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SG11201608133PA - Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic film - Google Patents

Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic film

Info

Publication number
SG11201608133PA
SG11201608133PA SG11201608133PA SG11201608133PA SG11201608133PA SG 11201608133P A SG11201608133P A SG 11201608133PA SG 11201608133P A SG11201608133P A SG 11201608133PA SG 11201608133P A SG11201608133P A SG 11201608133PA SG 11201608133P A SG11201608133P A SG 11201608133PA
Authority
SG
Singapore
Prior art keywords
film
organic
film thickness
forming device
measuring
Prior art date
Application number
SG11201608133PA
Inventor
Atsushi Itoh
Masato Fukao
Yoshikazu Kobayashi
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of SG11201608133PA publication Critical patent/SG11201608133PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Physical Vapour Deposition (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Electroluminescent Light Sources (AREA)
SG11201608133PA 2014-05-26 2015-05-22 Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic film SG11201608133PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014107816 2014-05-26
PCT/JP2015/002580 WO2015182090A1 (en) 2014-05-26 2015-05-22 Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic film

Publications (1)

Publication Number Publication Date
SG11201608133PA true SG11201608133PA (en) 2016-11-29

Family

ID=54698445

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608133PA SG11201608133PA (en) 2014-05-26 2015-05-22 Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic film

Country Status (5)

Country Link
JP (1) JP6078694B2 (en)
KR (2) KR102035146B1 (en)
CN (1) CN106232858A (en)
SG (1) SG11201608133PA (en)
WO (1) WO2015182090A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10818564B2 (en) * 2016-03-11 2020-10-27 Applied Materials, Inc. Wafer processing tool having a micro sensor
JP6628869B2 (en) 2016-05-06 2020-01-15 株式会社アルバック Thin film manufacturing apparatus and thin film manufacturing method
KR102165001B1 (en) 2016-05-13 2020-10-13 울박, 인크 Organic thin film manufacturing apparatus, organic thin film manufacturing method
US10100410B2 (en) * 2016-08-05 2018-10-16 Industrial Technology Research Institute Film thickness monitoring system and method using the same
JP6564745B2 (en) 2016-09-06 2019-08-21 株式会社アルバック Film thickness sensor
US10763143B2 (en) 2017-08-18 2020-09-01 Applied Materials, Inc. Processing tool having a monitoring device
CN110257791B (en) * 2019-04-29 2021-07-20 昆山国显光电有限公司 Speed monitoring device, evaporation equipment and evaporation method
TWI701641B (en) * 2019-10-01 2020-08-11 龍翩真空科技股份有限公司 Wireless transmission film thickness monitoring device
JP6703217B1 (en) 2019-12-17 2020-06-03 株式会社アルバック Measurement abnormality detection device and measurement abnormality detection method
CN111188020A (en) * 2020-03-03 2020-05-22 成都晶砂科技有限公司 Vacuum steamed bun steaming equipment
CN111206232A (en) * 2020-03-03 2020-05-29 成都晶砂科技有限公司 Vacuum steamed bun steaming equipment
CN111829428B (en) * 2020-06-17 2022-02-15 华中科技大学 A dual-quartz crystal film thickness controller and error correction method

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JPS605619A (en) * 1983-06-23 1985-01-12 Seikosha Co Ltd Thickness-shear piezoelectric vibrator
JP3401112B2 (en) * 1995-03-20 2003-04-28 株式会社アルバック Oscillation circuit for piezoelectric crystal oscillation type film thickness meter
JPH09250918A (en) * 1996-03-13 1997-09-22 Miyota Kk Monitor for forming film of electrode
JPH09326668A (en) * 1996-04-02 1997-12-16 Seiko Epson Corp Piezoelectric element and manufacturing method thereof
JP3953301B2 (en) 2001-11-05 2007-08-08 株式会社アルバック Sensor head for crystal oscillation type film thickness monitor
JP3599188B2 (en) * 2002-02-14 2004-12-08 株式会社半導体先端テクノロジーズ Method for analyzing film characteristics and apparatus for analyzing film characteristics
JP2006118009A (en) * 2004-10-22 2006-05-11 Canon Inc Method for depositing thin film
JP4001296B2 (en) * 2005-08-25 2007-10-31 トッキ株式会社 Method and apparatus for vacuum deposition of organic materials
JP2008245243A (en) * 2007-02-26 2008-10-09 Epson Toyocom Corp Contour vibrator, adjustment method of contour vibrator
KR101283161B1 (en) * 2007-09-21 2013-07-05 가부시키가이샤 알박 Thin film forming apparatus, film thickness measuring method and film thickness sensor
JP2009185344A (en) * 2008-02-07 2009-08-20 Sony Corp Vapor deposition method, vapor deposition apparatus, and display device manufacturing method
JP4773581B2 (en) * 2008-09-22 2011-09-14 パイオニア株式会社 Film thickness measuring instrument using PLL circuit
JP5121645B2 (en) * 2008-09-25 2013-01-16 日立造船株式会社 Film thickness detector for vacuum deposition equipment
JP2010196082A (en) * 2009-02-23 2010-09-09 Canon Inc Vacuum vapor deposition apparatus
KR101379646B1 (en) * 2009-12-09 2014-03-28 가부시키가이샤 알박 Film forming device for organic thin films, and method for forming film using organic materials
JP2014062310A (en) * 2012-09-24 2014-04-10 Hitachi High-Technologies Corp Film thickness sensor, and vacuum evaporation apparatus and vacuum evaporation method using the same

Also Published As

Publication number Publication date
KR102035146B1 (en) 2019-10-22
WO2015182090A1 (en) 2015-12-03
JP6078694B2 (en) 2017-02-08
JPWO2015182090A1 (en) 2017-04-20
KR20180063369A (en) 2018-06-11
CN106232858A (en) 2016-12-14
KR20160127078A (en) 2016-11-02

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