SG11201608777TA - Pellicle frame, pellicle and method of manufacturing the same,original plate for exposure and method of manufacturing thesame, exposure device, and method of manufacturingsemiconductor device - Google Patents
Pellicle frame, pellicle and method of manufacturing the same,original plate for exposure and method of manufacturing thesame, exposure device, and method of manufacturingsemiconductor deviceInfo
- Publication number
- SG11201608777TA SG11201608777TA SG11201608777TA SG11201608777TA SG11201608777TA SG 11201608777T A SG11201608777T A SG 11201608777TA SG 11201608777T A SG11201608777T A SG 11201608777TA SG 11201608777T A SG11201608777T A SG 11201608777TA SG 11201608777T A SG11201608777T A SG 11201608777TA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- exposure
- pellicle
- manufacturingsemiconductor
- same
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014095425 | 2014-05-02 | ||
| PCT/JP2015/062742 WO2015166927A1 (fr) | 2014-05-02 | 2015-04-27 | Cadre de pellicule, pellicule et son procédé de fabrication, plaque originale d'exposition et son procédé de fabrication, dispositif d'exposition et procédé de fabrication de dispositif à semi-conducteur |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201608777TA true SG11201608777TA (en) | 2016-12-29 |
Family
ID=54358654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201608777TA SG11201608777TA (en) | 2014-05-02 | 2015-04-27 | Pellicle frame, pellicle and method of manufacturing the same,original plate for exposure and method of manufacturing thesame, exposure device, and method of manufacturingsemiconductor device |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10216081B2 (fr) |
| EP (1) | EP3118683A4 (fr) |
| JP (1) | JP6279719B2 (fr) |
| KR (1) | KR101853576B1 (fr) |
| CN (1) | CN106233201A (fr) |
| SG (1) | SG11201608777TA (fr) |
| TW (1) | TWI670561B (fr) |
| WO (1) | WO2015166927A1 (fr) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6423730B2 (ja) * | 2014-05-26 | 2018-11-14 | 三井化学株式会社 | ペリクル用の支持枠 |
| JP6367342B2 (ja) * | 2014-09-19 | 2018-08-01 | 三井化学株式会社 | ペリクル、ペリクルの製造方法及びペリクルを用いた露光方法 |
| SG11201701805QA (en) * | 2014-09-19 | 2017-04-27 | Mitsui Chemicals Inc | Pellicle, production method thereof, exposure method |
| CN108351586B (zh) | 2015-09-02 | 2022-01-14 | Asml荷兰有限公司 | 用于制造隔膜组件的方法 |
| CN108699687B (zh) | 2016-02-19 | 2022-03-01 | 爱沃特株式会社 | 化合物半导体基板、表膜、和化合物半导体基板的制造方法 |
| JP6944768B2 (ja) | 2016-08-29 | 2021-10-06 | エア・ウォーター株式会社 | ペリクルの製造方法 |
| CN110325908A (zh) * | 2017-02-17 | 2019-10-11 | 三井化学株式会社 | 防护膜组件、曝光原版、曝光装置及半导体装置的制造方法 |
| EP3404487B1 (fr) | 2017-05-15 | 2021-12-01 | IMEC vzw | Procédé de formation d'une membrane de pellicule ä nanotubes de carbone |
| EP3404486B1 (fr) | 2017-05-15 | 2021-07-14 | IMEC vzw | Procédé de formation d'une pellicule |
| WO2019172141A1 (fr) * | 2018-03-05 | 2019-09-12 | 三井化学株式会社 | Pellicule, matrice d'exposition, dispositif d'exposition et procédé de fabrication de dispositif semi-conducteur |
| EP3764160B1 (fr) * | 2018-03-09 | 2024-10-23 | Kaneka Corporation | Pellicule comprenant un film de graphite |
| KR102465834B1 (ko) * | 2018-03-27 | 2022-11-11 | 미쯔이가가꾸가부시끼가이샤 | 펠리클용 지지 프레임, 펠리클 및 그의 제조 방법, 그리고 이것들을 사용한 노광 원판, 반도체 장치의 제조 방법 |
| JP7139133B2 (ja) | 2018-04-03 | 2022-09-20 | 信越化学工業株式会社 | ペリクルフレーム、ペリクル、及びペリクルフレームの製造方法 |
| JP7330245B2 (ja) * | 2018-04-03 | 2023-08-21 | 信越化学工業株式会社 | ペリクルフレーム、ペリクル、ペリクル付フォトマスク、露光方法、及び半導体デバイスの製造方法 |
| JP7038640B2 (ja) * | 2018-10-26 | 2022-03-18 | 信越化学工業株式会社 | ペリクルの剥離方法及びペリクルの剥離装置 |
| TWI770802B (zh) * | 2020-02-04 | 2022-07-11 | 日商信越化學工業股份有限公司 | 防護薄膜框架、防護薄膜組件、帶防護薄膜組件的曝光原版及曝光方法、以及半導體裝置或液晶顯示板的製造方法 |
| US11194246B1 (en) | 2020-03-27 | 2021-12-07 | Intel Corporation | Monolithically framed pellicle membrane suitable for lithography in the fabrication of integrated circuits |
