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SG11201902651QA - Substrate processing control system, substrate processing control method, and program - Google Patents

Substrate processing control system, substrate processing control method, and program

Info

Publication number
SG11201902651QA
SG11201902651QA SG11201902651QA SG11201902651QA SG11201902651QA SG 11201902651Q A SG11201902651Q A SG 11201902651QA SG 11201902651Q A SG11201902651Q A SG 11201902651QA SG 11201902651Q A SG11201902651Q A SG 11201902651QA SG 11201902651Q A SG11201902651Q A SG 11201902651QA
Authority
SG
Singapore
Prior art keywords
polishing
recipe
local
substrate processing
processing control
Prior art date
Application number
SG11201902651QA
Inventor
Koichi Takeda
Tsuneo Torikoshi
Kunio Oishi
Katsuhide Watanabe
Hozumi Yasuda
Yu Ishii
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016204678A external-priority patent/JP6753758B2/en
Priority claimed from JP2016204675A external-priority patent/JP6782145B2/en
Priority claimed from JP2016204676A external-priority patent/JP6817778B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201902651QA publication Critical patent/SG11201902651QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL METHOD, AND PROGRAM A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing. Figure 3
SG11201902651QA 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program SG11201902651QA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016204678A JP6753758B2 (en) 2016-10-18 2016-10-18 Polishing equipment, polishing methods and programs
JP2016204675A JP6782145B2 (en) 2016-10-18 2016-10-18 Board processing control system, board processing control method, and program
JP2016204676A JP6817778B2 (en) 2016-10-18 2016-10-18 Local polishing equipment, local polishing methods and programs
PCT/JP2017/032306 WO2018074091A1 (en) 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program

Publications (1)

Publication Number Publication Date
SG11201902651QA true SG11201902651QA (en) 2019-05-30

Family

ID=62019303

Family Applications (3)

Application Number Title Priority Date Filing Date
SG10202111787PA SG10202111787PA (en) 2016-10-18 2017-09-07 Local polisher, method of a local polisher and program
SG10202111784SA SG10202111784SA (en) 2016-10-18 2017-09-07 System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program
SG11201902651QA SG11201902651QA (en) 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program

Family Applications Before (2)

Application Number Title Priority Date Filing Date
SG10202111787PA SG10202111787PA (en) 2016-10-18 2017-09-07 Local polisher, method of a local polisher and program
SG10202111784SA SG10202111784SA (en) 2016-10-18 2017-09-07 System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program

Country Status (4)

