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TW200628989A - Pattern-forming material and pattern-forming method - Google Patents

Pattern-forming material and pattern-forming method

Info

Publication number
TW200628989A
TW200628989A TW094141994A TW94141994A TW200628989A TW 200628989 A TW200628989 A TW 200628989A TW 094141994 A TW094141994 A TW 094141994A TW 94141994 A TW94141994 A TW 94141994A TW 200628989 A TW200628989 A TW 200628989A
Authority
TW
Taiwan
Prior art keywords
pattern
light
forming material
forming
diffusion
Prior art date
Application number
TW094141994A
Other languages
Chinese (zh)
Inventor
Shinichiro Serizawa
Yoshiharu Sasaki
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200628989A publication Critical patent/TW200628989A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G03F7/0295—Photolytic halogen compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

The purpose of the present invention is to provide a pattern-forming material which has improved optical property, and provide a pattern-forming device and a pattern-forming method which may inhibit the distortion of the image formed on the pattern-forming material and efficiently form a defect-free permanent pattern such as wiring pattern and the like with high precision. In other words, the present invention provides a pattern-forming material which has a photosensitive layer on a support having a synthetic resin-made film containing fine particles. The total light transmittance thereof being 80% or more when a light of 405 nm wavelength is irradiated, the angle as diffusion angle between the optical axis of the above irradiated light and the diffusion light is within 2 degrees, and the diffusion light energy relative to the irradiated light energy is within 1% when the above diffusion angle is 1.5 degrees.
TW094141994A 2004-12-01 2005-11-30 Pattern-forming material and pattern-forming method TW200628989A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004348428A JP2006154622A (en) 2004-12-01 2004-12-01 Pattern forming material and pattern forming method

Publications (1)

Publication Number Publication Date
TW200628989A true TW200628989A (en) 2006-08-16

Family

ID=36564968

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141994A TW200628989A (en) 2004-12-01 2005-11-30 Pattern-forming material and pattern-forming method

Country Status (3)

Country Link
JP (1) JP2006154622A (en)
TW (1) TW200628989A (en)
WO (1) WO2006059534A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110284139A (en) * 2018-03-19 2019-09-27 三星显示有限公司 Etchant composition and method for manufacturing metal pattern and array substrate using same

Families Citing this family (12)

* Cited by examiner, † Cited by third party
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JP4993458B2 (en) * 2006-12-04 2012-08-08 旭化成イーマテリアルズ株式会社 Photosensitive resin composition and use thereof
CN102707571A (en) 2006-12-19 2012-10-03 日立化成工业株式会社 Photosensitive element
KR101102186B1 (en) 2007-01-31 2012-01-02 히다치 가세고교 가부시끼가이샤 Photosensitive element
KR101734425B1 (en) * 2013-09-24 2017-05-11 주식회사 엘지화학 Preparation method for dry film solder resist and film laminate used therein
KR20240100483A (en) 2014-04-25 2024-07-01 가부시끼가이샤 레조낙 Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package
JP6227617B2 (en) * 2014-06-30 2017-11-08 太陽インキ製造株式会社 Photosensitive dry film and method for producing printed wiring board using the same
JP5882510B2 (en) * 2014-06-30 2016-03-09 太陽インキ製造株式会社 Photosensitive dry film and method for producing printed wiring board using the same
JP2016086000A (en) * 2014-10-22 2016-05-19 太陽インキ製造株式会社 Dry film and printed wiring board
JP6332577B1 (en) * 2017-03-31 2018-05-30 日立化成株式会社 Photosensitive element
JP6299940B1 (en) * 2017-03-31 2018-03-28 日立化成株式会社 Photosensitive element and photosensitive element roll
JP7040137B2 (en) * 2018-03-06 2022-03-23 東レ株式会社 Biaxially oriented polyester film for dry film resist supports
JPWO2022045256A1 (en) * 2020-08-26 2022-03-03

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JPS62139547A (en) * 1985-12-13 1987-06-23 Daicel Chem Ind Ltd Photosensitive laminate body having anti electrostatic property
JP2697176B2 (en) * 1989-08-28 1998-01-14 ダイアホイルヘキスト株式会社 Biaxially oriented polyester film for dry film
JPH06130657A (en) * 1991-08-20 1994-05-13 Mitsubishi Rayon Co Ltd Dry film resist
JP3789144B2 (en) * 1994-06-14 2006-06-21 三菱化学ポリエステルフィルム株式会社 Laminated polyester film for photoresist
JPH1039504A (en) * 1996-07-24 1998-02-13 Nitto Chem Ind Co Ltd Dry film resist
JP3820101B2 (en) * 2000-12-14 2006-09-13 帝人株式会社 Biaxially oriented laminated polyester film
JP2004106322A (en) * 2002-09-18 2004-04-08 Toray Ind Inc Laminated polyester film for dry-film photoresist
JP4096682B2 (en) * 2002-10-04 2008-06-04 三菱化学株式会社 Blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same
JP4305732B2 (en) * 2003-04-17 2009-07-29 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board
JP2004325596A (en) * 2003-04-22 2004-11-18 Fuji Photo Film Co Ltd Dry film photoresist
JP2004335639A (en) * 2003-05-06 2004-11-25 Fuji Photo Film Co Ltd Projection aligner
JP4244156B2 (en) * 2003-05-07 2009-03-25 富士フイルム株式会社 Projection exposure equipment
JP4159094B2 (en) * 2003-10-15 2008-10-01 東京応化工業株式会社 Photosensitive resin composition and photosensitive dry film using the same
JP2005227398A (en) * 2004-02-10 2005-08-25 Fuji Photo Film Co Ltd Photosensitive transfer sheet
JP4515123B2 (en) * 2004-03-18 2010-07-28 旭化成イーマテリアルズ株式会社 Photosensitive resin laminate and use thereof
JP4485239B2 (en) * 2004-04-01 2010-06-16 富士フイルム株式会社 Pattern formation method
JP2005292734A (en) * 2004-04-05 2005-10-20 Fuji Photo Film Co Ltd Photosensitive transfer sheet and laminate, image pattern forming method, and wiring pattern forming method
JP4493385B2 (en) * 2004-04-15 2010-06-30 旭化成イーマテリアルズ株式会社 Photosensitive resin composition and use thereof
JP2005331695A (en) * 2004-05-19 2005-12-02 Fuji Photo Film Co Ltd Photosensitive transfer sheet, photosensitive laminate, image pattern forming method, and wiring pattern forming method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110284139A (en) * 2018-03-19 2019-09-27 三星显示有限公司 Etchant composition and method for manufacturing metal pattern and array substrate using same
CN110284139B (en) * 2018-03-19 2022-05-27 三星显示有限公司 Etchant composition and method of manufacturing metal pattern and array substrate using the same

Also Published As

Publication number Publication date
WO2006059534A1 (en) 2006-06-08
JP2006154622A (en) 2006-06-15

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