200304158 柒、奉案若有化學式時，請揭示最能顯示發明特徵的化學 式： _ 玖發明說明 【發明所屬之技術領域】 本發明係關於一種保險絲元件，尤指一種當電流過大 時可自動斷電以保護元件不致損壞，而於溫度降低時可自 行恢復成導電狀態之自復式保險絲。 【先前技術】 於各式電氣產品中，為了保護内部元件不致於因過大 電流或電壓而造成損壞，電路保護元件的設置是有其必要 性的。在過電流保護元件中，即當屬保險絲最為普遍應用 ，而為滿足各式不同之電子元件，許多不同型態的保險絲 已廣泛可見。 習用保險絲之工作原理係於電流值過高時，即自動燒 毀形成電路開路以達到保護目的，惟其缺點是維修人員必 須持續更換新的元件，方能使產品再次正常工作。為克服 此一缺點，自復式保險絲即逐漸取代習用產品。自復式保 險絲利用其使用的材質特性，於一般電流工作狀況之下係 為良導體，而當電流過大導溫度上升時，其材質特性將由 導體轉為絕緣體，形同一開路元件，故能對電氣產品提供 保護作用，惟當溫度下降時，復自行恢復成導電狀態，故 謂自復式保險絲。 200304158 凊參閱第六圖所示，為 夕谓而-立 為目則吊見的一種自復式保險絲 個佴咚蘇目於I板上係形成有多個保險絲個體，每 -個保險絲個體依據圖面所示的切割線（： 形成，各切割蝮f Α Λ、 U A )裁切後 。 』線（A-A)均通過各鑽孔（70)之中心 ，、音I參=七圖所示’為前述各保險絲個體之立體結構 因裁：而呈i略呈扁平之矩形體，於其兩相對側面均形成 圓形之導孔（71)(”），就圖面而言 :二复式保險絲之上、下頂面均由一導電層所組成，於 間即導電高分子材質（—eh)，前述導 (72)之孔壁均電鍍有導電材質， 、下頂面構成電氣連接，又’頂面係藉成 -上絕緣線（7 3 )鄰近第 浴成有 回媒m $孔（7 1 )，於其底面亦 成有一鄰近第二導孔（72)之下絕緣線（74) 。藉由兩道絕緣線（7 3 ) ( 7 4 )的設置，上、 面便成為兩互不導通的極板’其中前述兩導孔（7 7ϋ即作為該保險絲的兩極點，分別與上 '下極板連接 Λ孔（7 1 ) ( 7 2 )即可與外部電路焊接。 導體^常電流工作狀況時’兩極板之間導電高分子係為 受的J二電流可流經兩極；當電流超過保險絲所能承 :，使-二:根據公式？= 1 2R ’將會使溫度急速上 絕緣體。 ”子產“鏈’故由導體轉為 根據第七圖所示，該保險絲之額定電流值係取決於兩 4 200304158 極之有效重疊面積（AA)，即介 73) (W)之間。由此可知 第—絕緣線（ )(Η)，實際上兩極板可使二=絕緣線⑺ 故此種自復式保險絲於一定尺寸實為有限， 無法過大，若為滿足較大的額定電：:：=電流勢必 == 對於縮減元件體積之要求而言，無疑 疋 月道而驰的作法。 【發明内容】 :克服前述習用技術無法承受較大的負載電流，本發 要目的係提供-種在較小尺寸體積之下，仍具有較 :的額定電流值且無過熱情況發生之自復式保險絲及其製 法0 本發明自復式保險絲之製法係包含有如下步驟： 於一銅基板表面同時形成複數保險絲之下層極板，立 中各保險絲之下層極板係分別由兩互不導通之極片組成/ 依序結合一導電膠材及一銅箔層於前述鋼基板上； 、+鑽設前述已結合有該導電膠材及銅落層之銅基板以形 成貝孔’並施;H·導通孔電鑛，各貫孔之位置係對應連接於 下層極板其中一極片； 以前述銅箔層構成保險絲之上層極板，令上層極板透 過前述導通孔與下層極板其中一極片構成電氣連接；及 以前述銅基板形成凸出狀之銅接點，係蝕刻該銅基板 令其形成銅接點，各銅接點係對應連接前述下層極板； 前述銅接點係供連接於一般電路板上，而該導電膠材 200304158 之材質係可承受一定的額定電流，當超過該額定電流值係 由導體轉成絕緣體以發揮保險絲作用。 又，本發明之自復式保險絲之體結構係具有： 一導電膠材，其材質係可承受一定的額定電流，當超 過该額定電流值係由導體轉成絕緣體； 一下層極板，係形成於前述導電膠材之底面，由兩互 不導通之極片組成； 一上層極板，係形成於前述導電膠材之頂面； 一導通孔，係連接前述上層極板與下層極板其中一極 因前述下層極板之一極片係與上層極板形成連接，故 上層極板係與下層極板之另一極片形成重疊，#以提高保 險絲之額定電流。 前述下層極板之兩極片係分別形成有銅接點，以該銅 接點焊接於一般電路板上。 【實施方式】 請參考第一 A圖所示，首先於-銅基板（1 0)表面 進行粗化處理，復以光阻施工利用 先罩將保險絲之下層極 板（21 a) (21b)圖案轉務5兮义 口朱褥移至该銅基板（1 〇 )的 、面上’再經曝光及顯像步驟，♦圖稿基準孔（ 對位孔（1 2 )及下層極板（2 i ) 、 柘fin、士 ,^ 丄b)於銅基 板（1 0 )表面顯鉻出，於下層極板 θ u 败 Q 2 1 a ) ( 2 1 b )圖案區域係電鍵一層抗I虫金屬 〇 ^士、 + , 仝屬例如以鎳為該抗蝕金屬 元成⑽之後’復去除光阻，則前述銅基板（10) 200304158 表面便形成有鎳材質 之下層極板（21 ' " σ第一B圖所示。前述 例，意即單顆佯卜蛛+ 系以早一保險絲個體為 請參閱第二A、二B; :/不導通之接點。 la) ( ο 1 κ n '字上述已完成下層極板（2 二I 銅基板（1〇)，係㈣合有-導電 ;==一銅“40)，後的銅基板⑴ Γ χ光找出位於銅基板（10)表面的圖稿基準孔 (1 1 )與對位孔f 1 、 #、，丄 (1 2 )，並以沖孔方式鑽出前述孔洞 如第三圖所示，利用各圖稿基準孔（1 1 )與對位孔 (1 2 )為基準點’於銅基板（工〇 )上形成導通孔（5 )、各導通孔（5 〇 )係可利用機械沖孔或雷射鑽孔等 方式構成且對應於各保險絲個體其下層極板的其中一極片 (2 1 b )，當導通孔（5 〇 )孔壁内施以電鍍程序後， 上層的銅箱（40)便可與下層的銅基板（1〇)形成電 氣連接。 請參閱第四A、四B圖所示，於前述銅箔（4〇)層 表面，對應於各個保險絲個體上方係以曝光、顯影、蝕刻 、去光阻等步，將前述銅箔（4 〇 )蝕刻成一上層極板（ 41) ’該上層極板（41)即經由導通孔（5〇)與前 述一下層極板（2 1 B)形成連接。由圖示中可清楚看出 上、下極板有效重疊面積係大為増加，故自然可承受較高 的額定電流。 請參閱第五圖所示，係於該銅基板（1 〇 )之底面具 200304158 對應下層極板（21a) (21b)所在位置經顯影、姓 刻等步驟，將該銅基板（10)钱刻而形成凸出狀的銅接 點U3)，並令下層極板（21〇 (2ib)顯露;出 來。於兩下層極板（21a) (2lb)之間，及上層極 板（4 1 )表面，均塗佈有一絕緣保護層（6 ) ( 6丄 )’而銅接點（13)之表面復以鎳、金、錫等金屬薄膜 施以表面電鍍處理，令銅接點（χ 3 )更易 _ 印刷電路板上。 