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SG84536A1 - Plating method of hard disk substrate - Google Patents

Plating method of hard disk substrate

Info

Publication number
SG84536A1
SG84536A1 SG9903433A SG1999003433A SG84536A1 SG 84536 A1 SG84536 A1 SG 84536A1 SG 9903433 A SG9903433 A SG 9903433A SG 1999003433 A SG1999003433 A SG 1999003433A SG 84536 A1 SG84536 A1 SG 84536A1
Authority
SG
Singapore
Prior art keywords
hard disk
plating method
disk substrate
substrate
plating
Prior art date
Application number
SG9903433A
Inventor
Saito Masahiro
Nakayama Ikuo
Tada Masanori
Shimizu Koichiro
Original Assignee
Uyemura C & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uyemura C & Co Ltd filed Critical Uyemura C & Co Ltd
Publication of SG84536A1 publication Critical patent/SG84536A1/en

Links

SG9903433A 1998-09-18 1999-06-25 Plating method of hard disk substrate SG84536A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10263829A JP2000096252A (en) 1998-09-18 1998-09-18 Plating method for hard disk substrate

Publications (1)

Publication Number Publication Date
SG84536A1 true SG84536A1 (en) 2001-11-20

Family

ID=17394811

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9903433A SG84536A1 (en) 1998-09-18 1999-06-25 Plating method of hard disk substrate

Country Status (3)

Country Link
JP (1) JP2000096252A (en)
MY (1) MY9904042A (en)
SG (1) SG84536A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4600623B2 (en) * 2001-02-16 2010-12-15 上村工業株式会社 Method for forming electroless zinc oxide film
JP2003064479A (en) * 2001-08-22 2003-03-05 Sony Corp Pretreatment method for electroless plating
JP5327494B2 (en) * 2005-11-16 2013-10-30 日立化成株式会社 Method for producing catalyst concentrate for electroless plating and method for applying plating catalyst using the same
JP4975344B2 (en) * 2006-03-15 2012-07-11 大和電機工業株式会社 Plating method
JP5288362B2 (en) * 2007-01-17 2013-09-11 奥野製薬工業株式会社 Multilayer plating film and printed wiring board
JP2008255460A (en) * 2007-04-09 2008-10-23 Rohm & Haas Electronic Materials Llc Electroless plating treatment method of polyimide resin
JP5481700B2 (en) * 2008-09-03 2014-04-23 奥野製薬工業株式会社 Activation solution for electroless plating
FR2950062B1 (en) * 2009-09-11 2012-08-03 Alchimer SOLUTION AND METHOD FOR ACTIVATING THE SURFACE OF A SEMICONDUCTOR SUBSTRATE
FR2950633B1 (en) * 2009-09-30 2011-11-25 Alchimer SOLUTION AND METHOD FOR ACTIVATION OF THE OXIDIZED SURFACE OF A SEMICONDUCTOR SUBSTRATE
CN114108046A (en) * 2021-12-20 2022-03-01 厦门华天华电子有限公司 Method for eliminating pits on FPC (Flexible printed Circuit) coating surface

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940512A (en) * 1971-01-25 1976-02-24 E. I. Du Pont De Nemours And Company Method and apparatus for concomitant particulate deposition in electroless plating, and the product thereof
US4180480A (en) * 1975-10-15 1979-12-25 Mcgean Chemical Company, Inc. Catalytically active compositions from precious metal complexes
US4259409A (en) * 1980-03-06 1981-03-31 Ses, Incorporated Electroless plating process for glass or ceramic bodies and product
US4581256A (en) * 1984-11-19 1986-04-08 Chemline Industries Electroless plating composition and method of use
US4661384A (en) * 1984-06-29 1987-04-28 Bayer Aktiengesellschaft Process for activating substrate surfaces for electroless metallization
US5348574A (en) * 1993-07-02 1994-09-20 Monsanto Company Metal-coated polyimide
US5405656A (en) * 1990-04-02 1995-04-11 Nippondenso Co., Ltd. Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor
US5543182A (en) * 1993-03-18 1996-08-06 Atotech Usa, Inc. Self-accelerating and replenishing non-formaldehyde immersion coating method
US5753304A (en) * 1997-06-23 1998-05-19 The Metal Arts Company, Inc. Activation bath for electroless nickel plating

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940512A (en) * 1971-01-25 1976-02-24 E. I. Du Pont De Nemours And Company Method and apparatus for concomitant particulate deposition in electroless plating, and the product thereof
US4180480A (en) * 1975-10-15 1979-12-25 Mcgean Chemical Company, Inc. Catalytically active compositions from precious metal complexes
US4259409A (en) * 1980-03-06 1981-03-31 Ses, Incorporated Electroless plating process for glass or ceramic bodies and product
US4661384A (en) * 1984-06-29 1987-04-28 Bayer Aktiengesellschaft Process for activating substrate surfaces for electroless metallization
US4581256A (en) * 1984-11-19 1986-04-08 Chemline Industries Electroless plating composition and method of use
US5405656A (en) * 1990-04-02 1995-04-11 Nippondenso Co., Ltd. Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor
US5543182A (en) * 1993-03-18 1996-08-06 Atotech Usa, Inc. Self-accelerating and replenishing non-formaldehyde immersion coating method
US5348574A (en) * 1993-07-02 1994-09-20 Monsanto Company Metal-coated polyimide
US5753304A (en) * 1997-06-23 1998-05-19 The Metal Arts Company, Inc. Activation bath for electroless nickel plating

Also Published As

Publication number Publication date
JP2000096252A (en) 2000-04-04
MY9904042A (en) 2007-06-29

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