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TW200626858A - Sintered heat pipe and method for manufacturing the same - Google Patents

Sintered heat pipe and method for manufacturing the same

Info

Publication number
TW200626858A
TW200626858A TW094101783A TW94101783A TW200626858A TW 200626858 A TW200626858 A TW 200626858A TW 094101783 A TW094101783 A TW 094101783A TW 94101783 A TW94101783 A TW 94101783A TW 200626858 A TW200626858 A TW 200626858A
Authority
TW
Taiwan
Prior art keywords
tube
powder
heat pipe
sintered heat
capillary structure
Prior art date
Application number
TW094101783A
Other languages
Chinese (zh)
Other versions
TWI260385B (en
Inventor
Jung-Yuan Wu
Chu-Wan Hong
Chang-Ting Lo
Ching-Tai Cheng
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW094101783A priority Critical patent/TWI260385B/en
Priority to US11/291,879 priority patent/US20060162907A1/en
Publication of TW200626858A publication Critical patent/TW200626858A/en
Application granted granted Critical
Publication of TWI260385B publication Critical patent/TWI260385B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A sintered heat pipe includes a tube and a capillary structure formed on the inner wall of the tube. The capillary structure formed by sintered powder includes at least three sections arranged in axis of the tube and being different in size of the powder. Method for manufacture of the sintered heat pipe includes the following steps: (1) providing the tube, and inserting a rigid mandril into the tube; (2) filling at least three types of powder into a space formed between an inner wall of the tube and the rigid mandril in turn for forming the at least three sections of the capillary structure, the size of the three types of powder increasing sequentially; (3) sintering the powder, and then drawing out the rigid mandril; (4) filling working liquid into the tube, and then vacuumizing and sealing the tube.
TW094101783A 2005-01-21 2005-01-21 Sintered heat pipe and method for manufacturing the same TWI260385B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094101783A TWI260385B (en) 2005-01-21 2005-01-21 Sintered heat pipe and method for manufacturing the same
US11/291,879 US20060162907A1 (en) 2005-01-21 2005-12-01 Heat pipe with sintered powder wick

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094101783A TWI260385B (en) 2005-01-21 2005-01-21 Sintered heat pipe and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW200626858A true TW200626858A (en) 2006-08-01
TWI260385B TWI260385B (en) 2006-08-21

Family

ID=36695489

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101783A TWI260385B (en) 2005-01-21 2005-01-21 Sintered heat pipe and method for manufacturing the same

Country Status (2)

Country Link
US (1) US20060162907A1 (en)
TW (1) TWI260385B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN107816908A (en) * 2017-11-29 2018-03-20 华南理工大学 A kind of gradient porosity fiber sintering formula heat pipe and its manufacture method

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US8453717B1 (en) 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
GB201009264D0 (en) * 2010-06-03 2010-07-21 Rolls Royce Plc Heat transfer arrangement for fluid washed surfaces
US20120031587A1 (en) * 2010-08-05 2012-02-09 Kunshan Jue-Choung Electronics Co., Ltd. Capillary structure of heat plate
TWI443944B (en) * 2011-02-18 2014-07-01 奇鋐科技股份有限公司 Thin hot plate structure
TW201309996A (en) * 2011-08-17 2013-03-01 Chaun Choung Technology Corp Method of manufacturing light-weight heat pipe and product of the same
CN102410764A (en) * 2011-10-28 2012-04-11 昆山德泰新材料科技有限公司 Heat conduction pipe and manufacturing method thereof
JP6033029B2 (en) * 2012-10-01 2016-11-30 株式会社フジクラ Wick manufacturing method
KR101422097B1 (en) * 2012-11-26 2014-07-28 잘만테크 주식회사 Evaporator for the looped heat pipe system and method for manufacturing thereof
US9752832B2 (en) * 2012-12-21 2017-09-05 Elwha Llc Heat pipe
US9404392B2 (en) * 2012-12-21 2016-08-02 Elwha Llc Heat engine system
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
US11769919B2 (en) * 2014-03-25 2023-09-26 Teledyne Scientific & Imaging, Llc Multi-functional high temperature structure for thermal management and prevention of explosion propagation
US11569537B2 (en) 2014-03-25 2023-01-31 Teledyne Scientific & Imaging, Llc Multi-functional structure for thermal management and prevention of failure propagation
US11482744B2 (en) 2014-03-25 2022-10-25 Teledyne Scientific & Imaging, Llc Multi-functional structure for thermal management and prevention of failure propagation
US20160010927A1 (en) * 2014-07-14 2016-01-14 Fujikura Ltd. Heat transport device
US10782014B2 (en) 2016-11-11 2020-09-22 Habib Technologies LLC Plasmonic energy conversion device for vapor generation
US11480394B2 (en) * 2018-07-18 2022-10-25 Aavid Thermal Corp. Heat pipes having wick structures with variable permeability
JP6801698B2 (en) * 2018-09-04 2020-12-16 セイコーエプソン株式会社 Cooling device and projector
WO2020252555A1 (en) * 2019-06-17 2020-12-24 Huawei Technologies Co., Ltd Heat transfer device and method for manufacturing such a heat transfer device
JPWO2022102163A1 (en) * 2020-11-16 2022-05-19
CN114636337A (en) * 2020-12-15 2022-06-17 全亿大科技（佛山）有限公司 Heat pipe, and manufacturing method and device of heat pipe
JP7550682B2 (en) * 2021-03-05 2024-09-13 三菱重工業株式会社 Heat pipe
CN113784584B (en) * 2021-08-19 2023-03-24 联想(北京)有限公司 Heat dissipation piece and electronic equipment
GB2615655A (en) * 2021-09-13 2023-08-16 Univ Jiangsu Bionic sweat gland and bionic skin
US11858075B1 (en) * 2022-10-25 2024-01-02 Westinghouse Electric Company Llc Heat pipe wick bonding through crimping
WO2025182719A1 (en) * 2024-02-29 2025-09-04 京セラ株式会社 Heat dissipation member, vapor chamber, and functional module
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107816908A (en) * 2017-11-29 2018-03-20 华南理工大学 A kind of gradient porosity fiber sintering formula heat pipe and its manufacture method

Also Published As

Publication number Publication date
US20060162907A1 (en) 2006-07-27
TWI260385B (en) 2006-08-21

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