SU1028694A1 - Polymeric composition - Google Patents

Abstract

POLYMER COMPOSITION, including polyamide and organosilicon compound, is different from a and with the fact that, in order to increase the service life of the products, it as the organosilicon compound1} and it contains diphenylsilanediol in the following ratio of components, weight.ch .: 100 5-2.0 Diphenylsilanediol

Description

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: about 4; The invention relates to the production of polymeric 1 polyamide-based compounds and can be used in the manufacture of products for the textile industry, operating under conditions of intense dry friction, elevated temperatures and dynamic impact loads. The heat-resistant polymer composition is known, which contains a polyamide and p, rf-dioxo-diphenyl or p, p-dioxyquaterphenyl. However, tests show that after holding for 8 hours, it retains 80–85% of the strength of Cl. Closest to the proposed technical essence and the achieved result is the polymer composition, including polyamide and the organosilicon compound dimethyl-di- {phenylaminophenoxy) -yylan 2. The disadvantage of the known composition is the instability of the material during operation. The purpose of the invention is to increase the service life of products. This goal is achieved by the fact that the position including polyamide and organosilicon compound, as the organosilicon compound, contains diphenylsilanediol with the following ratio of components, mAh Polyamide Diphenylsilanediol O, 5-2; О Example. Polyamide-b mixed in a ball mill with diphenylsilanediol. The resulting mixture is loaded into the hopper of the injection molding machine, final homogenization is achieved in the wormhole zone of the thermoplastic automat. For testing, preparing the composition of the composition presented in Table. 1. From the resulting compositions are cast standard samples. For comparison, a control composition was prepared with a known modifier (7). The test results are shown in Table. 2, As can be seen from table 2; The use of diphenylenediol diol allows to increase thermostability, compositions, and the modifier content (examples 1-6) deviates from the first limits. It is not advisable: when the content of diphenylsipanediol is less than 0.5 mph. increase in thermal stability is very slight; an increase in the amount of modifier over 2.0 mph. no longer affects thermostability. To evaluate the performance properties of the composition, we made an experimental batch of products (gear-electrons) working under dry friction conditions, alternating loads and temperatures within 60-8 ° C. The resulting composition had an average service life of 3000 machine tools (for a well-known composition 2000 machine hours), which is 1.5 times longer than the service life of products from a known composition .. The economic effect from the introduction of products from the resulting composition is approximately 243.2 thousand rubles. in year.

.., The amount of diphenylsilanediol, wt.

Composition Polyamide-6 + diphenylsilanediol, 25 0.5

Table 1 1.0 1.5 2.0 3.0 strength | after the display at 81-83 85-87 87-90 Ultimate temnepatypa eks61-62 68-70 69-73 tweet ,, grad

Table 2 87-9187-91 87-91 79-81 69-73 71-7572-76 60

Claims (1)

A POLYMERIC COMPOSITION comprising a polyamide and a silicon-organic compound, characterized in that, in order to increase the service life of the products, it contains diphenylsilanediol as an organosilicon compound in the following ratio of components, parts by weight: Polyamide 100 ► Diphenylsilanediol 0.5-2.0