SU1762425A1 - Process of deposition of current-conducting coat of sulfide of copper on dielectric substrate - Google Patents
Process of deposition of current-conducting coat of sulfide of copper on dielectric substrate Download PDFInfo
- Publication number
- SU1762425A1 SU1762425A1 SU914915732A SU4915732A SU1762425A1 SU 1762425 A1 SU1762425 A1 SU 1762425A1 SU 914915732 A SU914915732 A SU 914915732A SU 4915732 A SU4915732 A SU 4915732A SU 1762425 A1 SU1762425 A1 SU 1762425A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solution
- coating
- dielectric substrate
- forming substance
- copper
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 title claims description 3
- 238000000034 method Methods 0.000 title abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 4
- 229910052802 copper Inorganic materials 0.000 title description 4
- 239000010949 copper Substances 0.000 title description 4
- 230000008021 deposition Effects 0.000 title description 2
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract description 8
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 claims abstract description 4
- 229920001021 polysulfide Polymers 0.000 claims abstract description 4
- 239000005077 polysulfide Substances 0.000 claims abstract description 4
- 150000008117 polysulfides Polymers 0.000 claims abstract description 4
- 235000010289 potassium nitrite Nutrition 0.000 claims abstract description 4
- 239000004304 potassium nitrite Substances 0.000 claims abstract description 4
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims abstract description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract 2
- 150000001340 alkali metals Chemical class 0.000 claims abstract 2
- 229910052740 iodine Inorganic materials 0.000 claims abstract 2
- 239000011630 iodine Substances 0.000 claims abstract 2
- 239000000243 solution Substances 0.000 claims description 12
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 2
- 239000012266 salt solution Substances 0.000 claims 1
- 238000001465 metallisation Methods 0.000 abstract description 4
- 239000003989 dielectric material Substances 0.000 abstract description 3
- 239000011152 fibreglass Substances 0.000 abstract description 3
- 239000011888 foil Substances 0.000 abstract description 2
- 150000001879 copper Chemical class 0.000 abstract 1
- 239000003365 glass fiber Substances 0.000 abstract 1
- 239000012799 electrically-conductive coating Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical compound [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 description 2
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 2
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910000318 alkali metal phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-N sodium polysulfide Chemical compound [Na+].S HYHCSLBZRBJJCH-UHFFFAOYSA-N 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Использование: радиоэлектронна промышленность , приборостроение и вычислительна техника дл металлизации отверстий печатных схем на основе одно- и двух- стороннегофольгированного стеклотекстолита и других диэлектриков. Сущность изобретени : диэлектрическую подложку из стеклотекстолитэ последовательно обрабатывают в растворе соли одновалентной меди, в растворе структуроформирующего вещества и в растворе полисульфидов щелочного металла, причем в качестве структуроформирующего вещества используют 0,0025-0.025 М раствор персульфата кали или йода или нитрита кали . Способ обеспечивает увеличение электропроводности покрыти . 1 таблUse: electronic industry, instrumentation and computer technology for the metallization of the holes of printed circuits based on single and double sided foil fiberglass and other dielectrics. SUMMARY OF THE INVENTION: A glass fiber textolite dielectric substrate is successively treated in a solution of monovalent copper salt, in a solution of a structure-forming substance and in an alkali metal polysulfide solution, with a 0.0025-0.025 M solution of potassium persulfate or iodine or potassium nitrite being used as a structure-forming substance. The method provides an increase in the electrical conductivity of the coating. 1 tab
Description
Изобретение относитс к модификации свойств диэлектрических материалов и может быть использовано в радиоэлектронной промышленности, приборостроении и вычислительной технике дл металлизации отверстий печатных схем на основе одно- и двухстороннего фольгировэнного стеклотекстолита и других диэлектриков.The invention relates to the modification of the properties of dielectric materials and can be used in the electronics industry, instrument engineering and computer technology for the metallization of the holes of printed circuits based on single- and double-sided foil fiberglass and other dielectrics.
Электропровод щее покрытие сульфида меди широко примен етс в промышленности в качестве подсло при декоративной гальванической металлизации пластмасс. В этом случае важнейшими характеристиками сульфидного покрыти вл етс ее электропроводность и компактность.The conductive copper sulphide coating is widely used in industry as a sublayer for decorative galvanic metallization of plastics. In this case, the most important characteristics of the sulfide coating is its electrical conductivity and compactness.
Однако, известные способы нанесени электропровод щих покрытий сульфида меди при их использовании в техпроцессах металлизации отверстий печатных схем не обеспечивают полного покрыти сквозныхHowever, the known methods for applying the electrically conductive coatings of copper sulfide, when used in the metallization processes of the holes of printed circuits, do not provide complete coverage of the through holes.
отверстий из-за недостаточной их электропроводности .holes due to their lack of electrical conductivity.
Наиболее близким по технической сущности к изобретению вл етс способ получени электропроводного покрыти , согласно которому поверхность диэлектрика после обработки раствором одновалентной меди дополнительно обрабатывают водным раствором одно-, двух- или трехза- мещенного фосфата щелочного металла или аммони , а затем раствором полисульфидов . Обработка в растворе Фосфатов позвол ет получать гладкое, однородное электропроводное покрытие и тем самым обеспечить высокую декоративность гальванопокрыти . Однако, полученное этим спо - собом покрытие не обеспечивает полного покрыти отверстий печатных схем при осаждении гальванопокрыти .The closest to the technical essence of the invention is a method for producing an electrically conductive coating, according to which the surface of a dielectric after treatment with monovalent copper is further treated with an aqueous solution of one-, two-, or three-substituted alkali metal phosphate or ammonium, and then a solution of polysulfides. The treatment in the Phosphate solution allows to obtain a smooth, homogeneous electrically conductive coating and thereby to ensure a high decorative effect of electroplating. However, the coating obtained by this method does not completely cover the openings of printed circuits during the deposition of electroplating.
ю Yu
Целью изобретении вл етс улучшение покрытий отверстий печатных схем путем увеличени электропроводности покрыти .The aim of the invention is to improve the coatings of the openings of printed circuits by increasing the conductivity of the coating.
Поставленна цель достигаетс тем, что в способе получени электропровод щего покрыти , включающем обработку в растворе одновалентной меди, затем в водном растворе структуроформмрующего вещества промывку и оЬработку в растворе полисульфидов, в качестве структуроформи- рующего вещества используют водный 0,0025-0,025 М раствор персульфата кали , или йода, или нитрита кали .The goal is achieved by the fact that in the method of producing an electrically conductive coating, which includes treatment in a solution of monovalent copper, then in an aqueous solution of a structure-forming substance, washing and processing in a solution of polysulfides, aqueous 0.0025-0.025 M potassium persulfate solution is used as a structure-forming substance. , or iodine, or potassium nitrite.
Изобретение реализуетс следующим образом:1) образцы в течение 30 с обрабатывают в растворе состава (М): CuSCMSHaQ - 0,4 аммиак - 0,8 (до ,8) и металлическа медь в виде пластинки (-4дм /л); 2) на 5-30 с окунают в водный 0,0025-0,025 М раствор персульфата кали , или йода, или нитрита кали и промывают водой; 3) в течение 15-30 с обрабатывают в 0,005 М растворе полисульфидов натри и промывай водой. Операции провод тс при комнатной температуре и повтор ютс 2 раза.The invention is implemented as follows: 1) samples are treated for 30 seconds in a solution of the composition (M): CuSCMSHaQ — 0.4 ammonia — 0.8 (up to, 8) and metallic copper in the form of a plate (-4 dm / l); 2) for 5-30 s they are dipped into an aqueous 0.0025-0.025 M solution of potassium persulfate, or iodine, or potassium nitrite and washed with water; 3) for 15-30 seconds, they are treated in a 0.005 M solution of sodium polysulfide and washed with water. The operations are carried out at room temperature and are repeated 2 times.
Обработка раствором структуро- сЬоомирующего веш, способствует по- Ропиению электропроводности покрыти сульфида меди, что позвол ет достичь полного покрыти отверстий печатных схем гальванопокрытием.Processing with a solution of structure-homing vesh helps to protect the electrical conductivity of the copper sulphide coating, which makes it possible to achieve complete coverage of the openings of printed circuits by electroplating.
Положительное действие обработки в ргствооах структуроформирующего вещества , по-видимому, св зано с образованием более толстей и компактной (повышенной мелкокристалличности) пленки, котора по сравнению с пленкой прототипа обладает лучшей электропроводностью.The positive effect of the treatment in the pgstvioha structure-forming substances, apparently, is associated with the formation of a thicker and more compact (high crystallinity) film, which has better electrical conductivity compared to the film of the prototype.
Электропроводность оценивали по электросопротивлению покрыти , ограниченного квадратом, сторона которого равн лась 1 cts и измер ли на плоской поверхности стеклотекстолита.The electrical conductivity was estimated from the electrical resistance of the coating, bounded by a square, the side of which was equal to 1 cts, and measured on the flat surface of the fiberglass laminate.
Количество осажденного сульфида меди оценивали по количеству серы на поверхности диэлектрика, которое измер ли методом радиоактивных индикаторов с применением изотопа S .The amount of precipitated copper sulfide was estimated by the amount of sulfur on the surface of the dielectric, which was measured by the method of radioactive indicators using the S isotope.
Результаты экспериментальной проверки за вл емого изобретени представлены в таблице. Они свидетельствуют о следующем.The results of experimental verification of the claimed invention are presented in the table. They indicate the following.
1. Обработка поверхности диэлектрика1. Surface treatment dielectric
в растворах предлагаемых структуроформи- рующих веществ повышает электропроводность покрыти по сравнению с прототипом до 3-6 раз.in solutions of the proposed structure-forming substances, increases the electrical conductivity of the coating, as compared with the prototype, by up to 3-6 times.
2. Предлагаемый способ получени электропровод щего покрыти обеспечивает полное покрытие отверстий печатных схем.2. The proposed method for producing an electrically conductive coating provides complete coverage of the openings of printed circuits.
3.Положительный эффект достигаетс только при определенных концентраци х,3. A positive effect is achieved only at certain concentrations,
за пределами которых покрытие не отличаетс повышенной электропроводностью.beyond which the coating does not differ in increased electrical conductivity.
4.Электропровод щее покрытие, полученное по предлагаемому способу, вл етс 4. The electroconductive coating obtained by the proposed method is
более толстым по сравнению с прототипом, на что указывают данные радиометрических измерений, и более равномерным, на что указывают меньшие разброс этих данных.thicker than the prototype, as indicated by radiometric measurement data, and more uniform, as indicated by the smaller scatter of these data.
30thirty
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU914915732A SU1762425A1 (en) | 1991-01-22 | 1991-01-22 | Process of deposition of current-conducting coat of sulfide of copper on dielectric substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU914915732A SU1762425A1 (en) | 1991-01-22 | 1991-01-22 | Process of deposition of current-conducting coat of sulfide of copper on dielectric substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU1762425A1 true SU1762425A1 (en) | 1992-09-15 |
Family
ID=21563016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU914915732A SU1762425A1 (en) | 1991-01-22 | 1991-01-22 | Process of deposition of current-conducting coat of sulfide of copper on dielectric substrate |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU1762425A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| LT4713B (en) | 1998-11-13 | 2000-10-25 | Enthone-Omi Inc. | Process for obtaining electrical conductive coating on dielectric surface |
| LT4806B (en) | 1999-10-19 | 2001-06-25 | Enthone-Omi Inc. | Process for obtaining electrical conductive coatings on dielectric surface |
| US6887561B2 (en) | 2000-07-20 | 2005-05-03 | Shipley Company, L.L.C. | Methods and producing conductor layers on dielectric surfaces |
| RU2337603C2 (en) * | 2005-12-19 | 2008-11-10 | Самсунг Гуангджу Электроникс Ко., Лтд. | Compact robot-vacuum cleaner |
-
1991
- 1991-01-22 SU SU914915732A patent/SU1762425A1/en active
Non-Patent Citations (1)
| Title |
|---|
| Авторское свидетельство СССР № 980858,80505/12, 1982. Авторское свидетельство СССР № 1343616. 805 D 5/12, 1987. * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| LT4713B (en) | 1998-11-13 | 2000-10-25 | Enthone-Omi Inc. | Process for obtaining electrical conductive coating on dielectric surface |
| LT4806B (en) | 1999-10-19 | 2001-06-25 | Enthone-Omi Inc. | Process for obtaining electrical conductive coatings on dielectric surface |
| US6887561B2 (en) | 2000-07-20 | 2005-05-03 | Shipley Company, L.L.C. | Methods and producing conductor layers on dielectric surfaces |
| RU2337603C2 (en) * | 2005-12-19 | 2008-11-10 | Самсунг Гуангджу Электроникс Ко., Лтд. | Compact robot-vacuum cleaner |
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