b200304158 若, if there is a chemical formula in the case, please disclose the chemical formula that best shows the characteristics of the invention: _ 玖 Description of the invention [Technical field to which the invention belongs] The present invention relates to a fuse element, especially a type that can automatically power off when the current is too large In order to protect the components from damage, the self-resetting fuse can be restored to a conductive state by itself when the temperature decreases. [Prior art] In various electrical products, in order to protect internal components from being damaged due to excessive current or voltage, it is necessary to provide circuit protection components. Among the overcurrent protection components, that is, the fuse is the most commonly used, and in order to meet various electronic components, many different types of fuses have been widely seen. The working principle of the conventional fuse is that when the current value is too high, the circuit is automatically burned to form an open circuit to achieve protection. However, the disadvantage is that maintenance personnel must continue to replace new components to make the product work normally again. To overcome this shortcoming, self-resetting fuses have gradually replaced conventional products. The self-resetting fuse uses its material characteristics and is a good conductor under normal current operating conditions. When the current is too high and the temperature rises, its material characteristics will change from the conductor to the insulator and form an open circuit component, so it can be used for electrical products. Provide protection, but when the temperature drops, the compound will automatically return to the conductive state, so it is called a self-resetting fuse. 200304158 凊 Refer to the sixth figure, which is a self-resetting fuse that is seen for the sake of Li-Li. The Su-head is formed on the I board with multiple fuse units. Each fuse unit is based on the drawing. The illustrated cutting lines (: formed, each cutting 蝮 f Α Λ, UA) are cut. The line (AA) passes through the center of each drilled hole (70), and the sound I parameter = as shown in the seventh figure. 'The three-dimensional structure of each fuse body is tailored as follows: i is a slightly flat rectangular body. Circular guide holes (71) (") are formed on the opposite sides. As far as the drawing is concerned, the top and bottom surfaces of the two-fold fuse are composed of a conductive layer, which is a conductive polymer material (—eh). The hole wall of the aforementioned guide (72) is electroplated with conductive material, and the lower top surface constitutes an electrical connection, and the top surface is borrowed-an upper insulated wire (7 3) is adjacent to the first bath and has a m $ hole (7 1) An insulated wire (74) is also formed on the bottom surface adjacent to the second guide hole (72). With the arrangement of two insulated wires (7 3) (7 4), the upper and lower surfaces become non-conducting. The two holes in the electrode plate (7 7ϋ) are the two poles of the fuse, and are connected to the upper hole and the lower electrode plate Λ holes (7 1) (7 2) to solder the external circuit. When the conductive polymer system between the two plates is subjected to the current, the two currents can flow through the two poles; when the current exceeds the capacity of the fuse: -2: according to the formula = 1 2R 'will cause the temperature to rapidly rise to the