[go: up one dir, main page]

SG11202008643PA - Laser processing device, laser processing system, and laser processing method - Google Patents

Laser processing device, laser processing system, and laser processing method

Info

Publication number
SG11202008643PA
SG11202008643PA SG11202008643PA SG11202008643PA SG11202008643PA SG 11202008643P A SG11202008643P A SG 11202008643PA SG 11202008643P A SG11202008643P A SG 11202008643PA SG 11202008643P A SG11202008643P A SG 11202008643PA SG 11202008643P A SG11202008643P A SG 11202008643PA
Authority
SG
Singapore
Prior art keywords
laser processing
processing device
processing system
processing method
laser
Prior art date
Application number
SG11202008643PA
Inventor
Hirotoshi Mori
Yoshihiro Kawaguchi
Hayato Tanoue
Kazuya Hisano
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG11202008643PA publication Critical patent/SG11202008643PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H01L2223/5446—Located in scribe lines

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Dicing (AREA)
SG11202008643PA 2018-04-09 2019-03-27 Laser processing device, laser processing system, and laser processing method SG11202008643PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018074994 2018-04-09
PCT/JP2019/013292 WO2019198512A1 (en) 2018-04-09 2019-03-27 Laser processing device, laser processing system, and laser processing method

Publications (1)

Publication Number Publication Date
SG11202008643PA true SG11202008643PA (en) 2020-10-29

Family

ID=68163609

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202008643PA SG11202008643PA (en) 2018-04-09 2019-03-27 Laser processing device, laser processing system, and laser processing method

Country Status (7)

Country Link
US (1) US12191168B2 (en)
JP (1) JP6932248B2 (en)
KR (1) KR102669504B1 (en)
CN (1) CN111868886B (en)
SG (1) SG11202008643PA (en)
TW (1) TWI793295B (en)
WO (1) WO2019198512A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7217426B2 (en) * 2019-02-22 2023-02-03 パナソニックＩｐマネジメント株式会社 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
TWI857094B (en) * 2019-07-18 2024-10-01 日商東京威力科創股份有限公司 Processing device and processing method
JP7479755B2 (en) * 2020-02-25 2024-05-09 株式会社ディスコ How the chip is manufactured
JP7455476B2 (en) * 2020-05-28 2024-03-26 株式会社ディスコ Wafer inspection equipment and wafer inspection method
CN111952157B (en) * 2020-08-17 2022-08-23 北京中科镭特电子有限公司 Laser annealing device
DE112021006062T5 (en) * 2021-02-10 2023-08-31 Yamaha Hatsudoki Kabushiki Kaisha processing device
KR102881270B1 (en) * 2025-06-10 2025-11-06 주식회사 블루타일랩 Integrated laser apparatus for simultaneous inspection and processing

