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SG11201906676XA - Electrostatic substrate holder - Google Patents

Electrostatic substrate holder

Info

Publication number
SG11201906676XA
SG11201906676XA SG11201906676XA SG11201906676XA SG11201906676XA SG 11201906676X A SG11201906676X A SG 11201906676XA SG 11201906676X A SG11201906676X A SG 11201906676XA SG 11201906676X A SG11201906676X A SG 11201906676XA SG 11201906676X A SG11201906676X A SG 11201906676XA
Authority
SG
Singapore
Prior art keywords
substrate holder
electrostatic substrate
electrostatic
holder
substrate
Prior art date
Application number
SG11201906676XA
Other languages
English (en)
Inventor
Christoph Flötgen
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201906676XA publication Critical patent/SG11201906676XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201906676XA 2017-03-09 2017-03-09 Electrostatic substrate holder SG11201906676XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/055608 WO2018162070A1 (fr) 2017-03-09 2017-03-09 Support de substrat électrostatique

Publications (1)

Publication Number Publication Date
SG11201906676XA true SG11201906676XA (en) 2019-08-27

Family

ID=58266617

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201906676XA SG11201906676XA (en) 2017-03-09 2017-03-09 Electrostatic substrate holder

Country Status (8)

Country Link
US (1) US11270902B2 (fr)
EP (1) EP3593379B1 (fr)
JP (1) JP6985399B2 (fr)
KR (1) KR102371870B1 (fr)
CN (1) CN110431659B (fr)
SG (1) SG11201906676XA (fr)
TW (1) TWI700771B (fr)
WO (1) WO2018162070A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11240411B2 (en) * 2019-06-26 2022-02-01 Magna Electronics Inc. Vehicular camera with controlled camera focus
US11579400B2 (en) 2019-10-08 2023-02-14 Magna Electronics Inc. Vehicular camera with adhesive disposed between non-axially opposed surfaces of the lens barrel and PCB structure
US11635672B2 (en) 2020-06-08 2023-04-25 Magna Electronics Inc. Vehicular camera assembly process using welding to secure lens relative to camera image plane
US12174448B2 (en) 2020-06-08 2024-12-24 Magna Electronics Inc. Vehicular camera assembly process using welding to secure lens relative to camera image plane
DE102020120732A1 (de) * 2020-08-06 2022-02-10 Vat Holding Ag Stifthubvorrichtung
US12078913B2 (en) 2021-07-16 2024-09-03 Magna Electronics Inc. Vehicular camera with low CTE metal housing and plastic lens attachment
US12422691B2 (en) 2022-05-17 2025-09-23 Magna Electronics Inc. Vehicular camera assembly with lens barrel welded at imager housing
US20240118329A1 (en) * 2022-10-05 2024-04-11 Taiwan Semiconductor Manufacturing Company Limited Electrostatic field strength measurement
WO2025026563A1 (fr) * 2023-08-03 2025-02-06 Ev Group E. Thallner Gmbh Procédé de liaison d'un premier substrat sur un second substrat, dispositif de collage, support de substrat pour un tel dispositif, et élément capteur

