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TW200616182A - A cooling system for electronic substrates - Google Patents

A cooling system for electronic substrates

Info

Publication number
TW200616182A
TW200616182A TW094126271A TW94126271A TW200616182A TW 200616182 A TW200616182 A TW 200616182A TW 094126271 A TW094126271 A TW 094126271A TW 94126271 A TW94126271 A TW 94126271A TW 200616182 A TW200616182 A TW 200616182A
Authority
TW
Taiwan
Prior art keywords
cooling system
electronic substrates
heat transfer
transfer fluid
electronic
Prior art date
Application number
TW094126271A
Other languages
Chinese (zh)
Inventor
Celine Nicole
Clemens J M Lasance
Menno Willem Jose Prins
Jean-Christophe Baret
Michel Marcel Jose Decre
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200616182A publication Critical patent/TW200616182A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)

Abstract

The present invention relates to a cooling system for an electronic substrate comprising a heat transfer fluid (4, 10). The heat transfer fluid (4, 10) is arranged to flow along a path (5, 11, 12) by capillary force.
TW094126271A 2004-08-05 2005-08-02 A cooling system for electronic substrates TW200616182A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04103775 2004-08-05

Publications (1)

Publication Number Publication Date
TW200616182A true TW200616182A (en) 2006-05-16

Family

ID=35457651

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126271A TW200616182A (en) 2004-08-05 2005-08-02 A cooling system for electronic substrates

Country Status (7)

Country Link
US (1) US20090008064A1 (en)
EP (1) EP1797388A1 (en)
JP (1) JP2008509550A (en)
KR (1) KR20070040835A (en)
CN (1) CN1993596B (en)
TW (1) TW200616182A (en)
WO (1) WO2006016293A1 (en)

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US8232637B2 (en) * 2009-04-30 2012-07-31 General Electric Company Insulated metal substrates incorporating advanced cooling
FR2950133B1 (en) * 2009-09-14 2011-12-09 Commissariat Energie Atomique THERMAL EXCHANGE DEVICE WITH IMPROVED EFFICIENCY
FR2950134B1 (en) * 2009-09-14 2011-12-09 Commissariat Energie Atomique THERMAL EXCHANGE DEVICE WITH ENHANCED CONVECTIVE BOILING AND IMPROVED EFFICIENCY
US8290147B2 (en) * 2009-10-30 2012-10-16 General Dynamics C4 Systems, Inc. Systems and methods for efficiently creating digests of digital data
TWI506238B (en) * 2009-12-29 2015-11-01 鴻準精密工業股份有限公司 Micro liquid cooling device
EP2395549B1 (en) * 2010-06-10 2014-06-25 Imec Device for cooling integrated circuits
US9146596B2 (en) 2012-04-10 2015-09-29 Google Inc. Apparatus and methods for thermal management of a computing device
EP3121850B1 (en) * 2012-10-01 2018-08-01 Hamilton Sundstrand Corporation Dielectrophoretic cooling solution for electronics
US8848371B2 (en) * 2012-10-01 2014-09-30 Hamilton Sundstrand Corporation Dielectrophoretic restriction to prevent vapor backflow
US9030824B2 (en) 2012-10-02 2015-05-12 Hamilton Sundstrand Corporation Dielectrophoretic cooling solution for electronics
US9038407B2 (en) * 2012-10-03 2015-05-26 Hamilton Sundstrand Corporation Electro-hydrodynamic cooling with enhanced heat transfer surfaces
US10168113B2 (en) 2014-03-21 2019-01-01 Board Of Regents, The University Of Texas System Heat pipes with electrical pumping of condensate
CN108885066B (en) * 2017-03-08 2020-09-25 华为技术有限公司 Plate Heat Pipes, Microchannel Cooling Systems and Terminations
US10375855B2 (en) * 2017-11-08 2019-08-06 Honeywell International Inc. Systems and methods for zero power automatic thermal regulation
CN112944952A (en) * 2021-01-28 2021-06-11 中山大学 Sweating cooling system aiming at high-temperature surface thermal protection and thermal control
US12306396B2 (en) 2021-09-24 2025-05-20 Qualcomm Incorporated Electronic device comprising an electrowetting device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3682239A (en) * 1971-02-25 1972-08-08 Momtaz M Abu Romia Electrokinetic heat pipe
US4396055A (en) * 1981-01-19 1983-08-02 The United States Of America As Represented By The Secretary Of The Navy Electrohydrodynamic inductively pumped heat pipe
JPH02136698A (en) * 1988-11-18 1990-05-25 Agency Of Ind Science & Technol Heat transfer promoting device in convection heat transfer surface
US5769155A (en) * 1996-06-28 1998-06-23 University Of Maryland Electrohydrodynamic enhancement of heat transfer
KR100294317B1 (en) * 1999-06-04 2001-06-15 이정현 Micro-cooling system
KR100338810B1 (en) * 1999-11-08 2002-05-31 윤종용 cooling device
DE60103415D1 (en) * 2000-09-29 2004-06-24 Nanostream Inc MICROFLUIDIC DEVICE FOR HEAT TRANSFER
KR100398309B1 (en) * 2001-02-20 2003-09-19 한국과학기술원 Micropump actuated by the movement of liquid drop induced by continuous electrowetting
US6443704B1 (en) * 2001-03-02 2002-09-03 Jafar Darabi Electrohydrodynamicly enhanced micro cooling system for integrated circuits
US6672373B2 (en) * 2001-08-27 2004-01-06 Idalex Technologies, Inc. Method of action of the pulsating heat pipe, its construction and the devices on its base
US6810946B2 (en) * 2001-12-21 2004-11-02 Tth Research, Inc. Loop heat pipe method and apparatus
US6888721B1 (en) * 2002-10-18 2005-05-03 Atec Corporation Electrohydrodynamic (EHD) thin film evaporator with splayed electrodes
WO2004042307A2 (en) * 2002-11-05 2004-05-21 Thar Technologies, Inc Methods and apparatuses for electronics cooling
CN2591775Y (en) * 2002-12-06 2003-12-10 威盛电子股份有限公司 Thin planar heat pipe radiator
TW559460U (en) * 2002-12-12 2003-10-21 Ind Tech Res Inst Enhanced heat conductance structure configured with electrodes
JP2004190978A (en) * 2002-12-12 2004-07-08 Sony Corp Heat transport device and electronic device
US7188484B2 (en) * 2003-06-09 2007-03-13 Lg Electronics Inc. Heat dissipating structure for mobile device
US6863118B1 (en) * 2004-02-12 2005-03-08 Hon Hai Precision Ind. Co., Ltd. Micro grooved heat pipe

Also Published As

Publication number Publication date
CN1993596A (en) 2007-07-04
US20090008064A1 (en) 2009-01-08
CN1993596B (en) 2011-04-20
EP1797388A1 (en) 2007-06-20
JP2008509550A (en) 2008-03-27
WO2006016293A1 (en) 2006-02-16
KR20070040835A (en) 2007-04-17

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