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TW200503094A - Organic matter removing apparatus and method, ozone water jet nozzle, and organic matter removing apparatus for mask substrate - Google Patents

Organic matter removing apparatus and method, ozone water jet nozzle, and organic matter removing apparatus for mask substrate

Info

Publication number
TW200503094A
TW200503094A TW093111072A TW93111072A TW200503094A TW 200503094 A TW200503094 A TW 200503094A TW 093111072 A TW093111072 A TW 093111072A TW 93111072 A TW93111072 A TW 93111072A TW 200503094 A TW200503094 A TW 200503094A
Authority
TW
Taiwan
Prior art keywords
organic matter
removing apparatus
matter removing
ozone water
substrate surface
Prior art date
Application number
TW093111072A
Other languages
Chinese (zh)
Inventor
Yoji Fujimori
Yoshihiko Furuno
Kazutoshi Yamazaki
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003116216A external-priority patent/JP2006196477A/en
Priority claimed from JP2003116217A external-priority patent/JP4351862B2/en
Priority claimed from JP2003116218A external-priority patent/JP2006196479A/en
Priority claimed from JP2003409375A external-priority patent/JP2006164996A/en
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200503094A publication Critical patent/TW200503094A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

This invention provides an organic matter removing apparatus and method, and an ozone water jet nozzle which enable to highly efficiently remove an organic matter on a substrate surface. An organic matter removing apparatus for mask substrate is also disclosed which enables to highly efficiently remove an organic matter on the surface of a mask substrate. The organic matter removing apparatus removes organic matters on a substrate surface by flowing ozone water over the substrate surface to be processed. It comprises at least a reaction unit which is composed of a fixing unit for fixing the substrate in such a manner that the substrate surface to be processed is generally parallel to the direction of oz one water flow and a changing member arranged in a position opposite to the fixed substrate surface for changing the direction of ozone water flow.
TW093111072A 2003-04-21 2004-04-21 Organic matter removing apparatus and method, ozone water jet nozzle, and organic matter removing apparatus for mask substrate TW200503094A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003116216A JP2006196477A (en) 2003-04-21 2003-04-21 Ozone water jet nozzle, and resist removing apparatus
JP2003116217A JP4351862B2 (en) 2003-04-21 2003-04-21 Resist removing method and resist removing apparatus
JP2003116218A JP2006196479A (en) 2003-04-21 2003-04-21 Resist removal method and resist removing apparatus
JP2003409375A JP2006164996A (en) 2003-12-08 2003-12-08 Resist removing apparatus for mask substrate

Publications (1)

Publication Number Publication Date
TW200503094A true TW200503094A (en) 2005-01-16

Family

ID=33314359

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111072A TW200503094A (en) 2003-04-21 2004-04-21 Organic matter removing apparatus and method, ozone water jet nozzle, and organic matter removing apparatus for mask substrate

Country Status (2)

Country Link
TW (1) TW200503094A (en)
WO (1) WO2004095550A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110459493A (en) * 2019-08-21 2019-11-15 北京北方华创微电子装备有限公司 Vacuumize chamber and vacuum pumping method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101373341B (en) * 2007-08-24 2013-11-20 北京京东方光电科技有限公司 Photoresist apparatus for removing edge
US10960094B1 (en) 2020-06-16 2021-03-30 Innovative Technologies Disinfection system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3869566B2 (en) * 1998-11-13 2007-01-17 三菱電機株式会社 Photoresist film removal method and apparatus
JP2001269631A (en) * 2000-03-27 2001-10-02 Dainippon Screen Mfg Co Ltd Substrate cleaning device
JP2001326210A (en) * 2000-05-18 2001-11-22 Dainippon Screen Mfg Co Ltd Substrate treating device
JP4005326B2 (en) * 2000-09-22 2007-11-07 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP3810278B2 (en) * 2001-03-23 2006-08-16 大日本スクリーン製造株式会社 Substrate processing equipment
JP2004207515A (en) * 2002-12-25 2004-07-22 Sekisui Chem Co Ltd Device and method for removing resist
JP4177092B2 (en) * 2002-12-25 2008-11-05 積水化学工業株式会社 Resist removing apparatus and resist removing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110459493A (en) * 2019-08-21 2019-11-15 北京北方华创微电子装备有限公司 Vacuumize chamber and vacuum pumping method

Also Published As

Publication number Publication date
WO2004095550A1 (en) 2004-11-04

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