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SG128425A1 - Abrasive, method of polishing target member and process for producing semiconductor device - Google Patents

Abrasive, method of polishing target member and process for producing semiconductor device

Info

Publication number
SG128425A1
SG128425A1 SG200202565A SG200202565A SG128425A1 SG 128425 A1 SG128425 A1 SG 128425A1 SG 200202565 A SG200202565 A SG 200202565A SG 200202565 A SG200202565 A SG 200202565A SG 128425 A1 SG128425 A1 SG 128425A1
Authority
SG
Singapore
Prior art keywords
abrasive
semiconductor device
target member
producing semiconductor
polishing target
Prior art date
Application number
SG200202565A
Other languages
English (en)
Inventor
Masato Yoshida
Toranosuke Ashizawa
Hiroki Terasaki
Yuuto Ootuki
Yasushi Kurata
Jun Matsuzawa
Kiyohito Tanno
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27304106&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG128425(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG128425A1 publication Critical patent/SG128425A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
SG200202565A 1997-12-18 1998-12-18 Abrasive, method of polishing target member and process for producing semiconductor device SG128425A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34924097A JPH11181403A (ja) 1997-12-18 1997-12-18 酸化セリウム研磨剤及び基板の研磨法
JP8304398 1998-03-30
JP8304298 1998-03-30

Publications (1)

Publication Number Publication Date
SG128425A1 true SG128425A1 (en) 2007-01-30

Family

ID=27304106

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200202565A SG128425A1 (en) 1997-12-18 1998-12-18 Abrasive, method of polishing target member and process for producing semiconductor device

Country Status (10)

Country Link
US (7) US6343976B1 (fr)
EP (1) EP1043379A4 (fr)
JP (5) JPH11181403A (fr)
KR (10) KR100403719B1 (fr)
CN (4) CN100567441C (fr)
AU (1) AU1683899A (fr)
CA (2) CA2315057A1 (fr)
SG (1) SG128425A1 (fr)
TW (3) TW577913B (fr)
WO (1) WO1999031195A1 (fr)

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