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TW200626848A - Airflow control system - Google Patents

Airflow control system

Info

Publication number
TW200626848A
TW200626848A TW094140831A TW94140831A TW200626848A TW 200626848 A TW200626848 A TW 200626848A TW 094140831 A TW094140831 A TW 094140831A TW 94140831 A TW94140831 A TW 94140831A TW 200626848 A TW200626848 A TW 200626848A
Authority
TW
Taiwan
Prior art keywords
airflow control
control system
baffle assembly
airflow
chassis
Prior art date
Application number
TW094140831A
Other languages
English (en)
Inventor
Christopher Lucero
Javier Leija
James Shipley
Christopher Gonzales
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200626848A publication Critical patent/TW200626848A/zh

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Air-Conditioning For Vehicles (AREA)
  • Air-Flow Control Members (AREA)
TW094140831A 2004-12-06 2005-11-21 Airflow control system TW200626848A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/005,910 US7652891B2 (en) 2004-12-06 2004-12-06 Airflow control system

Publications (1)

Publication Number Publication Date
TW200626848A true TW200626848A (en) 2006-08-01

Family

ID=36573920

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094140831A TW200626848A (en) 2004-12-06 2005-11-21 Airflow control system

Country Status (4)

Country Link
US (2) US7652891B2 (zh)
CN (1) CN1787734A (zh)
TW (1) TW200626848A (zh)
WO (1) WO2006062730A2 (zh)

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US7652891B2 (en) 2004-12-06 2010-01-26 Radisys Corporation Airflow control system
US20080013276A1 (en) * 2006-06-29 2008-01-17 Michael Pyle Systems and methods for improved cooling of electrical components
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US20080218969A1 (en) * 2007-03-09 2008-09-11 Sony Corporation Electronic system with adjustable venting system
US9017154B2 (en) * 2007-07-13 2015-04-28 Dell Products L.P. Chassis having an internal air plenum and an arrangement of multiple chassis to form a vertical air plenum
US7646600B2 (en) * 2008-04-15 2010-01-12 International Business Machines Corporation Structural support module to prevent common interface deflection
US7885066B2 (en) * 2008-07-17 2011-02-08 Juniper Networks, Inc. Airflow/cooling solution for chassis with orthogonal boards
US20100216390A1 (en) * 2008-10-17 2010-08-26 Emerson Network Power - Embedded Computing, Inc. Apparatus and Method for Restricting Air Flow Within an Electronic Equipment Enclosure
US8363388B2 (en) * 2008-10-17 2013-01-29 Emerson Network Power—Embedded Computing, Inc. System and method for supplying power to electronics enclosures utilizing distributed DC power architectures
US20100218920A1 (en) * 2008-10-17 2010-09-02 Emerson Network Power - Embedded Computing, Inc. System And Method For Airflow Dividers For Use With Cooling Systems For An Equipment Enclosure
US10321601B2 (en) * 2008-10-17 2019-06-11 Artesyn Embedded Computing, Inc. System and method for restricting airflow through a portion of an electronics enclosure
US20100159816A1 (en) * 2008-12-23 2010-06-24 International Business Machines Corporation Converging segments cooling
US7903405B1 (en) * 2009-09-18 2011-03-08 Fisher-Rosemount Systems, Inc. Electronic device enclosures having improved ventilation to dissipate heat
FR2954971B1 (fr) 2010-01-06 2012-02-10 Paul Benoit Radiateur electrique utilisant des processeurs de calcul comme source chaude.
US20110228475A1 (en) * 2010-03-17 2011-09-22 International Business Machines Corporation Enclosure with concurrently maintainable field replaceable units
US8446725B2 (en) * 2010-08-05 2013-05-21 Alcatel Lucent Airflow control in an electronic chassis
CN102480895A (zh) * 2010-11-22 2012-05-30 鸿富锦精密工业(深圳)有限公司 电子装置及其导风罩
CN102647883A (zh) * 2011-02-17 2012-08-22 鸿富锦精密工业(深圳)有限公司 导风罩
TW201309179A (zh) * 2011-08-04 2013-02-16 Wistron Corp 流阻調節裝置及刀鋒伺服器
US8848364B2 (en) * 2012-04-05 2014-09-30 Hewlett-Packard Development Company, L.P. Daughterboard having airflow path
EP2836057B1 (en) * 2013-08-09 2019-07-17 British Telecommunications public limited company Ventilation system
WO2015122914A1 (en) * 2014-02-14 2015-08-20 Hewlett-Packard Development Company, L.P. Controlling impedance of blank cartridges
JP6285299B2 (ja) * 2014-07-07 2018-02-28 東芝三菱電機産業システム株式会社 半導体装置
US9788461B2 (en) * 2014-07-30 2017-10-10 Ciena Corporation Airflow divider for balancing airflow in a modular chassis system
US9915987B2 (en) 2015-02-02 2018-03-13 International Business Machines Corporation Implementing DIMM air flow baffle
US9949407B1 (en) * 2015-05-29 2018-04-17 Amazon Technologies, Inc. Computer system with partial bypass cooling
US10373169B2 (en) * 2015-08-11 2019-08-06 Paypal, Inc. Enhancing information security via the use of a dummy credit card number
US10403328B2 (en) * 2016-01-29 2019-09-03 Western Digital Technologies, Inc. Acoustic attenuation in data storage enclosures
US9949408B2 (en) * 2016-05-27 2018-04-17 Cisco Technology, Inc. Blank card with scalable airflow impedance for electronic enclosures
US10838470B1 (en) * 2017-02-17 2020-11-17 American Megatrends International, Llc Monitoring temperature inside computer chassis
US10037062B1 (en) 2017-03-17 2018-07-31 Microsoft Technology Licensing, Llc Thermal venting device with pressurized plenum
US10627877B2 (en) 2017-03-31 2020-04-21 Hewlett Packard Enterprise Development Lp Air impeding structures with snap-in tabs
CN108733175B (zh) * 2017-04-17 2021-05-07 伊姆西Ip控股有限责任公司 机架以及用于机架的散热装置
US11102910B2 (en) * 2017-08-01 2021-08-24 Dell Products L.P. Flexible service air baffle
CN112445299B (zh) * 2019-09-05 2023-03-10 英业达科技有限公司 扩充卡固定架
CN113163635B (zh) * 2020-01-23 2025-10-17 华为技术有限公司 一种电子设备外罩及电子设备组件
CN112236018A (zh) * 2020-11-05 2021-01-15 阳光电源股份有限公司 功率柜及变流器
US20250240908A1 (en) * 2024-01-19 2025-07-24 Dell Products L.P. Universal airflow impedance blank with adjustable venting ratio