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US1533757A (en) 1919-03-10 1925-04-14 Rahbek Knud Apparatus for changing electrical variations to mechanical
US4943750A (en) * 1987-05-20 1990-07-24 Massachusetts Institute Of Technology Electrostatic micromotor
JPH06232047A (ja) 1993-01-29 1994-08-19 Mitsubishi Heavy Ind Ltd ウェハ回転装置
US5982986A (en) 1995-02-03 1999-11-09 Applied Materials, Inc. Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
TW298660B (fr) * 1995-06-13 1997-02-21 Nisshin Denki Kk
JP3419204B2 (ja) * 1995-06-13 2003-06-23 日新電機株式会社 回転部電流伝達機構
US5790365A (en) * 1996-07-31 1998-08-04 Applied Materials, Inc. Method and apparatus for releasing a workpiece from and electrostatic chuck
JP4386983B2 (ja) * 1998-02-25 2009-12-16 キヤノンアネルバ株式会社 基板処理装置、マルチチャンバー基板処理装置及び電子デバイス製作方法
JP3437520B2 (ja) * 2000-03-01 2003-08-18 キヤノン株式会社 静電アクチュエータ駆動機構、静電アクチュエータ駆動方法、及びこれらによる静電アクチュエータ、回転ステージ、ポリゴンミラー
JP4745556B2 (ja) 2001-08-20 2011-08-10 キヤノン株式会社 位置決め装置、露光装置、及びデバイス製造方法
JP3688243B2 (ja) * 2002-02-18 2005-08-24 株式会社日立国際電気 半導体製造装置
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JP4368739B2 (ja) * 2004-05-21 2009-11-18 アルプス電気株式会社 静電吸引駆動装置
JP4395752B2 (ja) * 2004-12-22 2010-01-13 日本精工株式会社 回転保持装置
KR101153118B1 (ko) * 2005-10-12 2012-06-07 파나소닉 주식회사 플라즈마 처리장치 및 플라즈마 처리방법
US7511935B2 (en) * 2006-02-27 2009-03-31 Applied Materials, Israel, Ltd. Electrostatic chuck and method of its manufacture
JP4768699B2 (ja) * 2006-11-30 2011-09-07 キヤノンアネルバ株式会社 電力導入装置及び成膜方法
US7898204B2 (en) * 2007-01-05 2011-03-01 Active Precision, Inc. High-speed substrate manipulator
KR101540140B1 (ko) * 2008-08-08 2015-07-28 아사히 가라스 가부시키가이샤 기판의 유지 장치, 기판의 유지 방법 및 합판 유리의 제조 방법
DE102009018156B4 (de) 2009-04-21 2024-08-29 Ev Group Gmbh Vorrichtung und Verfahren zum Trennen eines Substrats von einem Trägersubstrat
JP5396353B2 (ja) * 2009-09-17 2014-01-22 日本碍子株式会社 静電チャック及びその製法
US20110102761A1 (en) * 2009-09-28 2011-05-05 Nikon Corporation Stage apparatus, exposure apparatus, and device fabricating method
JP5504980B2 (ja) * 2010-03-04 2014-05-28 日新イオン機器株式会社 ウエハリフト回転機構、ステージ装置及びイオン注入装置
JP5462364B2 (ja) * 2010-07-21 2014-04-02 キヤノンアネルバ株式会社 電力導入装置及び電力導入装置を用いた真空処理装置
JP5898236B2 (ja) 2011-12-13 2016-04-06 キヤノンアネルバ株式会社 電力導入装置及び電力導入装置を用いた真空処理装置
JP5994306B2 (ja) 2012-03-15 2016-09-21 ソニー株式会社 情報処理装置、情報処理システムおよびプログラム
JP6207880B2 (ja) 2012-09-26 2017-10-04 東芝メモリ株式会社 プラズマ処理装置およびプラズマ処理方法
EP2752870A1 (fr) * 2013-01-04 2014-07-09 Süss Microtec Lithography GmbH Mandrin, en particulier pour utilisation dans un aligneur de masques
KR101489074B1 (ko) * 2013-07-01 2015-02-04 주식회사 야스 클러스터 장비에 적용되는 정전기부상 기판 이송 시스템
US9853579B2 (en) * 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck
KR20160015510A (ko) * 2014-07-30 2016-02-15 삼성전자주식회사 정전척 어셈블리, 이를 구비하는 반도체 제조장치, 및 이를 이용한 플라즈마 처리방법
WO2016137964A1 (fr) * 2015-02-25 2016-09-01 Corning Incorporated Appareil et procédé de montage en mandrin électrostatique de substrats à un support mobile
JP6462620B2 (ja) * 2016-03-29 2019-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
US20190355606A1 (en) 2019-11-21
WO2018162070A1 (fr) 2018-09-13
KR20190120180A (ko) 2019-10-23
EP3593379A1 (fr) 2020-01-15
JP2020511776A (ja) 2020-04-16
US11270902B2 (en) 2022-03-08
CN110431659B (zh) 2023-11-24
TWI700771B (zh) 2020-08-01
KR102371870B1 (ko) 2022-03-07
EP3593379B1 (fr) 2023-08-16
TW201842621A (zh) 2018-12-01
CN110431659A (zh) 2019-11-08
JP6985399B2 (ja) 2021-12-22

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