Country Link
US (2) US12036634B2 (en)
SG (3) SG10202111787PA (en)
TW (2) TWI739906B (en)
WO (1) WO2018074091A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7023455B2 (en) * 2017-01-23 2022-02-22 不二越機械工業株式会社 Work polishing method and work polishing equipment
CN111902924B (en) * 2018-03-13 2024-11-29 应用材料公司 Machine learning system for monitoring of semiconductor processing
JP6830464B2 (en) * 2018-09-26 2021-02-17 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ Substrate processing equipment, semiconductor device manufacturing methods and recording media.
JP2020053550A (en) * 2018-09-27 2020-04-02 株式会社荏原製作所 Polishing device, polishing method, and machine learning device
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
JP7220573B2 (en) 2019-01-24 2023-02-10 株式会社荏原製作所 Information processing system, information processing method, program and substrate processing apparatus
EP3921091A1 (en) 2019-02-05 2021-12-15 3M Innovative Properties Company Paint repair process by scenario
BR112021019580A2 (en) 2019-03-29 2021-12-14 Saint Gobain Abrasifs Sa Performance of grinding solutions
CA3135979C (en) 2019-04-03 2023-12-19 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
JP7224265B2 (en) * 2019-09-18 2023-02-17 株式会社荏原製作所 machine learning device, substrate processing device, trained model, machine learning method, machine learning program
JP7469032B2 (en) * 2019-12-10 2024-04-16 株式会社荏原製作所 Polishing method and polishing apparatus
JP7542417B2 (en) * 2019-12-27 2024-08-30 株式会社Ｓｃｒｅｅｎホールディングス SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM, AND METHOD FOR GENERATING LEARNING DATA
JP7408421B2 (en) * 2020-01-30 2024-01-05 株式会社Ｓｃｒｅｅｎホールディングス Processing condition specifying method, substrate processing method, substrate product manufacturing method, computer program, storage medium, processing condition specifying device, and substrate processing device
JP7390945B2 (en) 2020-03-19 2023-12-04 株式会社荏原製作所 Polishing equipment, information processing system and program
JP7465498B2 (en) * 2020-03-24 2024-04-11 株式会社荏原製作所 System for chemical mechanical polishing of a workpiece, computing system, and method for creating a simulation model of chemical mechanical polishing - Patents.com
JP7519804B2 (en) * 2020-04-27 2024-07-22 株式会社ディスコ Processing Equipment
JP2021194748A (en) * 2020-06-17 2021-12-27 株式会社荏原製作所 Polishing device and program
US20220288774A1 (en) * 2020-07-31 2022-09-15 GrayMatter Robotics Inc. System and method for autonomously scanning and processing a part
WO2022070309A1 (en) * 2020-09-30 2022-04-07 株式会社ニコン Machining system and display device
JP7709281B2 (en) * 2021-01-14 2025-07-16 株式会社荏原製作所 POLISHING APPARATUS, POLISHING METHOD, AND METHOD FOR OUTPUTING VISUALIZED INFORMATION OF THIN FILM DISTRIBUTION ON SUBSTRATE
JP7684058B2 (en) * 2021-03-01 2025-05-27 株式会社荏原製作所 Polishing apparatus and polishing method
US20220395956A1 (en) * 2021-06-15 2022-12-15 Axus Technology, Llc Method and apparatus for in-situ monitoring of chemical mechanical planarization (cmp) processes
US11969140B2 (en) * 2021-06-22 2024-04-30 Micron Technology, Inc. Surface cleaning
KR20240100395A (en) * 2021-11-02 2024-07-01 어플라이드 머티어리얼스, 인코포레이티드 Methods and mechanisms for process recipe optimization
JP7420328B2 (en) * 2021-12-27 2024-01-23 株式会社レゾナック Waviness prediction device, waviness prediction method, method and program for processing objects to be polished
JP7783107B2 (en) * 2022-03-30 2025-12-09 株式会社荏原製作所 Method and apparatus for polishing a workpiece

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0349846A (en) 1989-07-13 1991-03-04 Omron Corp Control device adapted to grinding work
JPH10264011A (en) 1997-03-24 1998-10-06 Canon Inc Precision polishing apparatus and method
JP3086794B2 (en) 1997-09-19 2000-09-11 豊田工機株式会社 Numerically controlled grinding machine
JPH1190816A (en) * 1997-09-22 1999-04-06 Toshiba Corp Polishing apparatus and polishing method
GB2346103A (en) 1997-11-18 2000-08-02 Speedfam Ipec Corp Method and apparatus for modeling a chemical mechanical polishing process
JP4067164B2 (en) 1998-02-27 2008-03-26 東京エレクトロン株式会社 Polishing method and polishing apparatus
JP2000288915A (en) 1999-04-01 2000-10-17 Nikon Corp Polishing apparatus and polishing method
US6592429B1 (en) * 2000-07-28 2003-07-15 Advanced Micro Devices, Inc. Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures
TWI221435B (en) * 2001-01-20 2004-10-01 Guo-Jen Wang Method for optimizing timing control process parameters in chemical mechanical polishing
US6540591B1 (en) * 2001-04-18 2003-04-01 Alexander J. Pasadyn Method and apparatus for post-polish thickness and uniformity control
JP2002343753A (en) 2001-05-21 2002-11-29 Nikon Corp Simulation method and apparatus, processing apparatus, processing system, and semiconductor device manufacturing method
US7160739B2 (en) * 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US6594024B1 (en) * 2001-06-21 2003-07-15 Advanced Micro Devices, Inc. Monitor CMP process using scatterometry
JP3811376B2 (en) * 2001-08-08 2006-08-16 大日本スクリーン製造株式会社 Substrate cleaning method and substrate cleaning apparatus
US6630360B2 (en) * 2002-01-10 2003-10-07 Advanced Micro Devices, Inc. Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
JP3935757B2 (en) 2002-03-28 2007-06-27 信越半導体株式会社 Wafer double-side polishing apparatus and double-side polishing method
US8185230B2 (en) * 2002-08-22 2012-05-22 Advanced Micro Devices, Inc. Method and apparatus for predicting device electrical parameters during fabrication
WO2004075276A1 (en) * 2003-02-18 2004-09-02 Nikon Corporation Polishing apparatus, method of polishing and process for producing semiconductor device
TWI286964B (en) * 2003-03-25 2007-09-21 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US7001243B1 (en) * 2003-06-27 2006-02-21 Lam Research Corporation Neural network control of chemical mechanical planarization
US7354332B2 (en) * 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7264535B2 (en) * 2004-04-23 2007-09-04 Hitachi Global Storage Technologies Netherlands, B.V. Run-to-run control of backside pressure for CMP radial uniformity optimization based on center-to-edge model
JP4163145B2 (en) * 2004-04-30 2008-10-08 株式会社ルネサステクノロジ Wafer polishing method
TW200600263A (en) * 2004-06-18 2006-01-01 Trancom Technology Inc Voiceprint data monitor system of chemical mechanical polishing equipment
KR20070068285A (en) * 2005-12-26 2007-06-29 배성훈 Chemical mechanical polishing equipment
JP2009028856A (en) * 2007-07-27 2009-02-12 Tokyo Seimitsu Co Ltd Polishing end point detection method using torque change and apparatus thereof
US8357286B1 (en) * 2007-10-29 2013-01-22 Semcon Tech, Llc Versatile workpiece refining
JP2009194134A (en) 2008-02-14 2009-08-27 Ebara Corp Polishing method and polishing apparatus
JP5399109B2 (en) 2009-03-25 2014-01-29 Ｈｏｙａ株式会社 Mask blank substrate manufacturing method, mask blank manufacturing method, and mask manufacturing method
KR101170760B1 (en) * 2009-07-24 2012-08-03 세메스 주식회사 Substrate polishing apparatus
JP2011060977A (en) 2009-09-09 2011-03-24 Toshiba Corp Manufacturing apparatus of semiconductor device and manufacturing method
US9102033B2 (en) * 2010-11-24 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process
US9418904B2 (en) 2011-11-14 2016-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Localized CMP to improve wafer planarization
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
JP2013176828A (en) 2012-02-29 2013-09-09 Ebara Corp Remote monitoring system of polishing end point detection device
US20130241075A1 (en) * 2012-03-13 2013-09-19 Macronix International Co., Ltd. Contact or via critical dimension control with novel closed loop control system in chemical mechanical planarization process
US10500693B2 (en) * 2012-04-05 2019-12-10 Texas Instruments Incorporated Run-to-run control for chemical mechanical planarization
US20140080229A1 (en) * 2012-09-14 2014-03-20 Stmicroelectronics, Inc. Adaptive semiconductor processing using feedback from measurement devices
CN105659362B (en) * 2013-10-23 2019-11-26 应用材料公司 Polishing system with regional area rate control
US9751189B2 (en) * 2014-07-03 2017-09-05 Applied Materials, Inc. Compliant polishing pad and polishing module
TWI692385B (en) * 2014-07-17 2020-05-01 美商應用材料股份有限公司 Method, system and polishing pad for chemical mechancal polishing
CN106463384B (en) * 2014-07-18 2020-03-17 应用材料公司 Modifying a substrate thickness profile
KR102213468B1 (en) * 2014-08-26 2021-02-08 가부시키가이샤 에바라 세이사꾸쇼 Buffing apparatus, and substrate processing apparatus
US20160074988A1 (en) 2014-09-11 2016-03-17 Ebara Corporation Processing module, processing apparatus, and processing method
JP2016058724A (en) * 2014-09-11 2016-04-21 株式会社荏原製作所 Processing module, processor, and processing method

Also Published As

Publication number Publication date
TWI739906B (en) 2021-09-21
WO2018074091A1 (en) 2018-04-26
TWI775569B (en) 2022-08-21
US12036634B2 (en) 2024-07-16
TW201832872A (en) 2018-09-16
TW202204090A (en) 2022-02-01
US20240316720A1 (en) 2024-09-26
US20190240799A1 (en) 2019-08-08
SG10202111784SA (en) 2021-12-30
SG10202111787PA (en) 2021-11-29

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