insulator.' The "production" chain is changed from the conductor to the one shown in the seventh figure. The rated current value of the fuse depends on the effective overlap area (AA) of two 4 200304158 poles. That is, between 73) (W). It can be seen that the first-insulated wire () (Η), in fact, the two electrode plates can make two = insulated wire ⑺ Therefore, this type of self-resetting fuse is limited in a certain size and cannot be too large. If you want to meet the larger rated power ::: = current is bound to == For the requirement of reducing the volume of the component, it is undoubtedly the way to go. 【Summary】: Overcome the conventional technology can not withstand the large load current The purpose of the present invention is to provide a self-resetting fuse with a rated current value and no overheating under a small size and volume, and a manufacturing method thereof. The manufacturing method of the self-resetting fuse of the present invention includes the following steps : A plurality of lower fuse plates are formed on the surface of a copper substrate at the same time. The lower fuse plates of each fuse in the center are composed of two non-conducting pole pieces. A conductive adhesive material and a copper foil layer are sequentially combined in front. On a steel substrate; and + drill the aforementioned copper substrate that has been combined with the conductive adhesive material and the copper layer to form a shell hole; and H; through-hole electrical ore, the position of each through hole is correspondingly connected to the lower electrode plate One of the pole pieces; the upper layer electrode plate of the fuse is formed by the foregoing copper foil layer, so that the upper layer electrode plate is electrically connected to one of the lower layer electrode plates through the via hole; and a convex copper contact is formed by the foregoing copper substrate. The copper substrate is etched to form copper contacts, and each copper contact is correspondingly connected to the aforementioned lower electrode plate; the aforementioned copper contacts are for connection to a general circuit board, and the material of the conductive adhesive material 200304158 can withstand a certain amount When the rated current exceeds this value, the conductor is turned into an insulator to play the role of a fuse. In addition, the body structure of the self-resetting fuse of the present invention has: a conductive adhesive material whose material can withstand a certain rated current; when the value exceeds the rated current, the conductor is converted into an insulator; the lower layer electrode plate is formed on The bottom surface of the conductive adhesive material is composed of two non-conducting pole pieces; an upper electrode plate is formed on the top surface of the conductive adhesive material; a via hole connects one of the upper electrode plate and one of the lower electrode plates. Since one of the aforementioned lower electrode plates is connected to the upper electrode plate, the upper electrode plate and the other electrode plate of the lower electrode plate overlap to increase the rated current of the fuse. The two pole pieces of the aforementioned lower electrode plate are respectively formed with copper contacts, and the copper contacts are soldered to a general circuit board. [Embodiment] Please refer to the first figure A, first roughen the surface of the copper substrate (1 0), and then use the photoresist construction to use the first cover to pattern the lower electrode plate (21 a) (21b) of the fuse. Transfer 5 Xiyikou Zhu mattress to the surface of the copper substrate (10), and then through the exposure and development steps, the artwork reference hole (alignment hole (1 2)) and the lower electrode plate (2 i ), 柘 fin, shi, ^ 丄 b) Chromium appears on the surface of the copper substrate (1 0), and the lower layer θ u loses Q 2 1 a) (2 1 b). The pattern area is a layer of anti-I insect metal. ^ Shi, +, both belong to, for example, after nickel is used as the resist metal element to form a photoresist, and then the photoresist is removed, the surface of the aforementioned copper substrate (10) 200304158 is formed with a lower electrode plate (21) It is shown in Fig. B. The foregoing example means that a single scab spider + is based on a single fuse. Please refer to the second A and second B;: / non-conducting contact. La) (ο 1 κ n ' The above-mentioned completed lower electrode plate (2 2 I copper substrate (10)) is coupled with-conductive; == a copper "40", and the subsequent copper substrate ⑴ Γ χ find out the surface of the copper substrate (10) Artwork benchmark (1 1) and alignment holes f 1, # ,, 丄 (1 2), and punching out the aforementioned holes by punching, as shown in the third figure, using the reference holes (1 1) of each artwork and the alignment holes (1 2) is a reference point for forming a via hole (5) on a copper substrate (work), and each via hole (50) can be formed by mechanical punching or laser drilling, and corresponds to each fuse individual One of the pole pieces (2 1 b) of the lower layer plate is formed with a copper box (40) in the upper layer and a copper substrate (1) in the lower layer after the plating process is performed in the hole wall of the via hole (50). Electrical connection. Please refer to Figures 4A and 4B. On the surface of the aforementioned copper foil (40) layer, the steps of exposure, development, etching, and photoresist removal are performed on the surface of each of the individual fuses. (4) Etching an upper electrode plate (41) 'The upper electrode plate (41) is connected to the aforementioned lower electrode plate (2 1 B) via a via (50). It can be clearly seen from the figure The effective overlap area of the upper and lower plates is greatly increased, so it can naturally withstand a higher rated current. Please refer to the fifth figure, which is attached to the copper substrate (1 ) The bottom mask 200304158 corresponds to the position of the lower electrode plate (21a) (21b). The copper substrate (10) is engraved to form a convex copper contact U3) through development, surname engraving and other steps. The plate (21〇 (2ib) is exposed; it comes out. Between the two lower electrode plates (21a) (2lb) and the surface of the upper electrode plate (4 1), there is an insulating protective layer (6) (6 丄) ' The surface of the copper contact (13) is coated with a metal film such as nickel, gold, tin, etc., to make the surface of the copper contact (χ 3) easier to be printed circuit board. b
前述形成在銅基板（10)的保險絲成品，再經過切 割成型後，即成為單顆產品，以前述凸出的銅接點（U )便可直接焊接於—般的印刷電路之上，作為―過電流保 護元件。 ” Z ' 练上所述，本發明相較於習用自復式保險絲，就並社 ==發明之上、下兩極板幾乎是完全重疊，故： 積即Λ為增加’如此將使錄絲之可承受的額定 電流值提升，換言之，在與習用自復式保險絲相同的= 本毛月將可提供更尚額定電流之電路保護元件。 哼僅：古方面’以本發明之製程而言，每-顆自復式保險 =須有:道鑽孔程序，即用以形成連接上、下極板之導 i雷極以兩道鑽孔程序以形成接 • ’且必須利用上、下兩道絕緣線區隔 二:的鑽孔步驟而言，本發明足足少了一倍的加工量彳 發降二而更具產業競爭力，故而本發明在符合 牛之則提下，爰依法具文提出申請。 200304158 【圖式簡單說明】 (一）圖式部分 第一 A、一 b圖：係本發明之銅基板上形成下層極板之示 意圖。 B圖：係本發明之銅基板上壓合導電膠材及銅 第 箔之示意圖 第三圖：係本發明形成導通孔之示意圖。 第四A、四B圖：係本發明形成上層極板之示意圊 第五圖··係本發明自復式保險絲之示意圖。 第六圖：係習用自復式保險絲之平面示意圖。 第七圖：係習用自復式保險絲之立體示意圖。 (二）元件代表符號 (1〇)銅基板 （1 1)圖稿基準孔 (1 2 )對位孔 （1 3 )銅接點 (21 a) (21b)下層極板 (3 0 )導電膠材 (4 0 )銅箔 （5 0 )導通孔 (60)(61)絕緣保護層 (71)(72)導孔（73)上絕緣線 (7 4 )下絕緣線The finished fuse product formed on the copper substrate (10) is cut into a single product, and the protruding copper contact (U) can be directly soldered to a general printed circuit as- Overcurrent protection element. ”Z” As mentioned above, compared with the conventional self-resetting fuse, the invention of the present invention is that the upper and lower plates of the invention are almost completely overlapped, so: the product is Λ is increased. The rated current value withstand is increased, in other words, the same as the conventional self-resetting fuse = this gross month will provide circuit protection components with a higher rated current. Humming only: in the ancient aspect, in terms of the process of the present invention, each- Self-recovery insurance = must have: a drilling procedure, that is, a guide to connect the upper and lower electrode plates with two drilling procedures to form the connection • 'and must be separated by the upper and lower insulation lines Second: In terms of drilling steps, the present invention doubles the processing volume by a factor of two and is more industrially competitive. Therefore, the present invention is submitted in accordance with the law and is filed in accordance with the law. [Brief description of the drawings] (A) The first part A and B of the drawing part are schematic diagrams of forming a lower electrode plate on the copper substrate of the present invention. Figure B: The conductive adhesive material and the copper substrate of the present invention are pressed together. Schematic diagram of the copper foil Schematic diagrams of through holes. Figures 4A and 4B are schematic diagrams of forming the upper layer of the present invention. Figure 5 is a schematic diagram of the self-resetting fuse of the present invention. Figure 6 is a schematic plan view of the conventional self-resetting fuse. The seventh figure: It is a three-dimensional schematic diagram of a conventional self-resetting fuse. (II) Component representative symbol (10) Copper substrate (1 1) Drawing reference hole (1 2) Alignment hole (1 3) Copper contact (21 a ) (21b) The lower electrode plate (3 0) conductive adhesive (4 0) copper foil (50) via hole (60) (61) insulation protection layer (71) (72) via hole (73) insulated wire ( 7 4) Lower insulated wire