SG163506A1 - Controlled electrochemical polishing method - Google Patents
Controlled electrochemical polishing methodInfo
- Publication number
- SG163506A1 SG163506A1 SG201004136-6A SG2010041366A SG163506A1 SG 163506 A1 SG163506 A1 SG 163506A1 SG 2010041366 A SG2010041366 A SG 2010041366A SG 163506 A1 SG163506 A1 SG 163506A1
- Authority
- SG
- Singapore
- Prior art keywords
- polishing method
- electrochemical polishing
- controlled electrochemical
- substrate
- controlled
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
- H01L21/32125—Planarisation by chemical mechanical polishing [CMP] by simultaneously passing an electrical current, i.e. electrochemical mechanical polishing, e.g. ECMP
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/150,944 US7998335B2 (en) | 2005-06-13 | 2005-06-13 | Controlled electrochemical polishing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG163506A1 true SG163506A1 (en) | 2010-08-30 |
Family
ID=37036861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG201004136-6A SG163506A1 (en) | 2005-06-13 | 2006-06-06 | Controlled electrochemical polishing method |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7998335B2 (fr) |
| EP (1) | EP1920089A2 (fr) |
| JP (1) | JP5468778B2 (fr) |
| KR (1) | KR101281968B1 (fr) |
| CN (1) | CN101218378A (fr) |
| IL (1) | IL187944A (fr) |
| MY (1) | MY145771A (fr) |
| SG (1) | SG163506A1 (fr) |
| TW (1) | TWI333515B (fr) |
| WO (1) | WO2006138110A2 (fr) |
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| JP3955066B2 (ja) * | 2002-04-03 | 2007-08-08 | 東邦エンジニアリング株式会社 | 研磨パッドと該研磨パッドの製造方法および該研磨パッドを用いた半導体基板の製造方法 |
| JP2003342800A (ja) * | 2002-05-21 | 2003-12-03 | Sony Corp | 研磨方法および研磨装置、並びに半導体装置の製造方法 |
| JP2004172338A (ja) * | 2002-11-20 | 2004-06-17 | Sony Corp | 研磨方法、研磨装置および半導体装置の製造方法 |
| WO2004072332A1 (fr) * | 2003-02-12 | 2004-08-26 | Ebara Corporation | Fluide de polissage, methode de polissage, et appareil de polissage |
| US7241725B2 (en) * | 2003-09-25 | 2007-07-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Barrier polishing fluid |
| JP2004149926A (ja) * | 2003-11-20 | 2004-05-27 | Matsushita Electric Ind Co Ltd | 埋め込み配線の形成方法 |
| US7288021B2 (en) | 2004-01-07 | 2007-10-30 | Cabot Microelectronics Corporation | Chemical-mechanical polishing of metals in an oxidized form |
-
2005
- 2005-06-13 US US11/150,944 patent/US7998335B2/en not_active Expired - Fee Related
-
2006
- 2006-06-06 SG SG201004136-6A patent/SG163506A1/en unknown
- 2006-06-06 CN CNA2006800210234A patent/CN101218378A/zh active Pending
- 2006-06-06 KR KR1020087000814A patent/KR101281968B1/ko not_active Expired - Fee Related
- 2006-06-06 JP JP2008516931A patent/JP5468778B2/ja not_active Expired - Fee Related
- 2006-06-06 EP EP06772263A patent/EP1920089A2/fr not_active Withdrawn
- 2006-06-06 WO PCT/US2006/021887 patent/WO2006138110A2/fr not_active Ceased
- 2006-06-12 MY MYPI20062746A patent/MY145771A/en unknown
- 2006-06-13 TW TW095121035A patent/TWI333515B/zh not_active IP Right Cessation
-
2007
- 2007-12-06 IL IL187944A patent/IL187944A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP5468778B2 (ja) | 2014-04-09 |
| IL187944A0 (en) | 2008-03-20 |
| US7998335B2 (en) | 2011-08-16 |
| EP1920089A2 (fr) | 2008-05-14 |
| US20060281196A1 (en) | 2006-12-14 |
| KR20080021778A (ko) | 2008-03-07 |
| TW200706709A (en) | 2007-02-16 |
| WO2006138110A3 (fr) | 2007-06-07 |
| IL187944A (en) | 2013-02-28 |
| KR101281968B1 (ko) | 2013-07-03 |
| JP2008544523A (ja) | 2008-12-04 |
| WO2006138110A2 (fr) | 2006-12-28 |
| MY145771A (en) | 2012-04-13 |
| TWI333515B (en) | 2010-11-21 |
| CN101218378A (zh) | 2008-07-09 |
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