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SG137688A1 - Method of surface texturizing - Google Patents

Method of surface texturizing

Info

Publication number
SG137688A1
SG137688A1 SG200403836-0A SG2004038360A SG137688A1 SG 137688 A1 SG137688 A1 SG 137688A1 SG 2004038360 A SG2004038360 A SG 2004038360A SG 137688 A1 SG137688 A1 SG 137688A1
Authority
SG
Singapore
Prior art keywords
surface texturizing
texturizing
Prior art date
Application number
SG200403836-0A
Inventor
Alan R Popiolkowski
Shannon M Hart
Marc O Schweitzer
Alan B Liu
Jennifer L Watia
Brian West
Mark Menzie
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/622,178 external-priority patent/US6812471B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG137688A1 publication Critical patent/SG137688A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00—Selection of abrasive materials or additives for abrasive blasts
    • B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
SG200403836-0A 2003-07-17 2004-06-30 Method of surface texturizing SG137688A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/622,178 US6812471B2 (en) 2002-03-13 2003-07-17 Method of surface texturizing

Publications (1)

Publication Number Publication Date
SG137688A1 true SG137688A1 (en) 2007-12-28

Family

ID=34216285

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200403836-0A SG137688A1 (en) 2003-07-17 2004-06-30 Method of surface texturizing

Country Status (5)

Country Link
JP (2) JP5575352B2 (en)
KR (1) KR100887218B1 (en)
CN (1) CN100351998C (en)
SG (1) SG137688A1 (en)
TW (1) TWI342582B (en)

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WO2007083363A1 (en) * 2006-01-18 2007-07-26 Mitsubishi Denki Kabushiki Kaisha Method for surface treatment with electron beam and apparatus for surface treatment with electron beam
US20080092806A1 (en) * 2006-10-19 2008-04-24 Applied Materials, Inc. Removing residues from substrate processing components
JP5072398B2 (en) * 2007-03-23 2012-11-14 株式会社アルバック Surface treatment method for welded part of metal member
CN102171786A (en) * 2008-10-03 2011-08-31 应用材料公司 Pre-cleaning and pre-heating of LAVACOAT
DE102010060143A1 (en) * 2009-11-05 2011-06-09 Oerlikon Solar Ag, Trübbach Method for producing vacuum-processing chamber that is utilized in e.g. physical vapor deposition, involves defining volume of vacuum-processing chamber through wall, and smoothing and shot blasting inner surface of wall by grinding
US9371578B2 (en) * 2010-03-29 2016-06-21 Jx Nippon Mining & Metals Corporation Tantalum coil for sputtering and method for processing the coil
JP4763101B1 (en) * 2010-03-29 2011-08-31 Ｊｘ日鉱日石金属株式会社 Tantalum coil for sputtering and processing method of the coil
KR20170100685A (en) * 2014-12-15 2017-09-05 어플라이드 머티어리얼스, 인코포레이티드 Methods for texturing a chamber component and chamber components having a textured surface
KR102467442B1 (en) * 2015-02-06 2022-11-14 어플라이드 머티어리얼스, 인코포레이티드 3D printed chamber components configured for lower film stress and lower operating temperature
US11569069B2 (en) 2015-02-06 2023-01-31 Applied Materials, Inc. 3D printed chamber components configured for lower film stress and lower operating temperature
US9346113B1 (en) * 2015-03-19 2016-05-24 Johnson Technology, Inc. Electrical discharge machining integrated control system
US10434604B2 (en) 2016-10-14 2019-10-08 Applied Materials, Inc. Texturizing a surface without bead blasting
KR102200515B1 (en) * 2017-10-20 2021-01-12 한국생산기술연구원 Cutting Tool and Device for Brazing using Electron Beam and Method for Brazing using Electron Beam
KR20250007702A (en) * 2018-04-17 2025-01-14 어플라이드 머티어리얼스, 인코포레이티드 Texturizing a surface without bead blasting
CN110560870A (en) * 2019-10-17 2019-12-13 太仓束捍机电科技有限公司 L-shaped workpiece placing table of vacuum beam welding machine
US11739411B2 (en) 2019-11-04 2023-08-29 Applied Materials, Inc. Lattice coat surface enhancement for chamber components
KR102439455B1 (en) * 2020-11-13 2022-09-02 한국생산기술연구원 Electron beam processing apparatus and processing method
CN117733305B (en) * 2024-02-20 2024-04-26 四川华束科技有限公司 Sealed-off type electron gun and non-vacuum electron beam welding robot
CN118390060A (en) * 2024-06-27 2024-07-26 艾庞半导体科技(四川)有限公司 Surface treatment method of carrier for semiconductor wafer grinding process

Citations (2)

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WO1998031845A1 (en) * 1997-01-16 1998-07-23 Bottomfield, Layne, F. Vapor deposition components and corresponding methods
WO2001040540A1 (en) * 1999-12-02 2001-06-07 Tegal Corporation Improved reactor with heated and textured electrodes and surfaces

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JP2001230165A (en) 1999-12-08 2001-08-24 Toshiba Corp Semiconductor device and manufacturing method thereof
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031845A1 (en) * 1997-01-16 1998-07-23 Bottomfield, Layne, F. Vapor deposition components and corresponding methods
WO2001040540A1 (en) * 1999-12-02 2001-06-07 Tegal Corporation Improved reactor with heated and textured electrodes and surfaces

Also Published As

Publication number Publication date
CN100351998C (en) 2007-11-28
JP5703262B2 (en) 2015-04-15
CN1577732A (en) 2005-02-09
JP2012245565A (en) 2012-12-13
KR100887218B1 (en) 2009-03-06
KR20050009221A (en) 2005-01-24
TW200504793A (en) 2005-02-01
JP5575352B2 (en) 2014-08-20
TWI342582B (en) 2011-05-21
JP2005039279A (en) 2005-02-10

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