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US6005770A (en) * 1997-11-12 1999-12-21 Dell U.S.A., L.P. Computer and a system and method for cooling the interior of the computer
US5914858A (en) * 1997-11-13 1999-06-22 Northern Telecom Limited Baffle arrangement for an airflow balance system
US5995368A (en) * 1998-10-20 1999-11-30 Nortel Networks Corporation Air flow distribution device for shelf-based circuit cards
US6031717A (en) * 1999-04-13 2000-02-29 Dell Usa, L.P. Back flow limiting device for failed redundant parallel fan
US6151213A (en) * 1999-05-12 2000-11-21 3Com Corporation Ventilation and cooling control system for modular platforms
US6285548B1 (en) 2000-08-18 2001-09-04 Quantum Bridge Communications, Inc. Face plate for a chassis for high frequency components
US6407331B1 (en) * 2001-03-21 2002-06-18 Eaton Corporation Pressure relief panel for arc resistant cabinets
US6738262B2 (en) * 2001-05-21 2004-05-18 Sycamore Networks, Inc. Port filler baffle
US6900387B2 (en) 2002-01-30 2005-05-31 Sun Microsystems, Inc. Balanced flow cooling
US6744632B2 (en) 2002-09-20 2004-06-01 Hewlett-Packard Development Company, L.P. Composite construction baffle for modular electronic systems
TW572187U (en) * 2003-04-24 2004-01-11 Datech Technology Co Ltd Register incorporationg a toggle-joint mechanism between open and closed position
US6922337B2 (en) 2003-04-30 2005-07-26 Hewlett-Packard Development Company, L.P. Circuit card divider to facilitate thermal management in an electronic system
US6912131B2 (en) * 2003-08-27 2005-06-28 Lucent Technologies Inc. Electronic components card air deflector
US6980435B2 (en) * 2004-01-28 2005-12-27 Hewlett-Packard Development Company, L.P. Modular electronic enclosure with cooling design
US7259961B2 (en) * 2004-06-24 2007-08-21 Intel Corporation Reconfigurable airflow director for modular blade chassis
US7652891B2 (en) * 2004-12-06 2010-01-26 Radisys Corporation Airflow control system
US7420806B1 (en) * 2005-11-22 2008-09-02 Juniper Networks, Inc. Airflow distribution through an electronic device
US7355850B2 (en) * 2006-03-31 2008-04-08 National Instruments Corporation Vented and ducted sub-rack support member
US7394654B2 (en) * 2006-10-19 2008-07-01 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device

Also Published As

Publication number Publication date
US7652891B2 (en) 2010-01-26
US7864541B2 (en) 2011-01-04
WO2006062730A3 (en) 2006-08-03
US20060120038A1 (en) 2006-06-08
US20100118490A1 (en) 2010-05-13
CN1787734A (zh) 2006-06-14
WO2006062730A2 (en) 2006-06-15

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