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TW200610958A - Automated optical inspection method - Google Patents

Automated optical inspection method

Info

Publication number
TW200610958A
TW200610958A TW093129304A TW93129304A TW200610958A TW 200610958 A TW200610958 A TW 200610958A TW 093129304 A TW093129304 A TW 093129304A TW 93129304 A TW93129304 A TW 93129304A TW 200610958 A TW200610958 A TW 200610958A
Authority
TW
Taiwan
Prior art keywords
optical inspection
inspection method
ccd
automated optical
defects
Prior art date
Application number
TW093129304A
Other languages
Chinese (zh)
Other versions
TWI282417B (en
Inventor
Tetsuo Kubo
Original Assignee
Kubotek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kubotek Corp filed Critical Kubotek Corp
Priority to TW93129304A priority Critical patent/TWI282417B/en
Publication of TW200610958A publication Critical patent/TW200610958A/en
Application granted granted Critical
Publication of TWI282417B publication Critical patent/TWI282417B/en

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

This invention provides an automated optical inspection method for inspecting defects on a plurality of continuous objects. The optical inspection system of this invention comprises at least one charged coupled device (CCD) and at least one image processing board correspondingly connected to a CCD. The automated optical inspection method comprises the steps of: providing the continuous objects; obtaining each image from each object by using the at least one CCD; overlapping image storage processes and digital signal processes; selectively displaying the processed full images and the defect-related data on a display for a further determination of the defects.
TW93129304A 2004-09-27 2004-09-27 Automated optical inspection method TWI282417B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93129304A TWI282417B (en) 2004-09-27 2004-09-27 Automated optical inspection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93129304A TWI282417B (en) 2004-09-27 2004-09-27 Automated optical inspection method

Publications (2)

Publication Number Publication Date
TW200610958A true TW200610958A (en) 2006-04-01
TWI282417B TWI282417B (en) 2007-06-11

Family

ID=38823714

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93129304A TWI282417B (en) 2004-09-27 2004-09-27 Automated optical inspection method

Country Status (1)

Country Link
TW (1) TWI282417B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104837006A (en) * 2014-02-11 2015-08-12 京元电子股份有限公司 Semiconductor device testing system and image processing acceleration method thereof
CN106973287A (en) * 2017-03-29 2017-07-21 张家港市欧微自动化研发有限公司 A kind of test system for cmos sensor
CN106993184A (en) * 2017-03-29 2017-07-28 张家港市欧微自动化研发有限公司 A kind of testing method for CMOS sensor
TWI681357B (en) * 2018-10-08 2020-01-01 台灣福雷電子股份有限公司 Device and method for substrate defects analyzation

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201514473A (en) * 2013-10-15 2015-04-16 Utechzone Co Ltd Method for inspecting mixed types of objects

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104837006A (en) * 2014-02-11 2015-08-12 京元电子股份有限公司 Semiconductor device testing system and image processing acceleration method thereof
CN106973287A (en) * 2017-03-29 2017-07-21 张家港市欧微自动化研发有限公司 A kind of test system for cmos sensor
CN106993184A (en) * 2017-03-29 2017-07-28 张家港市欧微自动化研发有限公司 A kind of testing method for CMOS sensor
TWI681357B (en) * 2018-10-08 2020-01-01 台灣福雷電子股份有限公司 Device and method for substrate defects analyzation

Also Published As

Publication number Publication date
TWI282417B (en) 2007-06-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees