SU497359A1 - Solution for chemical copper plating dielectrics - Google Patents

Description

de R H or CHZ,. This difference provides copper deposition rates more than once. increase in seawater, g / l: than in dvuharnokisla copper According to the invention, the process of chemical copper plating is carried out in solution containing 15 (pentahydrate) 12-14 Nickel chloride (hexahydrate) Potassium tartrate sodium Sodium hydroxide Formalin (37-40%) 45 -50 (ml / l) Modified phenol-formaldehyde resin HRV (0.5-0.8% solution in hydroxide 3-10 (ml / l) ammonium) at room temperature and pH 12.4-12.6. The solution is stable in operation for 4 days without adjustment and more than 30 days - when adjusting for the main components and pH. The resulting copper coatings, dense, solid, uniform in thickness (0.6-0.7 µm), have an insignificant porosity, a sufficiently strong adhesion to the base (120-1E5 kgf / cm). The invention can be used in the electrical and radio engineering industry, in instrument making in the manufacture of metallized plastic, glass and ceramic products. Example. Samples of impact-resistant polystyrene 40X70X3 mm are etched in a saturated solution of chromic anhydride in 85% sulfuric acid at a temperature of 50-60 ° C for 10-il5 minutes. Sensitize in a solution containing 40 g / l of tin dichloride and 40 g / l of concentrated hydrochloric acid at room temperature for 3-5 minutes. Next, the samples are activated in a solution containing 0.25 g / l of palladium chloride and 20 ml / l of concentrated hydrochloric acid at room temperature for 3-b min. The prepared samples are immersed in a solution of chemical copper, obtained by mixing solutions containing, g / l: A) Copper sulfate 28 Nickel chloride B) Potassium tartrate sodium 45 Sodium hydroxide 10 B) Formalin (37%) 100 (ml / l) D ) 0.5% solution of the modified HRV resin in a 25% solution of ammonium hydroxide 5 (ml / l). Before copper plating, the solutions are mixed in the ratio A: B: C 1: 2: 1, the pH is adjusted to 12.4-12, 6 by adding a concentrated solution of sodium hydroxide, after the first batch of parts has been plunged, solution G is added. going on for 10 minutes on a plate formed dense, continuous coating weight of 0.006 g (known in the solution in the same conditions by weight of the resulting coating is 0.0025 g). Subject of the Invention Solution for chemical copper plating of dielectrics containing copper sulphate, nickel chloride, potassium tartaric acid, sodium hydroxide, formalin and stabilizer, characterized in that, in order to increase the copper deposition rate, it contains a modified enol formaldehyde resin with Ratio of components, g / l: Copper sulfate 12–12 Nickel chloride 3–4 Potassium tartrate 45–50 Sodium hydroxide 7–10 Formalin (37–40%) 45–50 (ml / l) Modified phenol formaldehyde resin (0 , 5-0,8% solution in ammonium hydroxide) 3-10 (ml / l)