TW200604279A - Resin composition for radiating material and radiating material - Google Patents
Resin composition for radiating material and radiating materialInfo
- Publication number
- TW200604279A TW200604279A TW094108165A TW94108165A TW200604279A TW 200604279 A TW200604279 A TW 200604279A TW 094108165 A TW094108165 A TW 094108165A TW 94108165 A TW94108165 A TW 94108165A TW 200604279 A TW200604279 A TW 200604279A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- radiating material
- heat dissipating
- dissipating material
- compounding
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K5/00—Feeding devices for stock or game ; Feeding wagons; Feeding stacks
- A01K5/02—Automatic devices
- A01K5/0225—Gravity replenishment from a reserve, e.g. a hopper
- A01K5/0233—Gravity replenishment from a reserve, e.g. a hopper dispensing by dosing means actively operated by the animal
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K7/00—Watering equipment for stock or game
- A01K7/02—Automatic devices
- A01K7/022—Pumps actuated by the drinking animal
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Environmental Sciences (AREA)
- Animal Husbandry (AREA)
- Biodiversity & Conservation Biology (AREA)
- Birds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
To provide a resin composition for a heat dissipating material, having excellent curability, adhesion, flexibility, thermal conductivity and durability, and to provide its cured product of the heat dissipating material (for example a heat dissipating sheet). The resin composition for the heat dissipating material is obtained by compounding (A) a (meth)acrylic polymer with (B) a thermally conductive filler, where (A) has a hydrolyzable silyl group and ≤ 10 DEG C glass transition point.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004087038A JP2005272599A (en) | 2004-03-24 | 2004-03-24 | Resin composition for heat dissipating material and heat dissipating material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200604279A true TW200604279A (en) | 2006-02-01 |
| TWI293082B TWI293082B (en) | 2008-02-01 |
Family
ID=35046061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094108165A TW200604279A (en) | 2004-03-24 | 2005-03-17 | Resin composition for radiating material and radiating material |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2005272599A (en) |
| KR (1) | KR100715362B1 (en) |
| CN (1) | CN100341937C (en) |
| TW (1) | TW200604279A (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4853770B2 (en) * | 2006-02-23 | 2012-01-11 | 北川工業株式会社 | Flame retardant composite composition and flame retardant composite material |
| JP5098009B2 (en) * | 2006-10-25 | 2012-12-12 | 北川工業株式会社 | Conductive heat conductive material |
| JP5096782B2 (en) * | 2007-04-19 | 2012-12-12 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| KR100865771B1 (en) | 2007-12-31 | 2008-10-28 | 주식회사 리뷰텍 | Coating composition for heat dissipation |
| JP5218375B2 (en) * | 2009-11-04 | 2013-06-26 | 横浜ゴム株式会社 | Thermally conductive composition |
| JP5223149B2 (en) * | 2010-06-28 | 2013-06-26 | 北川工業株式会社 | Thermal conductivity material |
| CN103097470B (en) | 2010-08-05 | 2015-10-14 | 韩华石油化学株式会社 | Utilize the high efficiency heat radiation coating composition of carbon material |
| JP6145927B2 (en) | 2012-06-01 | 2017-06-14 | パナソニックIpマネジメント株式会社 | Lighting device and vehicle headlamp |
| JPWO2014136484A1 (en) * | 2013-03-07 | 2017-02-09 | 住友ベークライト株式会社 | Equipment, adhesive composition, adhesive sheet |
| KR101481804B1 (en) * | 2014-06-17 | 2015-01-26 | 부산대학교 산학협력단 | LED streetlamp using high heat-dissipating ceramic composite |
| WO2017150748A1 (en) * | 2016-03-02 | 2017-09-08 | 주식회사 대신테크젠 | Composite composition having high thermal conductivity for use in automotive light housing and preparation method therefor |
| CN113677717A (en) * | 2019-04-11 | 2021-11-19 | 电化株式会社 | Copolymer, dispersant, and resin composition |
| JP2023082904A (en) * | 2021-12-03 | 2023-06-15 | 富士フイルム株式会社 | Curable composition, thermally conductive material, thermally conductive sheet, device with thermally conductive layer, compound |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8400149D0 (en) * | 1984-01-05 | 1984-02-08 | Bp Chem Int Ltd | Polymer composition |
| JP2536092B2 (en) * | 1988-10-05 | 1996-09-18 | 日立電線株式会社 | Flame-retardant wire / cable |
