TW200617211A - Tank for a vertical processing line and method of manufacturing same - Google Patents
Tank for a vertical processing line and method of manufacturing sameInfo
- Publication number
- TW200617211A TW200617211A TW094127330A TW94127330A TW200617211A TW 200617211 A TW200617211 A TW 200617211A TW 094127330 A TW094127330 A TW 094127330A TW 94127330 A TW94127330 A TW 94127330A TW 200617211 A TW200617211 A TW 200617211A
- Authority
- TW
- Taiwan
- Prior art keywords
- tank
- processing line
- vertical processing
- manufacturing same
- tanks
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
In order allow for uniform and reproducible processing of printed circuit boards, more specifically of boards having microvias and blind microvias of less than 0.1 mm in diameter, in lines that are advantageous in terms of acquisition cost, a vertical processing line for processing work pieces (3) is proposed, said line being comprised of tanks with an interior space defined by tank walls (2, 10) and by a tank bottom (1, 1'). The tanks are formed from at least two tank modules. The walls and the bottom define respective module interior spaces which have the same heights (H) and which have the same widths (B).
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200410039632 DE102004039632A1 (en) | 2004-08-11 | 2004-08-11 | Container for a galvanic vertical treatment plant and its manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200617211A true TW200617211A (en) | 2006-06-01 |
Family
ID=35160070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094127330A TW200617211A (en) | 2004-08-11 | 2005-08-11 | Tank for a vertical processing line and method of manufacturing same |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE102004039632A1 (en) |
| TW (1) | TW200617211A (en) |
| WO (1) | WO2006015871A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI383475B (en) * | 2007-11-14 | 2013-01-21 | Samsung Electro Mech | Plating apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007026634B4 (en) | 2007-06-06 | 2009-04-16 | Atotech Deutschland Gmbh | Vertical plant for electroplating treatment of a workpiece and method for conveying the workpiece |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3121053A (en) * | 1961-04-13 | 1964-02-11 | R O Hull & Company Inc | Analytical electroplating apparatus |
| DE7035015U (en) * | 1970-09-22 | 1971-01-28 | Wieland Fa Dr Th | GALVANIZER. |
| DE2206505A1 (en) * | 1972-02-11 | 1973-08-23 | Winfried Trippe | Printed circuit mfg installation - with polyester basins contg treatment tanks and set in cabinet bases |
| FR2244353A5 (en) * | 1973-09-19 | 1975-04-11 | Thionville Laminoirs A Froid | |
| US4506687A (en) * | 1982-06-10 | 1985-03-26 | Circuit Services Corporation | Printed circuit processing apparatus |
| DE8709769U1 (en) * | 1986-09-23 | 1987-11-26 | Nadel- und Drahtwarenfabrik Ernst Bierbach GmbH & Co KG, 4750 Unna | Height and width adjustable post anchor |
| US4745004A (en) * | 1987-01-08 | 1988-05-17 | Schwerin Thomas E | Method and apparatus for transporting circuit or other work units being processed |
| US4933061A (en) * | 1988-12-29 | 1990-06-12 | Trifari, Krussman & Fishel, Inc. | Electroplating tank |
| DE4211836C2 (en) * | 1992-04-08 | 2000-08-03 | Metallglanz Gmbh | Arrangement of a treatment tub of an electroplating system and method for determining the geometric position of your treatment tub |
| DE59501606D1 (en) * | 1994-05-11 | 1998-04-16 | Siemens Sa | DEVICE FOR TREATING PCBS |
| SE510957C2 (en) * | 1997-11-10 | 1999-07-12 | Holmstrands Automation Ab | Machine for treating disc-shaped goods with various media and carriers for use in such a machine |
| DE10224817B4 (en) * | 2002-06-05 | 2005-04-14 | Atotech Deutschland Gmbh | Method and device for vertical dipping of film-like material to be treated in baths of electroplating and etching plants |
-
2004
- 2004-08-11 DE DE200410039632 patent/DE102004039632A1/en not_active Withdrawn
-
2005
- 2005-08-09 WO PCT/EP2005/008769 patent/WO2006015871A1/en not_active Ceased
- 2005-08-11 TW TW094127330A patent/TW200617211A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI383475B (en) * | 2007-11-14 | 2013-01-21 | Samsung Electro Mech | Plating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006015871A1 (en) | 2006-02-16 |
| DE102004039632A1 (en) | 2006-02-23 |
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