SI1199740T1 - Postopek za susenje silicijevih substratov - Google Patents
Postopek za susenje silicijevih substratovInfo
- Publication number
- SI1199740T1 SI1199740T1 SI9630728T SI9630728T SI1199740T1 SI 1199740 T1 SI1199740 T1 SI 1199740T1 SI 9630728 T SI9630728 T SI 9630728T SI 9630728 T SI9630728 T SI 9630728T SI 1199740 T1 SI1199740 T1 SI 1199740T1
- Authority
- SI
- Slovenia
- Prior art keywords
- substrate
- bath
- liquid
- drying
- silcion
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 11
- 238000001035 drying Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000007788 liquid Substances 0.000 abstract 7
- 238000007598 dipping method Methods 0.000 abstract 1
- 230000005660 hydrophilic surface Effects 0.000 abstract 1
- 230000002209 hydrophobic effect Effects 0.000 abstract 1
- 230000005661 hydrophobic surface Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
- Silicon Compounds (AREA)
- Detergent Compositions (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Inorganic Insulating Materials (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19531031A DE19531031C2 (de) | 1995-08-23 | 1995-08-23 | Verfahren zum Trocknen von Silizium |
| EP01130669A EP1199740B1 (en) | 1995-08-23 | 1996-08-09 | A method of drying silcion substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SI1199740T1 true SI1199740T1 (sl) | 2006-06-30 |
Family
ID=7770207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SI9630728T SI1199740T1 (sl) | 1995-08-23 | 1996-08-09 | Postopek za susenje silicijevih substratov |
Country Status (24)
| Country | Link |
|---|---|
| EP (2) | EP1199740B1 (sl) |
| JP (1) | JP3857314B2 (sl) |
| KR (1) | KR19990037642A (sl) |
| CN (1) | CN1091542C (sl) |
| AT (2) | ATE227885T1 (sl) |
| AU (1) | AU697397B2 (sl) |
| CA (1) | CA2228168A1 (sl) |
| CZ (1) | CZ291335B6 (sl) |
| DE (3) | DE19531031C2 (sl) |
| DK (2) | DK1199740T3 (sl) |
| ES (2) | ES2186800T3 (sl) |
| HK (1) | HK1043661B (sl) |
| HU (1) | HUP9802482A3 (sl) |
| IL (1) | IL123042A (sl) |
| MX (1) | MX9801464A (sl) |
| NO (1) | NO980734L (sl) |
| PL (1) | PL183355B1 (sl) |
| PT (1) | PT846334E (sl) |
| RU (1) | RU2141700C1 (sl) |
| SI (1) | SI1199740T1 (sl) |
| SK (1) | SK284835B6 (sl) |
| TW (1) | TW427952B (sl) |
| UA (1) | UA51663C2 (sl) |
| WO (1) | WO1997008742A1 (sl) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19613620C2 (de) | 1996-04-04 | 1998-04-16 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Trocknen von Substraten |
| DE19800584C2 (de) * | 1998-01-09 | 2002-06-20 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Trocknen von Substraten |
| DE19833257C1 (de) * | 1998-07-23 | 1999-09-30 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Halbleiterscheibe |
| DE19927457C2 (de) * | 1999-06-16 | 2002-06-13 | Wacker Siltronic Halbleitermat | Verwendung eines bekannten Verfahrens als Vorbehandlung zur Bestimmung der Diffusionslängen von Minoritätsträgern in einer Halbleiterscheibe |
| DE10036691A1 (de) * | 2000-07-27 | 2002-02-14 | Wacker Siltronic Halbleitermat | Verfahren zur chemischen Behandlung von Halbleiterscheiben |
| DE10064081C2 (de) * | 2000-12-21 | 2002-06-06 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Halbleiterscheibe |
| DE10360269A1 (de) * | 2003-12-17 | 2005-07-28 | Friedrich-Schiller-Universität Jena | Verfahren zur schnellen Mischung von kleinvolumigen Flüssigkeiten und Kit zu dessen Anwendung |
| WO2006066115A2 (en) | 2004-12-17 | 2006-06-22 | The Procter & Gamble Company | Process for extracting liquid from a fabric |
| KR100897581B1 (ko) | 2007-11-14 | 2009-05-14 | 주식회사 실트론 | 웨이퍼 건조 방법 |
| RU2486287C2 (ru) * | 2011-04-29 | 2013-06-27 | Антон Викторович Мантузов | Способ очистки поверхности полупроводниковых пластин и регенерации травильных растворов |
