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TW200626693A - Active-energy-ray adhesion-quenchable pressure-sensitive adhesive agent, active-energy-ray adhesion-quenchable pressure-sensitive adhesive sheet applied therewith, and method for producing etched metal article - Google Patents

Active-energy-ray adhesion-quenchable pressure-sensitive adhesive agent, active-energy-ray adhesion-quenchable pressure-sensitive adhesive sheet applied therewith, and method for producing etched metal article

Info

Publication number
TW200626693A
TW200626693A TW094134182A TW94134182A TW200626693A TW 200626693 A TW200626693 A TW 200626693A TW 094134182 A TW094134182 A TW 094134182A TW 94134182 A TW94134182 A TW 94134182A TW 200626693 A TW200626693 A TW 200626693A
Authority
TW
Taiwan
Prior art keywords
sensitive adhesive
pressure
quenchable
active
energy
Prior art date
Application number
TW094134182A
Other languages
Chinese (zh)
Inventor
Shinichi Usui
Keizou Ogata
Original Assignee
Toyo Ink Mfg Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink Mfg Co filed Critical Toyo Ink Mfg Co
Publication of TW200626693A publication Critical patent/TW200626693A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

A pressure-sensitive adhesive having its adherence lost by actinic energy radiation, comprising an etching-resistant photopolymerization initiator, an actinic energy radiation reactive compound and a hardening agent. Further, there is provided a process for producing an etched metallic material, comprising the steps of: (1) adhering a metal foil to a base film by means of the above pressure-sensitive adhesive having its adherence lost by actinic energy radiation; (2) performing selective etching of the metal foil to thereby obtain an etched metal layer; (3) combining the etched metal layer of the laminate composed of the base film, pressure-sensitive adhesive having its adherence lost by actinic energy radiation and etched metal layer with an insulating substrate; and (4) detaching the base film from the etched metal layer, wherein exposure to actinic energy radiation is carried out at least once after the step (1) but prior to the step (4).
TW094134182A 2004-10-01 2005-09-30 Active-energy-ray adhesion-quenchable pressure-sensitive adhesive agent, active-energy-ray adhesion-quenchable pressure-sensitive adhesive sheet applied therewith, and method for producing etched metal article TW200626693A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004289649 2004-10-01

Publications (1)

Publication Number Publication Date
TW200626693A true TW200626693A (en) 2006-08-01

Family

ID=36142622

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134182A TW200626693A (en) 2004-10-01 2005-09-30 Active-energy-ray adhesion-quenchable pressure-sensitive adhesive agent, active-energy-ray adhesion-quenchable pressure-sensitive adhesive sheet applied therewith, and method for producing etched metal article

Country Status (5)

Country Link
JP (1) JPWO2006038547A1 (en)
KR (1) KR20070059176A (en)
CN (1) CN101031625A (en)
TW (1) TW200626693A (en)
WO (1) WO2006038547A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009091551A1 (en) * 2008-01-15 2009-07-23 Dentsply International Inc. Functional resin composition for regulated polymerization stress
JP5464635B2 (en) * 2008-03-28 2014-04-09 リンテック株式会社 Adhesive sheet for semiconductor wafer processing and method of using the same
JP5097600B2 (en) * 2008-03-31 2012-12-12 リンテック株式会社 Chip holding structure, die sort sheet, and semiconductor device manufacturing method
JP2011089073A (en) * 2009-10-26 2011-05-06 Denki Kagaku Kogyo Kk Adhesive, adhesive sheet, multilayered adhesive sheet, and method for producing electronic part
JP5764518B2 (en) * 2011-03-31 2015-08-19 古河電気工業株式会社 Dicing tape and semiconductor wafer processing method
JP6000595B2 (en) * 2012-03-27 2016-09-28 日東電工株式会社 Heat-peelable pressure-sensitive adhesive sheet for electronic component cutting and electronic component processing method
JP2016138165A (en) * 2015-01-26 2016-08-04 日本化薬株式会社 Photosensitive resin composition
CN109072014B (en) * 2016-07-04 2022-02-15 纳美仕有限公司 Adhesive composition, cured product, precision parts
JP7573949B2 (en) * 2018-01-31 2024-10-28 三菱ケミカル株式会社 Curable polymer composition and cured product thereof
CN108864957A (en) * 2018-06-29 2018-11-23 新纶科技（常州）有限公司 A kind of preparation method of the adjustable UV visbreaking pressure sensitive adhesive of peeling force
KR102815609B1 (en) 2019-02-19 2025-05-30 닛토덴코 가부시키가이샤 Method for manufacturing a two-dimensional material laminate and the laminate
CN115868254A (en) * 2020-09-03 2023-03-28 积水化学工业株式会社 End-protected metal-clad laminate, method of manufacturing printed wiring board, and method of manufacturing intermediate for printed wiring board
TW202442839A (en) * 2023-03-27 2024-11-01 日商三菱化學股份有限公司 Active energy ray-curable peeling adhesive composition and adhesive sheet
CN117165210A (en) * 2023-08-22 2023-12-05 福建惠亿美环保材料科技有限公司 EVA adhesive film and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3909907B2 (en) * 1997-04-01 2007-04-25 日東電工株式会社 Adhesive sheets for semiconductor wafer processing and processing methods
JP2002018991A (en) * 2000-07-04 2002-01-22 Showa Highpolymer Co Ltd Curable prepreg, production method and curing method
JP2002069269A (en) * 2000-08-29 2002-03-08 Dainippon Ink & Chem Inc UV curable composition and optical disk
JP2002322454A (en) * 2001-04-26 2002-11-08 Toppan Forms Co Ltd Radiation-curable removable pressure-sensitive adhesive
JP2004088039A (en) * 2002-06-26 2004-03-18 Sekisui Chem Co Ltd Manufacturing method of circuit board

Also Published As

Publication number Publication date
KR20070059176A (en) 2007-06-11
CN101031625A (en) 2007-09-05
JPWO2006038547A1 (en) 2008-05-15
WO2006038547A1 (en) 2006-04-13

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