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TW200629511A - Nanotube-based connection arrangement and approach - Google Patents

Nanotube-based connection arrangement and approach

Info

Publication number
TW200629511A
TW200629511A TW094138309A TW94138309A TW200629511A TW 200629511 A TW200629511 A TW 200629511A TW 094138309 A TW094138309 A TW 094138309A TW 94138309 A TW94138309 A TW 94138309A TW 200629511 A TW200629511 A TW 200629511A
Authority
TW
Taiwan
Prior art keywords
integrated circuit
approach
carbon nanotubes
nanotube
connection arrangement
Prior art date
Application number
TW094138309A
Other languages
Chinese (zh)
Inventor
Chris Wyland
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200629511A publication Critical patent/TW200629511A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
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    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/732—Location after the connecting process
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

Conductive connections are made between components of an integrated circuit package. According to an example embodiment of the present invention, carbon nanotubes (232, 332, 333) extend from a surface of a first integrated circuit package component (120, 220, 320, 410,510) and distal ends of the carbon nanotubes are embedded in a connector (234, 334, 335, 422, 522) at a second integrated circuit package component (110, 210, 310, 420, 520). The embedding approach involves, e.g., physical coupling (i.e., pressing) of the carbon nanotubes and the connector together. This approach is applicable to coupling a variety of components together, such as integrated circuit dies (flip chip (120) and conventional (420)) to package substrates (110, 410, 510) and/or leadframes (410, 510).
TW094138309A 2004-11-04 2005-11-01 Nanotube-based connection arrangement and approach TW200629511A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62541304P 2004-11-04 2004-11-04

Publications (1)

Publication Number Publication Date
TW200629511A true TW200629511A (en) 2006-08-16

Family

ID=35892640

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138309A TW200629511A (en) 2004-11-04 2005-11-01 Nanotube-based connection arrangement and approach

Country Status (2)

Country Link
TW (1) TW200629511A (en)
WO (1) WO2006048846A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101639368A (en) * 2008-07-18 2010-02-03 泰勒斯公司 Electromechanical device and manufacturing method
US10840203B2 (en) 2016-05-06 2020-11-17 Smoltek Ab Assembly platform

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463615B (en) * 2004-11-04 2014-12-01 台灣積體電路製造股份有限公司 Directional conductive adhesion based on nanotubes
SG149711A1 (en) * 2007-07-12 2009-02-27 Agency Science Tech & Res A method for electrical interconnection and an interconnection structure
US8647922B2 (en) 2007-11-08 2014-02-11 Nanyang Technological University Method of forming an interconnect on a semiconductor substrate
DE102009059304B4 (en) 2009-12-23 2014-07-03 CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH Silicon chip with a cable attached to it and procedures for attaching the cable
US20150333024A1 (en) * 2013-01-09 2015-11-19 Hitachi Ltd Semiconductor device and method for manufacturing the same
DE102018106959A1 (en) * 2018-03-23 2019-09-26 Osram Opto Semiconductors Gmbh OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297063B1 (en) * 1999-10-25 2001-10-02 Agere Systems Guardian Corp. In-situ nano-interconnected circuit devices and method for making the same
DE10127351A1 (en) * 2001-06-06 2002-12-19 Infineon Technologies Ag Electronic chip comprises several external contacts of which at least two are provided with a plurality of nano-tubes for purposes of contacting an external contact of another electronic chip
DE10144704B4 (en) * 2001-09-11 2007-10-04 Infineon Technologies Ag Method for connecting a component to a carrier
JP3948377B2 (en) * 2002-09-12 2007-07-25 株式会社豊田中央研究所 Pressure contact type semiconductor device
TW582104B (en) * 2002-11-08 2004-04-01 Ind Tech Res Inst Self-assembled nanometer conductive bump and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101639368A (en) * 2008-07-18 2010-02-03 泰勒斯公司 Electromechanical device and manufacturing method
US10840203B2 (en) 2016-05-06 2020-11-17 Smoltek Ab Assembly platform
US11348890B2 (en) 2016-05-06 2022-05-31 Smoltek Ab Assembly platform

Also Published As

Publication number Publication date
WO2006048846A3 (en) 2006-09-21
WO2006048846A2 (en) 2006-05-11

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