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SG138516A1 - Substrate transfer apparatus and substrate processing system using the same - Google Patents

Substrate transfer apparatus and substrate processing system using the same

Info

Publication number
SG138516A1
SG138516A1 SG200700948-3A SG2007009483A SG138516A1 SG 138516 A1 SG138516 A1 SG 138516A1 SG 2007009483 A SG2007009483 A SG 2007009483A SG 138516 A1 SG138516 A1 SG 138516A1
Authority
SG
Singapore
Prior art keywords
substrate
blades
transfer apparatus
same
processing system
Prior art date
Application number
SG200700948-3A
Inventor
Sang-Ho Seol
Original Assignee
Psk Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psk Inc filed Critical Psk Inc
Publication of SG138516A1 publication Critical patent/SG138516A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate transfer apparatus includes first and second blades configured for supporting a substrate at different heights, respectively; an arm part connected to the first and second blades to move the first and second blades; and a drive unit configured for driving the first and second blades and the arm part, wherein the first and second blades are folded or unfolded while revolving on the same (single) axis of the arm part. According to the substrate transfer apparatus, a substrate processing throughput increases relative to a system area and time required for transferring and processing a substrate is reduced.
SG200700948-3A 2006-07-04 2007-02-08 Substrate transfer apparatus and substrate processing system using the same SG138516A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060062671A KR20080004118A (en) 2006-07-04 2006-07-04 Substrate processing equipment

Publications (1)

Publication Number Publication Date
SG138516A1 true SG138516A1 (en) 2008-01-28

Family

ID=38919286

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200700948-3A SG138516A1 (en) 2006-07-04 2007-02-08 Substrate transfer apparatus and substrate processing system using the same

Country Status (6)

Country Link
US (1) US20080008569A1 (en)
JP (1) JP2008016815A (en)
KR (1) KR20080004118A (en)
CN (1) CN101101888A (en)
SG (1) SG138516A1 (en)
TW (1) TW200805550A (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101359400B1 (en) * 2006-12-29 2014-02-07 주성엔지니어링(주) Vacuum chamber module for stable robot teaching
US20080175694A1 (en) 2007-01-19 2008-07-24 Dong-Seok Park Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
KR100803559B1 (en) * 2007-05-02 2008-02-15 피에스케이 주식회사 Substrate conveying unit and method, and substrate processing apparatus having the unit and substrate processing method using the unit
JP4703749B2 (en) * 2008-09-17 2011-06-15 株式会社日立国際電気 Substrate processing apparatus and substrate processing method
JP5295095B2 (en) 2008-12-29 2013-09-18 ケー．シー．テック カンパニー リミテッド Atomic layer deposition equipment
JP2010192559A (en) * 2009-02-17 2010-09-02 Tokyo Electron Ltd Substrate processing system
SG170645A1 (en) * 2009-11-02 2011-05-30 Semiconductor Tech & Instr Inc System and method for flexible high speed transfer of semiconductor components
US8562272B2 (en) * 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
KR101212514B1 (en) * 2010-09-15 2012-12-14 주식회사 유진테크 Apparatus for processing substrate and method for transfering substrate
TWI629743B (en) * 2012-02-10 2018-07-11 布魯克斯自動機械公司 Substrate processing equipment
FR2989947B1 (en) * 2012-04-26 2014-05-09 Delachaux Sa CONNECTION SYSTEM FOR CHARGING AN ELECTRIC VEHICLE
KR102214394B1 (en) * 2013-03-15 2021-02-08 어플라이드 머티어리얼스, 인코포레이티드 Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing
KR101530024B1 (en) * 2013-12-20 2015-06-22 주식회사 유진테크 Substrate processing module, substrate processing apparatus and substrate transfering method including the same
JP6293499B2 (en) * 2014-01-27 2018-03-14 株式会社日立ハイテクノロジーズ Vacuum processing equipment
CN106304833A (en) * 2014-05-15 2017-01-04 应用材料公司 Particle removal device and operational approach thereof
TWI677046B (en) * 2015-04-23 2019-11-11 美商應用材料股份有限公司 External substrate rotation in a semiconductor processing system
US10580672B2 (en) * 2016-10-18 2020-03-03 Mattson Technology, Inc. Systems and methods for workpiece processing
US11482434B2 (en) 2016-10-18 2022-10-25 Belting E-Town Semiconductor Technology Co., Ltd Systems and methods for workpiece processing
JP6881010B2 (en) 2017-05-11 2021-06-02 東京エレクトロン株式会社 Vacuum processing equipment
CN109994358B (en) * 2017-12-29 2021-04-27 中微半导体设备(上海)股份有限公司 Plasma processing system and operation method thereof
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
US20200156867A1 (en) * 2018-11-20 2020-05-21 Jiangsu Fine Storage Information Technology Co., L td. Method for taking, placing and conveying materials
CN119725065A (en) 2019-05-14 2025-03-28 玛特森技术公司 End effector and system for handling workpiece
KR102794091B1 (en) 2020-05-29 2025-04-15 주성엔지니어링(주) Processing system equipment and inspecting method the same
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access
WO2025054493A1 (en) * 2023-09-08 2025-03-13 Brooks Automation Us, Llc Compartmental link substrate transport apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4330703B2 (en) * 1999-06-18 2009-09-16 東京エレクトロン株式会社 Transport module and cluster system
US20020061248A1 (en) * 2000-07-07 2002-05-23 Applied Materials, Inc. High productivity semiconductor wafer processing system
JP2002158272A (en) * 2000-11-17 2002-05-31 Tatsumo Kk Double-arm substrate transfer device
JP2002184834A (en) * 2000-12-15 2002-06-28 Yaskawa Electric Corp Substrate transfer robot
WO2003006216A1 (en) * 2001-07-13 2003-01-23 Brooks Automation, Inc. Substrate transport apparatus with multiple independent end effectors
JP2003170384A (en) * 2001-12-04 2003-06-17 Rorze Corp SCARA robot for transporting flat objects and processing system for flat objects
US6737829B2 (en) * 2002-01-18 2004-05-18 Janaki Technologies, Inc. Portable electronic device charger and a method for using the same
JP2004288719A (en) * 2003-03-19 2004-10-14 Tokyo Electron Ltd Substrate carrying system and substrate processing system

Also Published As

Publication number Publication date
KR20080004118A (en) 2008-01-09
JP2008016815A (en) 2008-01-24
US20080008569A1 (en) 2008-01-10
CN101101888A (en) 2008-01-09
TW200805550A (en) 2008-01-16

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