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TW200626869A - Apparatus for testing a surface and method of testing a surface - Google Patents

Apparatus for testing a surface and method of testing a surface

Info

Publication number
TW200626869A
TW200626869A TW094142078A TW94142078A TW200626869A TW 200626869 A TW200626869 A TW 200626869A TW 094142078 A TW094142078 A TW 094142078A TW 94142078 A TW94142078 A TW 94142078A TW 200626869 A TW200626869 A TW 200626869A
Authority
TW
Taiwan
Prior art keywords
imaging
plate
testing
optical system
outer peripheral
Prior art date
Application number
TW094142078A
Other languages
Chinese (zh)
Other versions
TWI388798B (en
Inventor
Yoshinori Hayashi
Hiroyuki Naraidate
Makoto Kyoya
Koji Izunome
Hiromi Nagahama
Miyuki Shimizu
Kazuhiko Hamatani
Original Assignee
Shibaura Mechatronics Corp
Toshiba Ceramics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp, Toshiba Ceramics Co filed Critical Shibaura Mechatronics Corp
Publication of TW200626869A publication Critical patent/TW200626869A/en
Application granted granted Critical
Publication of TWI388798B publication Critical patent/TWI388798B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9506—Optical discs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8841—Illumination and detection on two sides of object

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A surface inspection device for inspecting surfaces (101a, 101b, 101c) formed on a outer peripheral edge of a plate-like object (100), the surface inspection device having an imaging device (30) for imaging the outer peripheral edge of the plate-like object, on which edge the surfaces of the plate-like object are formed, and having an image processing device for processing an image obtained by the imaging device, wherein the imaging device has an optical system (11, 12, 13) for guiding images of the surfaces of the plate-like object in the same direction and has a single camera unit (20) having an imaging surface (20d) and provided so that the images of the surfaces guided in the same direction by the optical system are focused on the imaging surface.
TW094142078A 2004-11-30 2005-11-30 Apparatus for testing a surface and method of testing a surface TWI388798B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004345141 2004-11-30

Publications (2)

Publication Number Publication Date
TW200626869A true TW200626869A (en) 2006-08-01
TWI388798B TWI388798B (en) 2013-03-11

Family

ID=36565080

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142078A TWI388798B (en) 2004-11-30 2005-11-30 Apparatus for testing a surface and method of testing a surface

Country Status (6)

Country Link
US (1) US7403278B2 (en)
JP (1) JP4990630B2 (en)
KR (1) KR100904007B1 (en)
CN (1) CN101069088B (en)
TW (1) TWI388798B (en)
WO (1) WO2006059647A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464390B (en) * 2008-02-06 2014-12-11 尼康股份有限公司 Surface inspection device and surface inspection method