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0357910A (en) * 1989-07-27 1991-03-13 Yamazaki Mazak Corp Apparatus for measuring direction of normal line and measuring of direction of normal line
JP2001300755A (en) * 2000-04-19 2001-10-30 Hitachi Constr Mach Co Ltd Method and device for laser beam machining
JP2003057910A (en) * 2001-08-20 2003-02-28 Ricoh Co Ltd Image forming device
CN1276306C (en) * 2002-05-14 2006-09-20 株式会社东芝 Processing method and manufacturing method of semiconductor device
KR101058800B1 (en) * 2003-05-22 2011-08-23 가부시키가이샤 토쿄 세이미쯔 Laser dicing equipment
JP4598407B2 (en) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4251146B2 (en) * 2005-03-29 2009-04-08 株式会社デンソー Manufacturing method of semiconductor device
US7638731B2 (en) * 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
US8735770B2 (en) * 2006-10-04 2014-05-27 Hamamatsu Photonics K.K. Laser processing method for forming a modified region in an object
JP2009135430A (en) * 2007-10-10 2009-06-18 Semiconductor Energy Lab Co Ltd Method for manufacturing semiconductor device
JP2009140958A (en) * 2007-12-03 2009-06-25 Tokyo Seimitsu Co Ltd Laser dicing device and dicing method
CN101983420B (en) * 2008-03-28 2013-06-26 伊雷克托科学工业股份有限公司 Autofocus method and apparatus for wafer scribing
US8526473B2 (en) * 2008-03-31 2013-09-03 Electro Scientific Industries Methods and systems for dynamically generating tailored laser pulses
JP5243098B2 (en) * 2008-05-09 2013-07-24 株式会社ディスコ Laser processing equipment
DE202009014893U1 (en) * 2009-12-21 2011-05-26 LT Ultra-Precision-Technology GmbH, 88634 Device for detecting and adjusting the focus of a laser beam in the laser machining of workpieces
JP5721377B2 (en) * 2010-09-09 2015-05-20 株式会社ディスコ Split method
TW201315554A (en) * 2011-09-15 2013-04-16 松下電器產業股份有限公司 Laser processing device and laser processing method
CN202317434U (en) * 2011-10-10 2012-07-11 华中科技大学 Laser processing automatic focusing adjustment device
JP5886603B2 (en) * 2011-11-11 2016-03-16 株式会社ディスコ Processing method of optical device wafer
JP5573861B2 (en) * 2012-02-16 2014-08-20 株式会社安川電機 Transport system
KR101279578B1 (en) * 2012-04-03 2013-06-27 주식회사 이오테크닉스 Auto focusing apparatus for laser processing and auto focusing method using the same
KR101445832B1 (en) * 2012-11-15 2014-09-30 주식회사 이오테크닉스 Laser processing apparatus and laser processing method
JP6148075B2 (en) * 2013-05-31 2017-06-14 株式会社ディスコ Laser processing equipment
WO2016121685A1 (en) * 2015-01-28 2016-08-04 株式会社東京精密 Laser dicing device
DE102015015651B3 (en) * 2015-12-02 2017-04-13 Lessmüller Lasertechnik GmbH Monitoring device, processing system and method for work space monitoring for laser material processing
JP2017131949A (en) * 2016-01-28 2017-08-03 浜松ホトニクス株式会社 Laser processing apparatus and laser processing method
DE112017000576T5 (en) * 2016-01-28 2018-10-31 Hamamatsu Photonics K.K. LASER PROCESSING DEVICE AND LASER DISPENSER
JP6622610B2 (en) * 2016-02-09 2019-12-18 株式会社ディスコ Grinding equipment
JP6644580B2 (en) * 2016-02-24 2020-02-12 浜松ホトニクス株式会社 Laser beam irradiation device and laser beam irradiation method
JP6689646B2 (en) * 2016-04-01 2020-04-28 浜松ホトニクス株式会社 Laser processing equipment
KR20180015353A (en) * 2016-08-03 2018-02-13 주식회사 탑 엔지니어링 Laser scribing appratus
CN108393579A (en) * 2017-02-07 2018-08-14 京东方科技集团股份有限公司 Laser processing device and laser processing
EP3585541A1 (en) * 2017-03-31 2020-01-01 Precitec GmbH & Co. KG Device and method for an additive manufacture

Also Published As

Publication number Publication date
WO2019198512A1 (en) 2019-10-17
KR102669504B1 (en) 2024-05-28
KR20200135949A (en) 2020-12-04
CN111868886B (en) 2024-01-05
US12191168B2 (en) 2025-01-07
CN111868886A (en) 2020-10-30
JPWO2019198512A1 (en) 2021-03-11
JP6932248B2 (en) 2021-09-08
US20200411338A1 (en) 2020-12-31
TW201944026A (en) 2019-11-16
TWI793295B (en) 2023-02-21

Similar Documents

Publication Publication Date Title
ZA202101366B (en) Processing system for processing cryptocurrencies and method for processing cryptocurrencies
EP3889761A4 (en) Message processing method, related device, and system
SG11202010000VA (en) Task processing method, apparatus, and system
PH12022551288A1 (en) Program, information processing method, information processing device, and information processing system
SG11201911378XA (en) Service processing method, device and system
GB201803116D0 (en) Device, system and method
EP3581321A4 (en) Laser processing device and laser processing method
EP3754915A4 (en) DATA PROCESSING METHOD, DEVICE AND SYSTEM
EP3396902A4 (en) Message processing method, device and system
EP3402154A4 (en) Service processing method, device, and system
HUE072315T2 (en) Resource processing method, apparatus, and system
EP3270546A4 (en) Message processing method, device and system
SG11202008643PA (en) Laser processing device, laser processing system, and laser processing method
EP3820194A4 (en) DATA PROCESSING METHOD, DEVICE AND SYSTEM
EP3301870A4 (en) Route processing method, device and system
EP3404628A4 (en) Money management device, money processing system, and money processing method
EP3713195A4 (en) LOG PROCESSING METHOD, ASSOCIATED DEVICE AND SYSTEM
EP3416039A4 (en) Image processing device, image processing system, and image processing method
EP3379771A4 (en) Message processing method, device and system
SG11202008663VA (en) Laser processing device and laser processing method
IL272975A (en) Information processing device, information processing system, and information processing method
SG11202006792TA (en) Cell processing method, device, and system
GB201721551D0 (en) System, device and method for processing data
EP3608824A4 (en) Information processing device, information processing system and information processing method
EP3576392A4 (en) Information processing device, information processing method, and information processing system