SG11201709412PA - Workpiece processing apparatus - Google Patents
Workpiece processing apparatusInfo
- Publication number
- SG11201709412PA SG11201709412PA SG11201709412PA SG11201709412PA SG11201709412PA SG 11201709412P A SG11201709412P A SG 11201709412PA SG 11201709412P A SG11201709412P A SG 11201709412PA SG 11201709412P A SG11201709412P A SG 11201709412PA SG 11201709412P A SG11201709412P A SG 11201709412PA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- workpiece processing
- workpiece
- processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015119338A JP6304132B2 (en) | 2015-06-12 | 2015-06-12 | Workpiece processing equipment |
| PCT/JP2016/001740 WO2016199333A1 (en) | 2015-06-12 | 2016-03-25 | Workpiece machining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201709412PA true SG11201709412PA (en) | 2017-12-28 |
Family
ID=57503434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201709412PA SG11201709412PA (en) | 2015-06-12 | 2016-03-25 | Workpiece processing apparatus |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10335918B2 (en) |
| JP (1) | JP6304132B2 (en) |
| KR (1) | KR102291381B1 (en) |
| CN (1) | CN107614199B (en) |
| DE (1) | DE112016002162T5 (en) |
| SG (1) | SG11201709412PA (en) |
| TW (1) | TWI682832B (en) |
| WO (1) | WO2016199333A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6829467B2 (en) * | 2017-04-05 | 2021-02-10 | スピードファム株式会社 | Double-sided polishing device |
| KR101941769B1 (en) * | 2017-04-19 | 2019-01-23 | 에스케이실트론 주식회사 | Double side polishing apparatus of the wafer |
| KR101941768B1 (en) * | 2017-04-19 | 2019-01-23 | 에스케이실트론 주식회사 | Double side polishing apparatus of the wafer |
| KR101993515B1 (en) * | 2017-05-11 | 2019-06-26 | 에스케이실트론 주식회사 | Double side polishing apparatus of the wafer |
| JP6451825B1 (en) * | 2017-12-25 | 2019-01-16 | 株式会社Sumco | Wafer double-side polishing method |
| CN108481185B (en) * | 2018-06-14 | 2024-11-22 | 东莞金研精密研磨机械制造有限公司 | Double-sided grinding machine |
| JP2020171996A (en) * | 2019-04-11 | 2020-10-22 | 信越半導体株式会社 | Double-sided polishing method |
| KR102705647B1 (en) | 2019-05-02 | 2024-09-11 | 삼성전자주식회사 | Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus |
| JP7308074B2 (en) * | 2019-05-14 | 2023-07-13 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
| US11801580B1 (en) | 2019-12-16 | 2023-10-31 | Arc Specialties, Inc. | Dual airbag compliance device for ball and seat lapping |
| JP6885492B1 (en) * | 2020-05-13 | 2021-06-16 | 信越半導体株式会社 | Double-sided polishing method |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946667U (en) * | 1982-09-16 | 1984-03-28 | 株式会社東芝 | Polisher polishing cloth brushing device |
| JP2535089B2 (en) * | 1990-04-27 | 1996-09-18 | 昭和アルミニウム株式会社 | Polishing method and polishing apparatus |
| JPH0425372A (en) * | 1990-05-17 | 1992-01-29 | Seiko Electronic Components Ltd | Double face polishing device |
| JP3808156B2 (en) | 1997-02-24 | 2006-08-09 | 不二越機械工業株式会社 | Double-side polishing equipment |
| JPH11254308A (en) * | 1998-03-06 | 1999-09-21 | Fujikoshi Mach Corp | Both face grinding device |
| JP2984263B1 (en) * | 1998-10-23 | 1999-11-29 | システム精工株式会社 | Polishing method and polishing apparatus |
| JP2001038603A (en) * | 1999-08-04 | 2001-02-13 | Speedfam Co Ltd | Dresser, grinding device with the dresser, and dressing method |
| JP2002154049A (en) * | 2000-11-15 | 2002-05-28 | Fujikoshi Mach Corp | Polishing method |
| EP1459844B1 (en) * | 2001-12-26 | 2011-08-17 | Koyo Machine Industries Co., Ltd. | Truing method for grinding wheels and grinding machine |
| DE102007056628B4 (en) * | 2007-03-19 | 2019-03-14 | Siltronic Ag | Method and apparatus for simultaneously grinding a plurality of semiconductor wafers |
| DE102009038942B4 (en) * | 2008-10-22 | 2022-06-23 | Peter Wolters Gmbh | Device for machining flat workpieces on both sides and method for machining a plurality of semiconductor wafers simultaneously by removing material from both sides |
| JP5399115B2 (en) * | 2009-03-31 | 2014-01-29 | Hoya株式会社 | Polishing apparatus, glass substrate polishing method and glass substrate manufacturing method |
| JP5533355B2 (en) * | 2010-07-01 | 2014-06-25 | 旭硝子株式会社 | Glass substrate for magnetic recording medium, double-side polishing apparatus, glass substrate polishing method, and glass substrate manufacturing method |
| KR20140083317A (en) * | 2012-12-26 | 2014-07-04 | 주식회사 엘지실트론 | Sun gear and apparatus for polishing wafer including the same |
-
2015
- 2015-06-12 JP JP2015119338A patent/JP6304132B2/en active Active
-
2016
- 2016-03-25 SG SG11201709412PA patent/SG11201709412PA/en unknown
- 2016-03-25 KR KR1020177034812A patent/KR102291381B1/en active Active
- 2016-03-25 CN CN201680029025.1A patent/CN107614199B/en active Active
- 2016-03-25 DE DE112016002162.3T patent/DE112016002162T5/en active Pending
- 2016-03-25 WO PCT/JP2016/001740 patent/WO2016199333A1/en not_active Ceased
- 2016-03-25 US US15/572,747 patent/US10335918B2/en active Active
- 2016-03-28 TW TW105109674A patent/TWI682832B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| US10335918B2 (en) | 2019-07-02 |
| JP6304132B2 (en) | 2018-04-04 |
| CN107614199A (en) | 2018-01-19 |
| TWI682832B (en) | 2020-01-21 |
| DE112016002162T5 (en) | 2018-02-15 |
| KR20180017004A (en) | 2018-02-20 |
| WO2016199333A1 (en) | 2016-12-15 |
| JP2017001151A (en) | 2017-01-05 |
| TW201710027A (en) | 2017-03-16 |
| CN107614199B (en) | 2019-10-25 |
| US20180117729A1 (en) | 2018-05-03 |
| KR102291381B1 (en) | 2021-08-20 |
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