesive composition for window film with excellent rework porperties and compatibility and window film using the silicon pressure-sensitive adhesive
JP2014205762A (en) * 2013-04-12 2014-10-30 信越化学工業株式会社 Solventless silicone adhesive composition and adhesive article
JP6024638B2 (en) * 2013-10-10 2016-11-16 信越化学工業株式会社 Silicone pressure-sensitive adhesive composition, method for producing adhesion improver, and pressure-sensitive adhesive article
WO2017065131A1 (en) * 2015-10-14 2017-04-20 信越化学工業株式会社 Shock-absorbing screen protection film
JP6657037B2 (en) * 2015-12-22 2020-03-04 信越化学工業株式会社 Addition-curable silicone resin composition and semiconductor device
EP3184589B1 (en) 2015-12-22 2019-05-01 Shin-Etsu Chemical Co., Ltd. Addition-curable silicone resin composition and a semiconductor device
US11059971B2 (en) * 2017-09-29 2021-07-13 Dow Silicones Corporation Thermally conductive composition
GB2574440A (en) * 2018-06-06 2019-12-11 Advanced Insulation Ltd Tie coat
US20210246337A1 (en) * 2018-06-29 2021-08-12 Dow Silicones Corporation Solventless silicone pressure sensitive adhesive and methods for making and using same
US12129407B2 (en) 2018-12-13 2024-10-29 Dow Silicones Corporation Silicone adhesive composition and use thereof
EP4268980A4 (en) 2020-12-25 2024-11-20 Dow Toray Co., Ltd. ADHESIVE COMPOSITION BASED ON SILICONES AND ITS USE
CN119684965B (en) * 2024-12-13 2025-11-11 江苏皇冠新材料科技有限公司 Silicone pressure-sensitive adhesive composition, pressure-sensitive adhesive and product thereof for paper-based coating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082706A (en) * 1988-11-23 1992-01-21 Dow Corning Corporation Pressure sensitive adhesive/release liner laminate
US5292586A (en) * 1991-03-26 1994-03-08 General Electric Company Solventless or high solids-containing silicone pressure sensitive adhesive compositions
JP2734809B2 (en) * 1991-05-09 1998-04-02 信越化学工業株式会社 Silicone adhesive composition
US5357007A (en) * 1993-03-12 1994-10-18 General Electric Company Method for making a solventless silicone pressure sensitive adhesive composition and product
JP2002285129A (en) * 2001-03-23 2002-10-03 Shin Etsu Chem Co Ltd Silicone pressure sensitive adhesive composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479003B (en) * 2007-03-05 2015-04-01 Shinetsu Chemical Co Solventless silicone release agent composition for film, and release film using same
CN113302255A (en) * 2018-12-13 2021-08-24 陶氏东丽株式会社 Silicone pressure-sensitive adhesive composition and use thereof

Also Published As

Publication number Publication date
TWI374173B (en) 2012-10-11
JP2006160923A (en) 2006-06-22
JP4761020B2 (en) 2011-08-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees