[go: up one dir, main page]

TW200637901A - Flame-retardant curing agent containing phosphorus and its manufacturing method - Google Patents

Flame-retardant curing agent containing phosphorus and its manufacturing method

Info

Publication number
TW200637901A
TW200637901A TW094112640A TW94112640A TW200637901A TW 200637901 A TW200637901 A TW 200637901A TW 094112640 A TW094112640 A TW 094112640A TW 94112640 A TW94112640 A TW 94112640A TW 200637901 A TW200637901 A TW 200637901A
Authority
TW
Taiwan
Prior art keywords
flame
curing agent
manufacturing
agent containing
containing phosphorus
Prior art date
Application number
TW094112640A
Other languages
Chinese (zh)
Other versions
TWI310401B (en
Inventor
Ching-Hsuan Lin
Original Assignee
Univ Nat Chunghsing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Chunghsing filed Critical Univ Nat Chunghsing
Priority to TW094112640A priority Critical patent/TW200637901A/en
Publication of TW200637901A publication Critical patent/TW200637901A/en
Application granted granted Critical
Publication of TWI310401B publication Critical patent/TWI310401B/zh

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

This invention provides a flame-retardant curing agent containing phosphorus and its manufacturing method. The curing agent of the invention has higher glass transition temperature and flame-retardant after curing with epoxy resin. Therefore, it is suitable for integrated circuit boards and semiconductor packaging materials.
TW094112640A 2005-04-20 2005-04-20 Flame-retardant curing agent containing phosphorus and its manufacturing method TW200637901A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094112640A TW200637901A (en) 2005-04-20 2005-04-20 Flame-retardant curing agent containing phosphorus and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094112640A TW200637901A (en) 2005-04-20 2005-04-20 Flame-retardant curing agent containing phosphorus and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200637901A true TW200637901A (en) 2006-11-01
TWI310401B TWI310401B (en) 2009-06-01

Family

ID=45072233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094112640A TW200637901A (en) 2005-04-20 2005-04-20 Flame-retardant curing agent containing phosphorus and its manufacturing method

Country Status (1)

Country Link
TW (1) TW200637901A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8222441B2 (en) 2008-04-11 2012-07-17 Chang Chun Plastics Co., Ltd. Phosphorus-containing compounds and their preparing process and use
TWI408144B (en) * 2010-12-30 2013-09-11 Univ Nat Chunghsing Flame retardant polyester copolymer
TWI413644B (en) * 2008-01-15 2013-11-01 Nat Univ Chung Hsing Manufacture of phosphorus-containing diamines and their derivatives
TWI417298B (en) * 2009-09-09 2013-12-01 Nat Univ Chung Hsing Multifunctional phosphorus-containing compounds as flame-retardancy curing agent and their preparing process and use
TWI449707B (en) * 2008-07-15 2014-08-21 Univ Nat Chunghsing Preparation of novel phosphorus-containing biphenols and their derivatives
TWI465457B (en) * 2009-06-30 2014-12-21 Nat Univ Chung Hsing Amino-containing multifunctional epoxy curing agents and their derivatives, preparation and use
TWI469990B (en) * 2009-05-21 2015-01-21 Nat Univ Chung Hsing Asymmetric phosohorus-containing diamines, their polyimides, and method of manufacturing the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413644B (en) * 2008-01-15 2013-11-01 Nat Univ Chung Hsing Manufacture of phosphorus-containing diamines and their derivatives
US8222441B2 (en) 2008-04-11 2012-07-17 Chang Chun Plastics Co., Ltd. Phosphorus-containing compounds and their preparing process and use
TWI397533B (en) * 2008-04-11 2013-06-01 Chang Chun Plastics Co Ltd Novel phosphorus-containing compounds and their preparing process and use
TWI449707B (en) * 2008-07-15 2014-08-21 Univ Nat Chunghsing Preparation of novel phosphorus-containing biphenols and their derivatives
TWI469990B (en) * 2009-05-21 2015-01-21 Nat Univ Chung Hsing Asymmetric phosohorus-containing diamines, their polyimides, and method of manufacturing the same
TWI465457B (en) * 2009-06-30 2014-12-21 Nat Univ Chung Hsing Amino-containing multifunctional epoxy curing agents and their derivatives, preparation and use
TWI417298B (en) * 2009-09-09 2013-12-01 Nat Univ Chung Hsing Multifunctional phosphorus-containing compounds as flame-retardancy curing agent and their preparing process and use
TWI408144B (en) * 2010-12-30 2013-09-11 Univ Nat Chunghsing Flame retardant polyester copolymer

Also Published As

Publication number Publication date
TWI310401B (en) 2009-06-01

Similar Documents

Publication Publication Date Title
TW200721421A (en) Semiconductor structure and method of assembly
TW200614276A (en) Dielectric composition for forming dielectric layer for use in circuitized substrates
MY148465A (en) Silicone resin composition for encapsulating luminescent element and process for producing optical- semiconductor electronic part with the same through potting
TW200641169A (en) Method for the production of a radiation-emitting optical component and radiation-emitting optical component
WO2008132972A1 (en) Resin composition for electronic tag sealing, resin-sealed electronic tag and method for producing the same
MY147460A (en) Optical devices and silicone compositions and process fabricating the optical devices
TW200746373A (en) Electronic package and method of preparing same
TW200703481A (en) Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same
EP2343327A4 (en) CURABLE RESIN COMPOSITION AND ITS CURED PRODUCT, CIRCUIT BOARD, AND EPOXY RESIN AND METHOD FOR MANUFACTURING THE SAME
DE602007005610D1 (en) METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MADE THEREFOR
TW200610106A (en) Epoxy resin molding material for sealing and electronic component
WO2011140402A3 (en) Potting for electronic components
PH12012500386A1 (en) Adhesive film, multilayer circuit board, electronic component, and semiconductor device
TWI339882B (en) Semiconductor package having embedded passive elements and method for manufacturing the same
TW200614900A (en) A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same
TW200631145A (en) A heat sink, an electronic component package, and a method of manufacturing a heat sink
WO2011098187A3 (en) Semiconductor component and corresponding production method
MY150435A (en) Composition for forming silicon-containing fine pattern and method for forming fine pattern using the same
ATE546033T1 (en) ELECTRONIC UNIT AND METHOD FOR THE PRODUCTION THEREOF
TW200631095A (en) A method of manufacturing a semiconductor device
TWI319907B (en) Heat sink, integrated circuit package and the method of fabricating thereof
ATE503251T1 (en) METHOD FOR PROVIDING OPTIMUM LOCATION PROGRAMMING OF ELECTRONIC FUSTED CONNECTIONS
TW200727372A (en) Method for the production of enclosed electronic components, and enclosed electronic component
TW200637901A (en) Flame-retardant curing agent containing phosphorus and its manufacturing method
EP1979757B8 (en) An integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees