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TW200617216A - Flat substrate plating apparatus and method - Google Patents

Flat substrate plating apparatus and method

Info

Publication number
TW200617216A
TW200617216A TW093135536A TW93135536A TW200617216A TW 200617216 A TW200617216 A TW 200617216A TW 093135536 A TW093135536 A TW 093135536A TW 93135536 A TW93135536 A TW 93135536A TW 200617216 A TW200617216 A TW 200617216A
Authority
TW
Taiwan
Prior art keywords
substrate
plating apparatus
flat substrate
substrate plating
contact
Prior art date
Application number
TW093135536A
Other languages
Chinese (zh)
Inventor
Shih-Chun Chung
Ru-Shi Liu
Yu-Hua Chang
Mei-Chun Kuo
Bang-Chang Chen
Nian Tsu Jan
Original Assignee
Procoat Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Procoat Technology Co Ltd filed Critical Procoat Technology Co Ltd
Priority to TW093135536A priority Critical patent/TW200617216A/en
Publication of TW200617216A publication Critical patent/TW200617216A/en

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  • Electroplating Methods And Accessories (AREA)

Abstract

Disclosed is an electroplating apparatus which can form a plated film with a uniform thickness on a flat high-electric-resistive substrate. In the apparatus in which current is applied in contact with an edge portion of a substrate, the electrolyte is kept in contact with the substrate in limited area, and continuously moved over the entire surface of the substrate to obtain a uniform electroplated metal layer.
TW093135536A 2004-11-19 2004-11-19 Flat substrate plating apparatus and method TW200617216A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093135536A TW200617216A (en) 2004-11-19 2004-11-19 Flat substrate plating apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093135536A TW200617216A (en) 2004-11-19 2004-11-19 Flat substrate plating apparatus and method

Publications (1)

Publication Number Publication Date
TW200617216A true TW200617216A (en) 2006-06-01

Family

ID=57808119

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093135536A TW200617216A (en) 2004-11-19 2004-11-19 Flat substrate plating apparatus and method

Country Status (1)

Country Link
TW (1) TW200617216A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385605B (en) * 2009-12-30 2013-02-11 Univ Ishou Applicable to the fuzzy control teaching of the card plating device
CN108239736A (en) * 2016-12-23 2018-07-03 无锡市斯威克科技有限公司 A kind of pulse air knife of photovoltaic reflective solder strip
CN114959848A (en) * 2022-06-08 2022-08-30 苏州晶洲装备科技有限公司 Horizontal electroplating device, horizontal electroplating method and application of photovoltaic cell
CN115323449A (en) * 2022-08-10 2022-11-11 苏州晶洲装备科技有限公司 A jet electrochemical deposition device, electrochemical deposition system device and electrochemical deposition method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385605B (en) * 2009-12-30 2013-02-11 Univ Ishou Applicable to the fuzzy control teaching of the card plating device
CN108239736A (en) * 2016-12-23 2018-07-03 无锡市斯威克科技有限公司 A kind of pulse air knife of photovoltaic reflective solder strip
CN108239736B (en) * 2016-12-23 2024-02-23 无锡市斯威克科技有限公司 Pulse air knife with reflective welding strip for photovoltaic
CN114959848A (en) * 2022-06-08 2022-08-30 苏州晶洲装备科技有限公司 Horizontal electroplating device, horizontal electroplating method and application of photovoltaic cell
CN114959848B (en) * 2022-06-08 2024-03-26 苏州晶洲装备科技有限公司 Horizontal electroplating device, horizontal electroplating method and application of photovoltaic cell
CN115323449A (en) * 2022-08-10 2022-11-11 苏州晶洲装备科技有限公司 A jet electrochemical deposition device, electrochemical deposition system device and electrochemical deposition method

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