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SG11201700505UA - Substrate storage container - Google Patents

Substrate storage container

Info

Publication number
SG11201700505UA
SG11201700505UA SG11201700505UA SG11201700505UA SG11201700505UA SG 11201700505U A SG11201700505U A SG 11201700505UA SG 11201700505U A SG11201700505U A SG 11201700505UA SG 11201700505U A SG11201700505U A SG 11201700505UA SG 11201700505U A SG11201700505U A SG 11201700505UA
Authority
SG
Singapore
Prior art keywords
storage container
substrate storage
substrate
container
storage
Prior art date
Application number
SG11201700505UA
Inventor
Osamu Ogawa
Kiminori Tominaga
Yasuhiro Fujimoto
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Publication of SG11201700505UA publication Critical patent/SG11201700505UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
SG11201700505UA 2014-07-25 2015-07-21 Substrate storage container SG11201700505UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014151855 2014-07-25
PCT/JP2015/070655 WO2016013536A1 (en) 2014-07-25 2015-07-21 Substrate storage container

Publications (1)

Publication Number Publication Date
SG11201700505UA true SG11201700505UA (en) 2017-02-27

Family

ID=55163061

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700505UA SG11201700505UA (en) 2014-07-25 2015-07-21 Substrate storage container

Country Status (8)

Country Link
US (1) US10312122B2 (en)
JP (1) JP6532466B2 (en)
KR (1) KR102397525B1 (en)
CN (1) CN106537574B (en)
DE (1) DE112015003423T5 (en)
SG (1) SG11201700505UA (en)
TW (1) TWI661503B (en)
WO (1) WO2016013536A1 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6553498B2 (en) * 2015-12-15 2019-07-31 信越ポリマー株式会社 Substrate storage container
KR101865636B1 (en) * 2016-07-06 2018-06-08 우범제 Wafer storage container
EP4102549A1 (en) * 2016-08-30 2022-12-14 Brooks Automation (Germany) GmbH Reticle compartment and diffusor plate
WO2018047541A1 (en) * 2016-09-06 2018-03-15 信越ポリマー株式会社 Substrate storage container and gas substitution unit
JP6623988B2 (en) * 2016-09-09 2019-12-25 株式会社ダイフク Container storage equipment
US10115607B2 (en) * 2016-09-16 2018-10-30 Applied Materials, Inc. Method and apparatus for wafer outgassing control
US10262884B2 (en) * 2016-11-10 2019-04-16 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port
JP6710861B2 (en) * 2017-01-24 2020-06-17 信越ポリマー株式会社 Substrate storage container and method for manufacturing substrate storage container
SG11201908168WA (en) * 2017-03-27 2019-10-30 Shin Etsu Polymer Co Ltd Substrate storage container
WO2018203384A1 (en) 2017-05-02 2018-11-08 ミライアル株式会社 Substrate storage container
KR102066175B1 (en) * 2017-12-28 2020-01-14 우범제 Wafer storage container
WO2019194327A1 (en) * 2018-04-02 2019-10-10 우범제 Wafer storage container
WO2019194326A1 (en) * 2018-04-02 2019-10-10 우범제 Wafer storage container
WO2020065968A1 (en) * 2018-09-28 2020-04-02 ミライアル株式会社 Substrate accommodation container
JP7299474B2 (en) * 2019-03-13 2023-06-28 シンフォニアテクノロジー株式会社 EFEM
CN112289718A (en) 2019-07-13 2021-01-29 家登精密工业股份有限公司 Substrate carrier and gas diffusion module thereof
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
KR102272005B1 (en) * 2019-10-17 2021-07-02 (주)에스티아이 FOUP cleaning device
JP7591919B2 (en) * 2020-12-16 2024-11-29 キヤノン株式会社 Storage device, exposure device, and method for manufacturing an article
JP7467367B2 (en) * 2021-02-19 2024-04-15 信越ポリマー株式会社 Panel storage container
JP7570264B2 (en) * 2021-03-26 2024-10-21 信越ポリマー株式会社 Substrate storage container
JP7675173B2 (en) * 2021-03-29 2025-05-12 ミライアル株式会社 Substrate storage container
KR20240017058A (en) * 2021-06-08 2024-02-06 엔테그리스, 아이엔씨. Wafer container and purge system
CN113937041A (en) * 2021-06-30 2022-01-14 家登精密工业股份有限公司 Substrate container system
US12347711B2 (en) 2021-08-17 2025-07-01 Gudeng Precision Industrial Co., Ltd. Gas diffusion device, and wafer container including the same
CN118414695A (en) 2021-12-17 2024-07-30 恩特格里斯公司 Method for installing a clean fluid conditioning element into a semiconductor substrate carrying container
TWD223988S (en) * 2022-03-03 2023-03-01 家登精密工業股份有限公司 air box
US20230321583A1 (en) * 2022-04-08 2023-10-12 Applied Materials, Inc. Filter isolation for reduced startup time in low relative humidity equipment front end module
TWI832599B (en) * 2022-07-27 2024-02-11 家登精密工業股份有限公司 Top-opening board carrier
TWI817828B (en) * 2022-08-11 2023-10-01 家登精密工業股份有限公司 Substrate container with built-in negative pressure cavity
TW202439510A (en) * 2023-03-23 2024-10-01 家登精密工業股份有限公司 Valve cover and substrate container using the same
TW202508722A (en) * 2023-07-21 2025-03-01 美商恩特葛瑞斯股份有限公司 Method and device to distribute gas into a container
JP7537570B1 (en) 2023-08-22 2024-08-21 ａｒｔｉｅｎｃｅ株式会社 Thermoplastic resin composition for electrical/electronic packaging material and electrical/electronic packaging material
CN118218326A (en) * 2024-03-14 2024-06-21 江苏芯梦半导体设备有限公司 A substrate storage container cleaning method, cleaning unit and cleaning equipment

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19540963C2 (en) * 1995-11-03 1999-05-20 Jenoptik Jena Gmbh Transport container for disc-shaped objects
JP2002122382A (en) * 2000-01-28 2002-04-26 Ebara Corp Substrate container
KR20010078077A (en) * 2000-01-28 2001-08-20 마에다 시게루 Substrate housing
JP2002170876A (en) * 2000-12-04 2002-06-14 Ebara Corp Substrate transport container
JP3960787B2 (en) 2001-11-30 2007-08-15 信越ポリマー株式会社 Precision substrate storage container
JP4201583B2 (en) 2002-11-28 2008-12-24 信越ポリマー株式会社 Substrate storage container
US6899145B2 (en) * 2003-03-20 2005-05-31 Asm America, Inc. Front opening unified pod
JP4027837B2 (en) 2003-04-28 2007-12-26 Ｔｄｋ株式会社 Purge apparatus and purge method
JP4920565B2 (en) 2007-12-04 2012-04-18 株式会社アルバック Substrate container and substrate processing method
US8783463B2 (en) * 2008-03-13 2014-07-22 Entegris, Inc. Wafer container with tubular environmental control components
KR101832512B1 (en) * 2009-12-10 2018-02-26 엔테그리스, 아이엔씨. Porous barrier for evenly distributed purge gas in a microenvironment
CN102939254A (en) * 2010-02-19 2013-02-20 信越聚合物株式会社 Substrate storing container
KR101368706B1 (en) * 2011-07-22 2014-02-28 주식회사 삼에스코리아 Wafer carrier
JP6087161B2 (en) * 2012-02-03 2017-03-01 東京エレクトロン株式会社 Method for purging substrate container
WO2014081825A1 (en) * 2012-11-20 2014-05-30 Entegris, Inc. Substrate container with purge ports
TWM453233U (en) * 2013-01-07 2013-05-11 Gudeng Prec Ind Co Ltd Gas filling device for substrate storage container
JP6226190B2 (en) * 2014-02-20 2017-11-08 Tdk株式会社 Purge system, and pod and load port apparatus provided for the purge system
US9881826B2 (en) * 2014-10-24 2018-01-30 Lam Research Corporation Buffer station with single exit-flow direction

Also Published As

Publication number Publication date
TW201622047A (en) 2016-06-16
JP6532466B2 (en) 2019-06-19
KR20170038846A (en) 2017-04-07
CN106537574A (en) 2017-03-22
CN106537574B (en) 2020-06-05
TWI661503B (en) 2019-06-01
KR102397525B1 (en) 2022-05-12
US20170213752A1 (en) 2017-07-27
JPWO2016013536A1 (en) 2017-05-25
WO2016013536A1 (en) 2016-01-28
US10312122B2 (en) 2019-06-04
DE112015003423T5 (en) 2017-05-04

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