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US7622666B2 (en) 2005-06-16 2009-11-24 Soliant Energy Inc. Photovoltaic concentrator modules and systems having a heat dissipating element located within a volume in which light rays converge from an optical concentrating element towards a photovoltaic receiver
US20070089777A1 (en) * 2005-10-04 2007-04-26 Johnson Richard L Jr Heatsink for concentrating or focusing optical/electrical energy conversion systems
US20070102037A1 (en) * 2005-10-04 2007-05-10 Irwin Philip C Self-powered systems and methods using auxiliary solar cells
EP1994336A2 (en) * 2006-01-17 2008-11-26 Soliant Energy, Inc. A hybrid primary optical component for optical concentrators
AU2007207582A1 (en) * 2006-01-17 2007-07-26 Soliant Energy, Inc. Concentrating solar panel and related systems and methods
CN101021489A (en) * 2006-02-15 2007-08-22 奥林巴斯株式会社 Visual inspection apparatus
US20080135096A1 (en) * 2006-09-30 2008-06-12 Johnson Richard L Optical concentrators having one or more line foci and related methods
WO2008112180A2 (en) * 2007-03-11 2008-09-18 Soliant Energy, Inc. Heat transfer and wiring considerations for a photo voltaic receiver for solar concentrator applications
DE102007024525B4 (en) * 2007-03-19 2009-05-28 Vistec Semiconductor Systems Gmbh Apparatus and method for evaluating defects at the edge area of a wafer
JP5060808B2 (en) * 2007-03-27 2012-10-31 オリンパス株式会社 Appearance inspection device
DE112008000723A5 (en) * 2007-03-30 2012-06-14 Shibaura Mechatronics Corp. Apparatus and method for testing the edge of a semiconductor wafer
JP5191484B2 (en) * 2007-04-27 2013-05-08 芝浦メカトロニクス株式会社 Surface inspection device
US20090000612A1 (en) * 2007-05-04 2009-01-01 Hines Braden E Apparatuses and methods for shaping reflective surfaces of optical concentrators
WO2009013887A1 (en) * 2007-07-25 2009-01-29 Nikon Corporation End section inspecting apparatus
US8488867B2 (en) * 2007-10-23 2013-07-16 Shibaura Mechatronics Corporation Inspection device for disk-shaped substrate
JP5183147B2 (en) * 2007-10-23 2013-04-17 芝浦メカトロニクス株式会社 Disc-shaped substrate inspection equipment
JP5183146B2 (en) * 2007-10-23 2013-04-17 芝浦メカトロニクス株式会社 Disc-shaped substrate inspection equipment
JP5372359B2 (en) * 2007-11-07 2013-12-18 芝浦メカトロニクス株式会社 Edge inspection device for plate substrate
JP5100371B2 (en) * 2007-12-28 2012-12-19 株式会社山梨技術工房 Foreign matter inspection method and foreign matter inspection apparatus for wafer peripheral edge
AU2009246864A1 (en) * 2008-05-16 2009-11-19 Emcore Corporation Solar systems that include one or more shade-tolerant wiring schemes
JP5144401B2 (en) * 2008-07-01 2013-02-13 直江津電子工業株式会社 Wafer inspection equipment
US20110199480A1 (en) * 2009-07-09 2011-08-18 Camtek Ltd. Optical inspection system using multi-facet imaging
KR101228459B1 (en) * 2010-09-09 2013-01-31 한미반도체 주식회사 Wafer inspection device and wafer inspection system having the same
JP2013190309A (en) * 2012-03-13 2013-09-26 Toshiba Corp Defect inspection device
JP5490855B2 (en) * 2012-07-12 2014-05-14 芝浦メカトロニクス株式会社 Edge inspection device for plate substrate
KR20160040044A (en) * 2014-10-02 2016-04-12 삼성전자주식회사 Apparatus and method for inspecting panel
JP7132042B2 (en) * 2018-09-10 2022-09-06 株式会社ディスコ processing equipment
JP6827086B2 (en) * 2019-09-25 2021-02-10 東京エレクトロン株式会社 Substrate imaging device
JP6788089B2 (en) * 2019-10-23 2020-11-18 東京エレクトロン株式会社 Substrate processing method, substrate processing equipment and computer-readable recording medium
JP7571532B2 (en) * 2020-12-23 2024-10-23 ニデックパワートレインシステムズ株式会社 Inspection Equipment
KR102734714B1 (en) * 2021-12-08 2024-11-27 주식회사 앤비젼 Multi-way imaging optical device

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US6294793B1 (en) * 1992-12-03 2001-09-25 Brown & Sharpe Surface Inspection Systems, Inc. High speed optical inspection apparatus for a transparent disk using gaussian distribution analysis and method therefor
US6262432B1 (en) * 1992-12-03 2001-07-17 Brown & Sharpe Surface Inspection Systems, Inc. High speed surface inspection optical apparatus for a reflective disk using gaussian distribution analysis and method therefor
EP0657732A1 (en) * 1993-12-06 1995-06-14 Elpatronic Ag Method and device for the optical inspection of a transparent part of a container, especially the mouth
JP2999925B2 (en) * 1994-07-18 2000-01-17 三洋電機株式会社 Object side imaging device
CH688663A5 (en) * 1994-10-20 1997-12-31 Elpatronic Ag Method and apparatus for inspecting objects, particularly bottles.
JPH11201906A (en) * 1998-01-12 1999-07-30 N Tec:Kk Object appearance inspection device
EP0935134B1 (en) * 1998-02-05 2000-09-27 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Apparatus and method for inspecting the edge micro-texture of a semiconductor wafer
KR100537684B1 (en) * 2001-09-19 2005-12-20 올림푸스 가부시키가이샤 Semiconductor wafer inspection system
JP3709426B2 (en) * 2001-11-02 2005-10-26 日本エレクトロセンサリデバイス株式会社 Surface defect detection method and surface defect detection apparatus
JP3629244B2 (en) 2002-02-19 2005-03-16 本多エレクトロン株式会社 Wafer inspection equipment
JP3936220B2 (en) * 2002-03-28 2007-06-27 株式会社レイテックス Edge inspection equipment
US7280200B2 (en) * 2003-07-18 2007-10-09 Ade Corporation Detection of a wafer edge using collimated light
US7280197B1 (en) * 2004-07-27 2007-10-09 Kla-Tehcor Technologies Corporation Wafer edge inspection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464390B (en) * 2008-02-06 2014-12-11 尼康股份有限公司 Surface inspection device and surface inspection method

Also Published As

Publication number Publication date
KR20070064376A (en) 2007-06-20
CN101069088B (en) 2010-05-12
US7403278B2 (en) 2008-07-22
JPWO2006059647A1 (en) 2008-06-05
US20070222977A1 (en) 2007-09-27
WO2006059647A1 (en) 2006-06-08
KR100904007B1 (en) 2009-06-22
JP4990630B2 (en) 2012-08-01
CN101069088A (en) 2007-11-07
TWI388798B (en) 2013-03-11

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