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TW200520136A - Adhesive sheet for processing semiconductors and method for processing semiconductors - Google Patents

Adhesive sheet for processing semiconductors and method for processing semiconductors

Info

Publication number
TW200520136A
TW200520136A TW093123311A TW93123311A TW200520136A TW 200520136 A TW200520136 A TW 200520136A TW 093123311 A TW093123311 A TW 093123311A TW 93123311 A TW93123311 A TW 93123311A TW 200520136 A TW200520136 A TW 200520136A
Authority
TW
Taiwan
Prior art keywords
processing semiconductors
adhesive sheet
semiconductors
processing
base film
Prior art date
Application number
TW093123311A
Other languages
Chinese (zh)
Other versions
TWI317155B (en
Inventor
Syouji Yamamoto
Tomokazu Takahashi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200520136A publication Critical patent/TW200520136A/en
Application granted granted Critical
Publication of TWI317155B publication Critical patent/TWI317155B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides an adhesive sheet for processing semiconductors, which has excellent pick-up performance even in thin semiconductor chips. In the adhesive sheet for processing semiconductors, a layer of adhesive compound (2) is disposed on at least one side of a base film (1) of a substrate. The base film (1) is characterized in that the polyethylene therein has a density below 0.915g/cm3.
TW093123311A 2003-10-10 2004-08-04 Adhesive sheet for processing semiconductors and method for processing semiconductors TWI317155B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003351680A JP2005116920A (en) 2003-10-10 2003-10-10 Adhesive sheet for semiconductor processing and semiconductor processing method

Publications (2)

Publication Number Publication Date
TW200520136A true TW200520136A (en) 2005-06-16
TWI317155B TWI317155B (en) 2009-11-11

Family

ID=34542853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093123311A TWI317155B (en) 2003-10-10 2004-08-04 Adhesive sheet for processing semiconductors and method for processing semiconductors

Country Status (4)

Country Link
JP (1) JP2005116920A (en)
KR (1) KR20050035101A (en)
CN (1) CN100365793C (en)
TW (1) TWI317155B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4717052B2 (en) * 2007-11-08 2011-07-06 日東電工株式会社 Dicing die bond film
WO2009060788A1 (en) * 2007-11-08 2009-05-14 Nitto Denko Corporation Dicing die-bonding film
WO2009060787A1 (en) * 2007-11-08 2009-05-14 Nitto Denko Corporation Dicing die-bonding film
JP4717051B2 (en) * 2007-11-08 2011-07-06 日東電工株式会社 Dicing die bond film
JP4717086B2 (en) * 2008-01-18 2011-07-06 日東電工株式会社 Dicing die bond film
JP4717085B2 (en) 2008-01-18 2011-07-06 日東電工株式会社 Dicing die bond film
JP4790073B2 (en) * 2010-04-14 2011-10-12 日東電工株式会社 Dicing die bond film
JP4718640B2 (en) * 2010-04-14 2011-07-06 日東電工株式会社 Dicing die bond film
JP5716371B2 (en) * 2010-12-03 2015-05-13 住友ベークライト株式会社 Film for semiconductor and method for manufacturing semiconductor device
JP2012209363A (en) * 2011-03-29 2012-10-25 Sumitomo Bakelite Co Ltd Dicing film
WO2018180594A1 (en) * 2017-03-28 2018-10-04 リンテック株式会社 Film-like adhesive composite sheet and semiconductor device manufacturing method
JP7377723B2 (en) * 2020-01-21 2023-11-10 タキロンシーアイ株式会社 Base film for dicing tape
KR20230064291A (en) * 2021-11-03 2023-05-10 삼성전자주식회사 Release film and method for manufacturing semiconductor package using same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120640B2 (en) * 1987-07-08 1995-12-20 古河電気工業株式会社 Radiation curable adhesive tape for semiconductors
KR100222141B1 (en) * 1996-01-11 1999-10-01 사또 아끼오 Adhesive polyethylene compositions and multi-layer laminated films using the same
JP2002168820A (en) * 2000-12-05 2002-06-14 Yazaki Corp Smoke detector

Also Published As

Publication number Publication date
TWI317155B (en) 2009-11-11
CN100365793C (en) 2008-01-30
JP2005116920A (en) 2005-04-28
CN1606144A (en) 2005-04-13
KR20050035101A (en) 2005-04-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees