SU606898A1 - Composition for copper-plating of titanium and its alloys - Google Patents
Composition for copper-plating of titanium and its alloysInfo
- Publication number
- SU606898A1 SU606898A1 SU762405922A SU2405922A SU606898A1 SU 606898 A1 SU606898 A1 SU 606898A1 SU 762405922 A SU762405922 A SU 762405922A SU 2405922 A SU2405922 A SU 2405922A SU 606898 A1 SU606898 A1 SU 606898A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- composition
- alloys
- plating
- titanium
- copper
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title description 4
- 239000000956 alloy Substances 0.000 title description 2
- 229910045601 alloy Inorganic materials 0.000 title description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- 229910052719 titanium Inorganic materials 0.000 title 1
- 239000010936 titanium Substances 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000011253 protective coating Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Coating With Molten Metal (AREA)
Description
(54) СОСТАВ ДЛЯ МЕДНЕНИЯ ТИТАНА И ЕГО СПЛАВОВ(54) COMPOSITION FOR TREATMENT AND TIN OF ALLOYS
как в примере 1. Д1Ш1ый состав вл етс (М1тимальным .as in example 1. The D1B1 composition is (minimum).
Образующеес в процессе насыщени покрытие имеет толщину 5-10 мкм и обладает хорошими технологическими св(н1ствами.The coating formed during the saturation process is 5–10 µm thick and has good technological properties.
Предлагаемь состав позвол ет интенсифищровать процесс насыщени в семь раз.The proposed composition allows to intensify the saturation process seven times.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU762405922A SU606898A1 (en) | 1976-09-21 | 1976-09-21 | Composition for copper-plating of titanium and its alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU762405922A SU606898A1 (en) | 1976-09-21 | 1976-09-21 | Composition for copper-plating of titanium and its alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU606898A1 true SU606898A1 (en) | 1978-05-15 |
Family
ID=20677547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU762405922A SU606898A1 (en) | 1976-09-21 | 1976-09-21 | Composition for copper-plating of titanium and its alloys |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU606898A1 (en) |
-
1976
- 1976-09-21 SU SU762405922A patent/SU606898A1/en active
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