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SG166670A1 - Stacked die in die bga package - Google Patents

Stacked die in die bga package

Info

Publication number
SG166670A1
SG166670A1 SG200603131-4A SG2006031314A SG166670A1 SG 166670 A1 SG166670 A1 SG 166670A1 SG 2006031314 A SG2006031314 A SG 2006031314A SG 166670 A1 SG166670 A1 SG 166670A1
Authority
SG
Singapore
Prior art keywords
die
bga package
stacked
stacked die
devices
Prior art date
Application number
SG200603131-4A
Inventor
Hock Chuan Tan
Thiam Chye Lim
Victor Cher Khng Tan
Chee Peng Neo
Michael Kian Shing Tan
Beng Chye Chew
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200603131-4A priority Critical patent/SG166670A1/en
Publication of SG166670A1 publication Critical patent/SG166670A1/en

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Abstract

Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
SG200603131-4A 2002-01-09 2002-01-09 Stacked die in die bga package SG166670A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200603131-4A SG166670A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200603131-4A SG166670A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package

Publications (1)

Publication Number Publication Date
SG166670A1 true SG166670A1 (en) 2010-12-29

Family

ID=43859888

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200603131-4A SG166670A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package

Country Status (1)

Country Link
SG (1) SG166670A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804004A (en) * 1992-05-11 1998-09-08 Nchip, Inc. Stacked devices for multichip modules
US6005778A (en) * 1995-06-15 1999-12-21 Honeywell Inc. Chip stacking and capacitor mounting arrangement including spacers
US6084308A (en) * 1998-06-30 2000-07-04 National Semiconductor Corporation Chip-on-chip integrated circuit package and method for making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804004A (en) * 1992-05-11 1998-09-08 Nchip, Inc. Stacked devices for multichip modules
US6005778A (en) * 1995-06-15 1999-12-21 Honeywell Inc. Chip stacking and capacitor mounting arrangement including spacers
US6084308A (en) * 1998-06-30 2000-07-04 National Semiconductor Corporation Chip-on-chip integrated circuit package and method for making the same

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