| US20230236497A1 (en) * | 2020-05-14 | 2023-07-27 | Shin-Etsu Chemical Co., Ltd. | Pellicle Frame, Pellicle, Pellicle-Attached Exposure Original Plate, Method for Manufacturing Semiconductor, Method for Manufacturing Liquid Crystal Display Plate, and Exposure Method |
| KR102581084B1 (ko) * | 2021-02-04 | 2023-09-21 | 주식회사 에프에스티 | 극자외선 리소그라피용 펠리클 프레임 |
| KR20250095929A (ko) | 2023-12-20 | 2025-06-27 | 한국전자기술연구원 | 극자외선 리소그래피용 펠리클 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4833051A (en) * | 1984-08-20 | 1989-05-23 | Nippon Kogaku K.K. | Protective device for photographic masks |
| JPS6358348A (ja) * | 1986-08-28 | 1988-03-14 | Fujitsu Ltd | レクチルの表面保護用具 |
| US5422704A (en) * | 1992-07-13 | 1995-06-06 | Intel Corporation | Pellicle frame |
| US5793836A (en) | 1996-09-06 | 1998-08-11 | International Business Machines Corporation | X-ray mask pellicle |
| US6264773B1 (en) * | 1998-09-01 | 2001-07-24 | Mark Damian Cerio | Apparatus and method for temporary and permanent attachment of pellicle frame to photomask substrate |
| WO2003034475A1 (fr) * | 2001-10-10 | 2003-04-24 | Nikon Corporation | Procede et dispositif de substitution de gaz, dispositif de protection de masque, masque, ainsi que procede et dispositif d'exposition |
| US7456932B2 (en) | 2003-07-25 | 2008-11-25 | Asml Netherlands B.V. | Filter window, lithographic projection apparatus, filter window manufacturing method, device manufacturing method and device manufactured thereby |
| JP2007506149A (ja) * | 2003-09-23 | 2007-03-15 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | レチクルを汚染から保護するよう使用されるペリクルへの重力の影響を補正する方法及び装置 |
| US7619718B2 (en) * | 2003-10-07 | 2009-11-17 | Asml Holding N.V. | Method and system for active purging of pellicle volumes |
| JP2006215487A (ja) * | 2005-02-07 | 2006-08-17 | Tekkusu Iijii:Kk | ペリクル |
| US8323855B2 (en) * | 2007-03-01 | 2012-12-04 | Nikon Corporation | Pellicle frame apparatus, mask, exposing method, exposure apparatus, and device fabricating method |
| KR101191055B1 (ko) * | 2007-07-06 | 2012-10-15 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 대형 펠리클 프레임체 및 그 프레임체의 파지 방법 |
| JP4861963B2 (ja) | 2007-10-18 | 2012-01-25 | 信越化学工業株式会社 | ペリクルおよびペリクルの製造方法 |
| JP4921417B2 (ja) * | 2007-12-21 | 2012-04-25 | 三井化学株式会社 | ペリクル |
| JP5489499B2 (ja) * | 2009-03-18 | 2014-05-14 | オリンパス株式会社 | 薄膜の貼り付け方法、およびそれにより製造されたペリクル光学素子 |
| JP5394808B2 (ja) | 2009-04-22 | 2014-01-22 | 信越化学工業株式会社 | リソグラフィ用ペリクルおよびその製造方法 |
| JP5047232B2 (ja) * | 2009-06-26 | 2012-10-10 | 信越化学工業株式会社 | ペリクル |
| KR101572269B1 (ko) | 2009-09-14 | 2015-12-04 | 에스케이하이닉스 주식회사 | 극자외선 마스크를 보호하는 펠리클 제조 방법 |
| EP2465012B1 (fr) | 2010-06-25 | 2012-12-12 | ASML Netherlands BV | Appareil et procédé lithographique |
| JP2012151158A (ja) | 2011-01-17 | 2012-08-09 | Shin Etsu Chem Co Ltd | Euv用ペリクル膜及びペリクル、並びに該膜の製造方法 |
| JP2012237838A (ja) * | 2011-05-11 | 2012-12-06 | Seto Engineering Co Ltd | フレーム接着剤の除去方法 |
| JP2013222143A (ja) * | 2012-04-18 | 2013-10-28 | Renesas Electronics Corp | 半導体装置の製造方法および露光用マスク |
-
2015
- 2015-04-27 WO PCT/JP2015/062742 patent/WO2015166927A1/fr not_active Ceased
- 2015-04-27 SG SG11201608777TA patent/SG11201608777TA/en unknown
- 2015-04-27 KR KR1020167029221A patent/KR101853576B1/ko active Active
- 2015-04-27 US US15/304,996 patent/US10216081B2/en active Active
- 2015-04-27 CN CN201580018782.4A patent/CN106233201A/zh active Pending
- 2015-04-27 EP EP15786200.4A patent/EP3118683A4/fr not_active Withdrawn
- 2015-04-27 JP JP2016516378A patent/JP6279719B2/ja active Active
- 2015-04-30 TW TW104113924A patent/TWI670561B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US20170192349A1 (en) | 2017-07-06 |
| KR101853576B1 (ko) | 2018-04-30 |
| TWI670561B (zh) | 2019-09-01 |
| CN106233201A (zh) | 2016-12-14 |
| KR20160138160A (ko) | 2016-12-02 |
| EP3118683A4 (fr) | 2017-11-01 |
| WO2015166927A1 (fr) | 2015-11-05 |
| JPWO2015166927A1 (ja) | 2017-04-20 |
| TW201543141A (zh) | 2015-11-16 |
| US10216081B2 (en) | 2019-02-26 |
| JP6279719B2 (ja) | 2018-02-14 |
| EP3118683A1 (fr) | 2017-01-18 |
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