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SG11201801665TA - Phosphorus-containing copper powder and method for producing the same - Google Patents

Phosphorus-containing copper powder and method for producing the same

Info

Publication number
SG11201801665TA
SG11201801665TA SG11201801665TA SG11201801665TA SG11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA
Authority
SG
Singapore
Prior art keywords
phosphorus
producing
same
copper powder
containing copper
Prior art date
Application number
SG11201801665TA
Inventor
Kenichi Inoue
Atsushi Ebara
Masahiro Yoshida
Kyoso MASUDA
Takahiro Yamada
Shinichi Uchiyama
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Priority claimed from PCT/JP2016/074076 external-priority patent/WO2017038478A1/en
Publication of SG11201801665TA publication Critical patent/SG11201801665TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
    • B22F2009/0828—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid with water
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29186—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2224/29187—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
SG11201801665TA 2015-09-03 2016-08-18 Phosphorus-containing copper powder and method for producing the same SG11201801665TA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015173730 2015-09-03
JP2016160289A JP6807681B2 (en) 2015-09-03 2016-08-18 Phosphorus-containing copper powder and its manufacturing method
PCT/JP2016/074076 WO2017038478A1 (en) 2015-09-03 2016-08-18 Phosphorus-containing copper powder and method for producing same

Publications (1)

Publication Number Publication Date
SG11201801665TA true SG11201801665TA (en) 2018-03-28

Family

ID=58278906

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201801665TA SG11201801665TA (en) 2015-09-03 2016-08-18 Phosphorus-containing copper powder and method for producing the same

Country Status (7)

Country Link
US (1) US10773311B2 (en)
EP (1) EP3345696B1 (en)
JP (1) JP6807681B2 (en)
KR (1) KR102404788B1 (en)
CN (1) CN107921532B (en)
SG (1) SG11201801665TA (en)
TW (1) TWI689604B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10773311B2 (en) * 2015-09-03 2020-09-15 Dowa Electronics Materials Co., Ltd. Phosphorus-containing copper powder and method for producing the same
JP7001685B2 (en) * 2017-06-21 2022-01-19 福田金属箔粉工業株式会社 Copper powder for laminated molding and its manufacturing method
JP2019031735A (en) * 2017-08-07 2019-02-28 Ｄｏｗａエレクトロニクス株式会社 Surface treatment silver-coated alloy powder, production method of powder, conductive paste, electronic component and electric device
CN110052617A (en) * 2018-01-17 2019-07-26 昆山磁通新材料科技有限公司 A kind of manufacturing method of low oxygen content water atomization metal powder
KR20250115033A (en) * 2024-01-23 2025-07-30 주식회사 엘지화학 Copper-based composite catalyst and method for screening oxidation number thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0699731B2 (en) * 1986-10-14 1994-12-07 株式会社クボタ Molding method of Al, Mg-based metal rapidly solidified powder
JPH05195024A (en) 1992-01-14 1993-08-03 Nippon Steel Corp Method for preventing oxidation of metal powder during production of metal powder
JP2920343B2 (en) * 1993-10-25 1999-07-19 松下電器産業株式会社 Hydrogen storage alloy powder, nickel-metal hydride battery having the hydrogen storage alloy powder as negative electrode active material, and method for producing hydrogen storage alloy powder
US5605585A (en) * 1993-07-15 1997-02-25 Matsushita Electric Industrial Co., Ltd. Method for producing hydrogen storage alloy particles and sealed-type nickel-metal hydride storage battery using the same
JP3984534B2 (en) * 2002-11-19 2007-10-03 三井金属鉱業株式会社 Copper powder for conductive paste and method for producing the same
US20050106435A1 (en) * 2003-11-13 2005-05-19 Jang Bor Z. Twin-wire arc deposited electrode, solid electrolyte membrane, membrane electrode assembly and fuel cell
JP4158713B2 (en) 2004-02-03 2008-10-01 住友金属鉱山株式会社 Copper paste composition for external electrodes
JP4888769B2 (en) * 2006-10-16 2012-02-29 新東工業株式会社 Copper powder and method for producing the same
KR20100024431A (en) * 2007-06-28 2010-03-05 닛코 킨조쿠 가부시키가이샤 Spherical copper fine powder and process for production of the same
JP5392884B2 (en) 2007-09-21 2014-01-22 三井金属鉱業株式会社 Method for producing copper powder
JP2011006740A (en) * 2009-06-25 2011-01-13 Mitsui Mining & Smelting Co Ltd Copper powder for conductive paste, and conductive paste
WO2011145378A1 (en) * 2010-05-19 2011-11-24 三井金属鉱業株式会社 Copper powder for conductive paste, and conductive paste
JP5785433B2 (en) * 2011-04-28 2015-09-30 三井金属鉱業株式会社 Low carbon copper particles
WO2012157704A1 (en) 2011-05-18 2012-11-22 戸田工業株式会社 Copper powder, copper paste, method for manufacturing conductive coating film, and conductive coating film
CN102398040A (en) * 2011-12-07 2012-04-04 昆山德泰新材料科技有限公司 Atomization production method of copper powder with ultralow apparent density
JP2014077101A (en) 2012-10-12 2014-05-01 Hitachi Chemical Co Ltd Adhesive composition using phosphorus-containing copper alloy particles and semiconductor device using the same
US10773311B2 (en) * 2015-09-03 2020-09-15 Dowa Electronics Materials Co., Ltd. Phosphorus-containing copper powder and method for producing the same

Also Published As

Publication number Publication date
TWI689604B (en) 2020-04-01
US20180243831A1 (en) 2018-08-30
EP3345696A1 (en) 2018-07-11
EP3345696A4 (en) 2019-03-20
KR20180048980A (en) 2018-05-10
EP3345696B1 (en) 2023-06-07
TW201715048A (en) 2017-05-01
US10773311B2 (en) 2020-09-15
CN107921532A (en) 2018-04-17
EP3345696C0 (en) 2023-06-07
KR102404788B1 (en) 2022-06-02
JP2017048461A (en) 2017-03-09
JP6807681B2 (en) 2021-01-06
CN107921532B (en) 2020-05-08

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