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SG11201608436VA - Wavy interconnect for bendable and stretchable devices - Google Patents

Wavy interconnect for bendable and stretchable devices

Info

Publication number
SG11201608436VA
SG11201608436VA SG11201608436VA SG11201608436VA SG11201608436VA SG 11201608436V A SG11201608436V A SG 11201608436VA SG 11201608436V A SG11201608436V A SG 11201608436VA SG 11201608436V A SG11201608436V A SG 11201608436VA SG 11201608436V A SG11201608436V A SG 11201608436VA
Authority
SG
Singapore
Prior art keywords
bendable
stretchable devices
wavy interconnect
wavy
interconnect
Prior art date
Application number
SG11201608436VA
Inventor
Chuan Hu
Adel A Elsherbini
Yoshihiro Tomita
Shawna Liff
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of SG11201608436VA publication Critical patent/SG11201608436VA/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
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KR20160138249A (en) 2016-12-02
EP3149769A1 (en) 2017-04-05
JP2017517890A (en) 2017-06-29
CN106463490A (en) 2017-02-22
KR101984453B1 (en) 2019-05-30
EP3149769A4 (en) 2018-03-21
US20170079135A1 (en) 2017-03-16
WO2015183264A1 (en) 2015-12-03
US9942980B2 (en) 2018-04-10
KR20180088743A (en) 2018-08-06

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