| CN114993028B (zh) * | 2022-06-17 | 2023-05-30 | 高景太阳能股份有限公司 | 一种硅片烘干处理方法及系统 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2722783A1 (de) * | 1977-05-20 | 1978-11-30 | Wacker Chemitronic | Verfahren zum reinigen von silicium |
| US4169807A (en) * | 1978-03-20 | 1979-10-02 | Rca Corporation | Novel solvent drying agent |
| DE3317286A1 (de) * | 1983-05-11 | 1984-11-22 | Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen | Verfahren zur reinigung von silicium durch saeureeinwirkung |
| FR2591324B1 (fr) * | 1985-12-10 | 1989-02-17 | Recif Sa | Appareil pour le sechage unitaire des plaquettes de silicium par centrifugation |
| JPS62198127A (ja) * | 1986-02-25 | 1987-09-01 | Sanyo Electric Co Ltd | 半導体ウエハの洗浄方法 |
| US4722752A (en) * | 1986-06-16 | 1988-02-02 | Robert F. Orr | Apparatus and method for rinsing and drying silicon wafers |
| US4902350A (en) * | 1987-09-09 | 1990-02-20 | Robert F. Orr | Method for rinsing, cleaning and drying silicon wafers |
| NL8900480A (nl) * | 1989-02-27 | 1990-09-17 | Philips Nv | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
| JPH0366126A (ja) * | 1989-08-04 | 1991-03-20 | Sharp Corp | 絶縁膜の製造方法及びその製造装置 |
| JPH0466175A (ja) * | 1990-07-03 | 1992-03-02 | Seiko Epson Corp | 水切り乾燥方法 |
| JPH04346431A (ja) * | 1991-05-24 | 1992-12-02 | Mitsubishi Electric Corp | 半導体シリコンウェハの洗浄装置 |
| JPH09503099A (ja) * | 1993-09-22 | 1997-03-25 | レガシー システムズ インコーポレイテッド | 流体中の半導体ウエハを処理するプロセスおよび装置 |
-
1995
- 1995-08-23 DE DE19531031A patent/DE19531031C2/de not_active Expired - Fee Related
-
1996
- 1996-08-09 PT PT96929234T patent/PT846334E/pt unknown
- 1996-08-09 SI SI9630728T patent/SI1199740T1/sl unknown
- 1996-08-09 WO PCT/EP1996/003541 patent/WO1997008742A1/en not_active Ceased
- 1996-08-09 EP EP01130669A patent/EP1199740B1/en not_active Expired - Lifetime
- 1996-08-09 AT AT96929234T patent/ATE227885T1/de active
- 1996-08-09 DE DE69624830T patent/DE69624830T2/de not_active Expired - Lifetime
- 1996-08-09 DK DK01130669T patent/DK1199740T3/da active
- 1996-08-09 PL PL96325121A patent/PL183355B1/pl not_active IP Right Cessation
- 1996-08-09 AT AT01130669T patent/ATE309613T1/de active
- 1996-08-09 DE DE69635427T patent/DE69635427T2/de not_active Expired - Lifetime
- 1996-08-09 IL IL12304296A patent/IL123042A/en not_active IP Right Cessation
- 1996-08-09 AU AU68720/96A patent/AU697397B2/en not_active Ceased
- 1996-08-09 ES ES96929234T patent/ES2186800T3/es not_active Expired - Lifetime
- 1996-08-09 JP JP50977197A patent/JP3857314B2/ja not_active Expired - Fee Related
- 1996-08-09 CN CN96196222A patent/CN1091542C/zh not_active Expired - Fee Related
- 1996-08-09 SK SK212-98A patent/SK284835B6/sk unknown
- 1996-08-09 DK DK96929234T patent/DK0846334T3/da active
- 1996-08-09 KR KR1019980701119A patent/KR19990037642A/ko not_active Ceased
- 1996-08-09 HU HU9802482A patent/HUP9802482A3/hu unknown
- 1996-08-09 RU RU98104458A patent/RU2141700C1/ru not_active IP Right Cessation
- 1996-08-09 EP EP96929234A patent/EP0846334B1/en not_active Expired - Lifetime
- 1996-08-09 CZ CZ1998517A patent/CZ291335B6/cs not_active IP Right Cessation
- 1996-08-09 CA CA002228168A patent/CA2228168A1/en not_active Abandoned
- 1996-08-09 ES ES01130669T patent/ES2250292T3/es not_active Expired - Lifetime
- 1996-08-20 TW TW085110167A patent/TW427952B/zh not_active IP Right Cessation
- 1996-09-08 UA UA98020935A patent/UA51663C2/uk unknown
-
1998
- 1998-02-20 NO NO980734A patent/NO980734L/no unknown
- 1998-02-23 MX MX9801464A patent/MX9801464A/es not_active IP Right Cessation
- 1998-10-14 HK HK02104685.0A patent/HK1043661B/en not_active IP Right Cessation
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