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TW200616246A - Method of manufacturing light emitting diode package and structure of the same - Google Patents

Method of manufacturing light emitting diode package and structure of the same

Info

Publication number
TW200616246A
TW200616246A TW093133489A TW93133489A TW200616246A TW 200616246 A TW200616246 A TW 200616246A TW 093133489 A TW093133489 A TW 093133489A TW 93133489 A TW93133489 A TW 93133489A TW 200616246 A TW200616246 A TW 200616246A
Authority
TW
Taiwan
Prior art keywords
emitting diode
light emitting
led
same
light
Prior art date
Application number
TW093133489A
Other languages
Chinese (zh)
Other versions
TWI235511B (en
Inventor
John Liu
Yeong-Her Wang
Yeong-Ching Chao
Y J Lee
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW93133489A priority Critical patent/TWI235511B/en
Application granted granted Critical
Publication of TWI235511B publication Critical patent/TWI235511B/en
Publication of TW200616246A publication Critical patent/TW200616246A/en

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  • Led Device Packages (AREA)

Abstract

A method of manufacturing light emitting diode (LED) package is disclosed. A plurality of LED chips mount on a upper surface of a substrate. Each LED chip has a light-emitting surface. A passivation layer is formed on the upper surface of the substrate and covered the LED chips. Partial passivation layer is removed to expose the light-emitting surfaces of the LED chips and form a plurality of sidewalls surrounding the light-emitting surfaces of the LED chips. A reflecting layer is formed on the sidewalls to improve brightness of the LED packages.
TW93133489A 2004-11-03 2004-11-03 Method of manufacturing light emitting diode package and structure of the same TWI235511B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93133489A TWI235511B (en) 2004-11-03 2004-11-03 Method of manufacturing light emitting diode package and structure of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93133489A TWI235511B (en) 2004-11-03 2004-11-03 Method of manufacturing light emitting diode package and structure of the same

Publications (2)

Publication Number Publication Date
TWI235511B TWI235511B (en) 2005-07-01
TW200616246A true TW200616246A (en) 2006-05-16

Family

ID=36637697

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93133489A TWI235511B (en) 2004-11-03 2004-11-03 Method of manufacturing light emitting diode package and structure of the same

Country Status (1)

Country Link
TW (1) TWI235511B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102738373A (en) * 2011-04-11 2012-10-17 展晶科技(深圳)有限公司 Encapsulation structure of a light-emitting diode and method for manufacturing the same
TWI401829B (en) * 2010-10-07 2013-07-11 Advanced Optoelectronic Tech Led pakage and method for manufacturing the same
CN103959491A (en) * 2011-11-29 2014-07-30 克利公司 Complex primary optics for LED packages and methods for fabricating the same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006033502A1 (en) 2006-05-03 2007-11-15 Osram Opto Semiconductors Gmbh Radiation-emitting semiconductor body with carrier substrate and method for producing such
CN113991004A (en) * 2021-10-26 2022-01-28 东莞市中麒光电技术有限公司 LED substrate manufacturing method, LED substrate, LED device manufacturing method and LED device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
TWI401829B (en) * 2010-10-07 2013-07-11 Advanced Optoelectronic Tech Led pakage and method for manufacturing the same
CN102738373A (en) * 2011-04-11 2012-10-17 展晶科技(深圳)有限公司 Encapsulation structure of a light-emitting diode and method for manufacturing the same
US8716734B2 (en) 2011-04-11 2014-05-06 Advanced Optoelectronic Technology, Inc. Light emitting diode package having a portion of reflection cup material covering electrode layer on side surfaces of substrate
TWI455363B (en) * 2011-04-11 2014-10-01 榮創能源科技股份有限公司 Light-emitting diode package structure and manufacturing method thereof
CN103959491A (en) * 2011-11-29 2014-07-30 克利公司 Complex primary optics for LED packages and methods for fabricating the same
CN103959491B (en) * 2011-11-29 2017-10-03 克利公司 Complicated primary optical part and the method that makes it for LED encapsulation piece
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate

Also Published As

Publication number Publication date
TWI235511B (en) 2005-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees