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SG11201810343TA - Release film - Google Patents

Release film

Info

Publication number
SG11201810343TA
SG11201810343TA SG11201810343TA SG11201810343TA SG11201810343TA SG 11201810343T A SG11201810343T A SG 11201810343TA SG 11201810343T A SG11201810343T A SG 11201810343TA SG 11201810343T A SG11201810343T A SG 11201810343TA SG 11201810343T A SG11201810343T A SG 11201810343TA
Authority
SG
Singapore
Prior art keywords
release film
release layer
filler
substrate
release
Prior art date
Application number
SG11201810343TA
Inventor
Shuichi Mori
Ryo Tamura
Takeo Otomo
Waka Sasaki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=60326238&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201810343T(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11201810343TA publication Critical patent/SG11201810343TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00—Unspecified macromolecular compounds
    • B32B2398/10—Thermosetting resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

RELEASE FILM A release film includes a substrate and a release layer formed on the substrate, the release layer including a resin component and a filler, wherein a ratio (A/B) of a volume average particle diameter A (μm) of the filler to a mass B (g/m2) per 1 m2 of the release layer is 1 or less. FIG. 1
SG11201810343TA 2016-05-20 2017-05-19 Release film SG11201810343TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016101820 2016-05-20
PCT/JP2017/018930 WO2017200102A1 (en) 2016-05-20 2017-05-19 Mold release film

Publications (1)

Publication Number Publication Date
SG11201810343TA true SG11201810343TA (en) 2018-12-28

Family

ID=60326238

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201810343TA SG11201810343TA (en) 2016-05-20 2017-05-19 Release film

Country Status (7)

Country Link
JP (1) JP6414345B2 (en)
KR (1) KR102340703B1 (en)
CN (1) CN109153155B (en)
MY (1) MY188629A (en)
SG (1) SG11201810343TA (en)
TW (2) TW201819141A (en)
WO (1) WO2017200102A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12290967B2 (en) 2019-03-20 2025-05-06 Kobayashi & Co., Ltd. Combination of mold and release film, release film, mold, and method for manufacturing molded article

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210021465A (en) 2018-06-22 2021-02-26 가부시키가이샤 고바야시 Release film and manufacturing method of release film
CN112292264B (en) 2018-06-22 2023-10-20 小林股份有限公司 Release film and manufacturing method of release film
JP6863523B2 (en) * 2018-08-24 2021-04-21 住友ベークライト株式会社 Manufacturing method of release film and molded product
WO2021079746A1 (en) * 2019-10-24 2021-04-29 昭和電工マテリアルズ株式会社 Mold-release film and method for manufacturing semiconductor package
CN111016017B (en) * 2019-12-31 2021-10-22 上海凯陆高分子材料有限公司 Material for surface treatment of vulcanization mold and preparation method and application thereof
TWI724765B (en) 2020-01-21 2021-04-11 達興材料股份有限公司 Laser-debondable composition, laminate thereof, and laser-debonding method
WO2022038712A1 (en) * 2020-08-19 2022-02-24 昭和電工マテリアルズ株式会社 Release film and electronic component device manufacturing method
JP6870775B1 (en) * 2020-10-21 2021-05-12 住友ベークライト株式会社 Manufacturing method of release film and molded product
JP2023130117A (en) * 2022-03-07 2023-09-20 株式会社レゾナック Release film for semiconductor molding and method for manufacturing semiconductor devices

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001038850A (en) * 1999-07-28 2001-02-13 Oji Paper Co Ltd Release sheet for electron beam curing process
JP2002158242A (en) 1999-11-30 2002-05-31 Hitachi Chem Co Ltd Mold release sheet for semiconductor mold and method for manufacturing resin-sealed semiconductor device
JP2004200467A (en) * 2002-12-19 2004-07-15 Hitachi Chem Co Ltd Release sheet for semiconductor mould
JP4183558B2 (en) * 2003-05-26 2008-11-19 ヤマウチ株式会社 Heat press sheet
WO2006006713A1 (en) * 2004-07-13 2006-01-19 Lintec Corporation Releasing sheet and formed article obtained by using such releasing sheet
JP2007287937A (en) 2006-04-17 2007-11-01 Kyocera Chemical Corp Resin-sealed semiconductor device and its manufacturing method
JP2008018679A (en) 2006-07-14 2008-01-31 Dainippon Printing Co Ltd Release film
WO2009057315A1 (en) * 2007-10-31 2009-05-07 Unitika Ltd. Releasing polyester film
JP5080232B2 (en) * 2007-12-13 2012-11-21 帝人デュポンフィルム株式会社 Release film for green sheet molding and method for producing the same
EP2508564A4 (en) * 2009-12-03 2013-04-24 Asahi Glass Co Ltd PROCESS FOR PRODUCING FLUORINATED COPOLYMER NANOCOMPOSITE
CN102782075A (en) * 2010-02-15 2012-11-14 旭硝子株式会社 Release agent composition
JP5799893B2 (en) 2012-05-25 2015-10-28 信越化学工業株式会社 Emulsion heavy release additive for release sheet, emulsion composition for release sheet, and release sheet
WO2013183671A1 (en) * 2012-06-08 2013-12-12 日立化成株式会社 Method for manufacturing semiconductor device
CN104470719B (en) * 2012-10-19 2016-06-08 东丽株式会社 Demoulding double axial orientated polyester film
JP6204051B2 (en) * 2013-04-19 2017-09-27 株式会社巴川製紙所 Mold release sheet
JP6284313B2 (en) 2013-08-02 2018-02-28 ライオン・スペシャリティ・ケミカルズ株式会社 Release film production method and release film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12290967B2 (en) 2019-03-20 2025-05-06 Kobayashi & Co., Ltd. Combination of mold and release film, release film, mold, and method for manufacturing molded article

Also Published As

Publication number Publication date
JP6414345B2 (en) 2018-10-31
CN109153155A (en) 2019-01-04
MY188629A (en) 2021-12-22
KR102340703B1 (en) 2021-12-16
JPWO2017200102A1 (en) 2018-05-31
WO2017200102A1 (en) 2017-11-23
CN109153155B (en) 2020-11-10
TW202237368A (en) 2022-10-01
TW201819141A (en) 2018-06-01
KR20190008883A (en) 2019-01-25

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