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TW200636388A - Photosensitive resin composition for forming lens - Google Patents

Photosensitive resin composition for forming lens

Info

Publication number
TW200636388A
TW200636388A TW095105814A TW95105814A TW200636388A TW 200636388 A TW200636388 A TW 200636388A TW 095105814 A TW095105814 A TW 095105814A TW 95105814 A TW95105814 A TW 95105814A TW 200636388 A TW200636388 A TW 200636388A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
forming lens
resin component
alkali
Prior art date
Application number
TW095105814A
Other languages
Chinese (zh)
Other versions
TWI315448B (en
Inventor
Yasuaki Sugimoto
Satoshi Niikura
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200636388A publication Critical patent/TW200636388A/en
Application granted granted Critical
Publication of TWI315448B publication Critical patent/TWI315448B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Abstract: A photosensitive resin composition for forming lens having excellent heat resistance is provided. The photosensitive resin composition contains (A) an alkali-soluble resin component and (B) a photosensitizer, in which (A) the alkali-soluble resin component contains a resin component having a structure unit (a1) expressed by the following general formula (a1): , in the general formula (a1), R0 represents a hydrogen atom or a methyl group, R1 represents a single bond or an alkylene group having 1 to 5 carbon atoms, R2 represents an alkyl group having 1 to 5 carbon atoms, "a" represents an integer of 1 to 5, "b" represents 0 or an integer of 1 to 4, and "a+b" is not higher than 5. It should be noted that in the case in which two or more of R2 exist, each of which may differ from each other and may be the same.
TW095105814A 2005-03-11 2006-02-21 Photosensitive resin composition for forming lens TWI315448B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005068909A JP2006251464A (en) 2005-03-11 2005-03-11 Photosensitive resin composition for lens formation

Publications (2)

Publication Number Publication Date
TW200636388A true TW200636388A (en) 2006-10-16
TWI315448B TWI315448B (en) 2009-10-01

Family

ID=37092019

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105814A TWI315448B (en) 2005-03-11 2006-02-21 Photosensitive resin composition for forming lens

Country Status (3)

Country Link
JP (1) JP2006251464A (en)
KR (1) KR100740823B1 (en)
TW (1) TWI315448B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825195B (en) * 2018-12-25 2023-12-11 日商東京應化工業股份有限公司 Resin composition and method for manufacturing substrate with microlens pattern

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090005976A (en) 2007-07-09 2009-01-14 도쿄 오카 고교 가부시키가이샤 Photosensitive resin composition and microlens using same
CN104718229B (en) 2012-10-23 2017-05-31 日产化学工业株式会社 Non-photosensitive resin composition
WO2017110393A1 (en) 2015-12-21 2017-06-29 日産化学工業株式会社 Resin composition
JP6963215B2 (en) 2016-07-28 2021-11-05 日産化学株式会社 Resin composition
WO2020130441A1 (en) * 2018-12-21 2020-06-25 주식회사 엘지화학 Photosensitive resin composition, photosensitive material, color filter, and display device
KR102683968B1 (en) 2019-11-06 2024-07-12 닛산 가가쿠 가부시키가이샤 Non-photosensitive resin composition

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3092158B2 (en) * 1989-12-01 2000-09-25 東ソー株式会社 Positive photosensitive material for lens formation
DE4002397A1 (en) * 1990-01-27 1991-08-01 Hoechst Ag Positive photosensitive mixt. contg. hydroxy-aralkyl acrylate polymer - and sensitiser, useful in printing plate mfr. and as photoresist
DE4006856A1 (en) * 1990-03-05 1991-09-12 Hoechst Ag HAZARDOUS POSITIVE WORKING LIGHT-SENSITIVE RECORDING MATERIAL AND METHOD FOR PRODUCING A COLOR TEST PICTURE USING THIS MATERIAL
JP3003808B2 (en) * 1991-03-14 2000-01-31 東京応化工業株式会社 Micro lens and manufacturing method thereof
JP3082179B2 (en) * 1992-07-03 2000-08-28 ジェイエスアール株式会社 Photosensitive resin composition for lenses
JP3114166B2 (en) * 1992-10-22 2000-12-04 ジェイエスアール株式会社 Radiation-sensitive resin composition for microlenses
JPH07168359A (en) * 1993-12-15 1995-07-04 Tosoh Corp Photosensitive material for microlenses
DE4414896A1 (en) * 1994-04-28 1995-11-02 Hoechst Ag Positive working radiation sensitive mixture
JP3783512B2 (en) * 2000-02-29 2006-06-07 Ｊｓｒ株式会社 Radiation-sensitive resin composition and interlayer insulating film formed therefrom
JP4312598B2 (en) * 2001-07-26 2009-08-12 チバ ホールディング インコーポレーテッド Photosensitive resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825195B (en) * 2018-12-25 2023-12-11 日商東京應化工業股份有限公司 Resin composition and method for manufacturing substrate with microlens pattern

Also Published As

Publication number Publication date
TWI315448B (en) 2009-10-01
JP2006251464A (en) 2006-09-21
KR20060097616A (en) 2006-09-14
KR100740823B1 (en) 2007-07-19

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