TW200610648A - Electro-active adhesive systems - Google Patents
Electro-active adhesive systemsInfo
- Publication number
- TW200610648A TW200610648A TW094119058A TW94119058A TW200610648A TW 200610648 A TW200610648 A TW 200610648A TW 094119058 A TW094119058 A TW 094119058A TW 94119058 A TW94119058 A TW 94119058A TW 200610648 A TW200610648 A TW 200610648A
- Authority
- TW
- Taiwan
- Prior art keywords
- electro
- active
- active adhesive
- adhesive
- adherends
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 6
- 230000001070 adhesive effect Effects 0.000 title abstract 6
- 230000005684 electric field Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000000969 carrier Substances 0.000 abstract 1
- 238000004377 microelectronic Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
A method of adhesive bonding by electric field. The method includes providing at least two adherends to be bonded, providing an electro-active adhesive between the at least two adherends, wherein the electro-active adhesive includes a multiplicity of electro-active particles and an adhesive binder, and applying an electric field to change the adhesion of the electro-active adhesive system to at least one of the adherends. Various carriers for microelectronic devices including electro-active adhesive contact surfaces are also included within the scope of the invention.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US57842204P | 2004-06-09 | 2004-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200610648A true TW200610648A (en) | 2006-04-01 |
Family
ID=57807593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094119058A TW200610648A (en) | 2004-06-09 | 2005-06-09 | Electro-active adhesive systems |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200610648A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017118217A1 (en) * | 2016-01-04 | 2017-07-13 | 京东方科技集团股份有限公司 | Substrate structure and attachment method and stripping method for flexible substrate thereof |
-
2005
- 2005-06-09 TW TW094119058A patent/TW200610648A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017118217A1 (en) * | 2016-01-04 | 2017-07-13 | 京东方科技集团股份有限公司 | Substrate structure and attachment method and stripping method for flexible substrate thereof |
| US10500816B2 (en) | 2016-01-04 | 2019-12-10 | Boe Technology Group Co., Ltd. | Substrate structure, method for attaching flexible substrate and method for peeling off flexible substrate |
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