| JPH05230179A (en) * | 1992-02-20 | 1993-09-07 | Kansai Paint Co Ltd | Low-temperature curable resin composition |
| JP4337991B2 (en) * | 1997-12-22 | 2009-09-30 | 日東電工株式会社 | Thermally conductive pressure-sensitive adhesive sheets and methods of fixing electronic components and heat radiating members using the same |
| PL200670B1 (en) | 1998-12-28 | 2009-01-30 | Chugoku Marine Paints | Silylmethacrylate copolymers, methods of obtaining them, antifoulding painting compositions containing such copolymers, antifoulding films formed of such painting compositions, methods of preventing surface fouling using such painting compositions and und |
| JP2001302936A (en) * | 2000-02-15 | 2001-10-31 | Sekisui Chem Co Ltd | Heat-conductive resin composition |
| JP3608612B2 (en) * | 2001-03-21 | 2005-01-12 | 信越化学工業株式会社 | Electromagnetic wave absorbing heat conducting composition, heat softening electromagnetic wave absorbing heat radiation sheet, and heat radiation construction method |
| JP2002363429A (en) * | 2001-06-07 | 2002-12-18 | Three Bond Co Ltd | Thermal conductive composition |
| JP2002371192A (en) * | 2001-06-15 | 2002-12-26 | Hitachi Chem Co Ltd | Heat dissipation film and heat dissipation plate |
| JP3975329B2 (en) | 2001-12-14 | 2007-09-12 | 信越化学工業株式会社 | MOUNTING CIRCUIT BOARD PROTECTION COATING AGENT, MOUNTING SURFACE PREVENTION METHOD, |
| US7439308B2 (en) * | 2002-04-25 | 2008-10-21 | Kaneka Corporation | Process for producing (meth)acrylic polymer terminated by crosslinkable silyl group |
-
2004
- 2004-03-24 JP JP2004087038A patent/JP2005272599A/en active Pending
-
2005
- 2005-03-02 KR KR1020050017133A patent/KR100715362B1/en not_active Expired - Fee Related
- 2005-03-17 TW TW094108165A patent/TW200604279A/en unknown
- 2005-03-22 CN CNB2005100560108A patent/CN100341937C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1673274A (en) | 2005-09-28 |
| CN100341937C (en) | 2007-10-10 |
| TWI293082B (en) | 2008-02-01 |
| JP2005272599A (en) | 2005-10-06 |
| KR100715362B1 (en) | 2007-05-07 |
| KR20060043304A (en) | 2006-05-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200604279A (en) | Resin composition for radiating material and radiating material | |
| CN102757648B (en) | A kind of thermally conductive silicone rubber composite material and preparation method thereof | |
| CN101875710B (en) | Siloxane-group light-initiated polyacrylic ester/silicon dioxide nanometer material and preparation method thereof | |
| TW200517462A (en) | Acrylic adhesive sheet | |
| WO2009038020A1 (en) | Adhesive composition for electronic components and adhesive sheet for electronic components using the same | |
| AU2003265983A1 (en) | Heat softening thermally conductive compositions and methods for their preparation | |
| EP1731544A4 (en) | Hardenable composition | |
| MY156527A (en) | Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product | |
| ATE279010T1 (en) | ELECTRICALLY CONDUCTIVE CURTABLE RESIN COMPOSITION, HARDENED PRODUCT PRODUCED THEREFROM AND PRODUCT PRODUCED USING THE COMPOSITION | |
| DE602007004235D1 (en) | HARDENABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | |
| WO2008153125A1 (en) | Sealing agent for optical semiconductor element, and optical semiconductor element | |
| BR0006008A (en) | Process for making a coupling between a plastic material and a metallic surface. | |
| EP2028220A4 (en) | Molded article and method for production thereof | |
| TW200704713A (en) | Curable silicone composition and cured product therefrom | |
| WO2008133265A1 (en) | Curable composition | |
| MY157959A (en) | Intermediate layer material and composite laminate | |
| TW200612111A (en) | Active energy ray-curable resin composition and the resulting sheet-like optical article | |
| WO2009058794A3 (en) | Thermal interface materials, methods of production and uses thereof | |
| DE602006003433D1 (en) | HARDENABLE ORGANOPOLYSILOXANE COMPOSITION | |
| JP2007070632A5 (en) | ||
| CN103665879A (en) | Organic silicon gel composition for high-power LED (light-emitting diode) packaging | |
| TW200420647A (en) | Curable composition, cured product thereof and molded product thereof | |
| TW200508349A (en) | Thermally-formable and cross-linkable precursor of a thermally conductive material | |
| CN104292847B (en) | A kind of high-performance conductive silicon rubber and preparation method thereof | |
| PT1728839E (en) | Actinic radiation curable coating compositions |