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SG11201505841XA - Photonic device structure and method of manufacture - Google Patents

Photonic device structure and method of manufacture

Info

Publication number
SG11201505841XA
SG11201505841XA SG11201505841XA SG11201505841XA SG11201505841XA SG 11201505841X A SG11201505841X A SG 11201505841XA SG 11201505841X A SG11201505841X A SG 11201505841XA SG 11201505841X A SG11201505841X A SG 11201505841XA SG 11201505841X A SG11201505841X A SG 11201505841XA
Authority
SG
Singapore
Prior art keywords
manufacture
device structure
photonic device
photonic
Prior art date
Application number
SG11201505841XA
Inventor
Gurtej Sandhu
Roy Meade
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of SG11201505841XA publication Critical patent/SG11201505841XA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1225—Basic optical elements, e.g. light-guiding paths comprising photonic band-gap structures or photonic lattices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12097—Ridge, rib or the like

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Integrated Circuits (AREA)
SG11201505841XA 2013-02-26 2014-02-12 Photonic device structure and method of manufacture SG11201505841XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/776,836 US9005458B2 (en) 2013-02-26 2013-02-26 Photonic device structure and method of manufacture
PCT/US2014/016009 WO2014133760A1 (en) 2013-02-26 2014-02-12 Photonic device structure and method of manufacture

Publications (1)

Publication Number Publication Date
SG11201505841XA true SG11201505841XA (en) 2015-09-29

Family

ID=50179960

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201505841XA SG11201505841XA (en) 2013-02-26 2014-02-12 Photonic device structure and method of manufacture

Country Status (8)

Country Link
US (2) US9005458B2 (en)
EP (1) EP2962139B1 (en)
JP (1) JP6244380B2 (en)
KR (1) KR101842758B1 (en)
CN (1) CN105026966B (en)
SG (1) SG11201505841XA (en)
TW (2) TWI574069B (en)
WO (1) WO2014133760A1 (en)

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US9372308B1 (en) * 2012-06-17 2016-06-21 Pacific Biosciences Of California, Inc. Arrays of integrated analytical devices and methods for production
US9768330B2 (en) * 2014-08-25 2017-09-19 Micron Technology, Inc. Method and optoelectronic structure providing polysilicon photonic devices with different optical properties in different regions
WO2016033207A1 (en) 2014-08-27 2016-03-03 Pacific Biosciences Of California, Inc. Arrays of integrated analyitcal devices
SG11201705526RA (en) 2015-01-08 2017-08-30 Acacia Communications Inc Horizontal coupling to silicon waveguides
CN113064236B (en) 2015-03-16 2022-11-01 加利福尼亚太平洋生物科学股份有限公司 Integrated device and system for free space optical coupling
AU2016259012C1 (en) 2015-05-07 2022-11-17 Pacific Biosciences Of California, Inc. Multiprocessor pipeline architecture
WO2016201387A1 (en) 2015-06-12 2016-12-15 Pacific Biosciences Of California, Inc. Integrated target waveguide devices and systems for optical coupling
US10571633B1 (en) 2016-12-23 2020-02-25 Acacia Communications, Inc. Suspended cantilever waveguide
US10416381B1 (en) 2016-12-23 2019-09-17 Acacia Communications, Inc. Spot-size-converter design for facet optical coupling
US20180372872A1 (en) * 2017-06-23 2018-12-27 Kabushiki Kaisha Toshiba Photodetector, method of manufacturing photodetector, and lidar apparatus
US10466514B1 (en) * 2018-11-06 2019-11-05 Globalfoundries Inc. Electro-optic modulator with vertically-arranged optical paths
US11169328B2 (en) * 2019-09-20 2021-11-09 Taiwan Semiconductor Manufacturing Co., Ltd. Photonic structure and method for forming the same
US11175451B2 (en) * 2019-09-26 2021-11-16 Intel Corporation Mechanisms for refractive index tuning semiconductor photonic devices
US11262500B2 (en) * 2019-12-02 2022-03-01 Renesas Electronics Corporation Semiconductor device and including an optical waveguide and method of manufacturing the same
CN111239900B (en) * 2020-03-18 2022-03-29 联合微电子中心有限责任公司 Forming SiO based on wafer bonding2Method for realizing spot-size conversion by waveguide and spot-size converter
EP3916760B1 (en) 2020-05-28 2024-07-03 Imec VZW A method for producing an undercut in a 300 mm silicon-on-insulator platform
US11409037B2 (en) * 2020-10-28 2022-08-09 Globalfoundries U.S. Inc. Enlarged waveguide for photonic integrated circuit without impacting interconnect layers
US11803009B2 (en) * 2022-02-25 2023-10-31 Globalfoundries U.S. Inc. Photonics structures having a locally-thickened dielectric layer
JP2025065144A (en) * 2022-03-28 2025-04-17 ライトマター インコーポレイテッド Photonic device, photonic interposer and data transmission method

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US6734453B2 (en) 2000-08-08 2004-05-11 Translucent Photonics, Inc. Devices with optical gain in silicon
US6712983B2 (en) * 2001-04-12 2004-03-30 Memsic, Inc. Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the same
US6695457B2 (en) * 2001-06-02 2004-02-24 Capella Photonics, Inc. Bulk silicon mirrors with hinges underneath
US6983086B2 (en) 2003-06-19 2006-01-03 Intel Corporation Thermally isolating optical devices
JP2005045162A (en) 2003-07-25 2005-02-17 Mitsubishi Electric Corp Semiconductor device and manufacturing method thereof
US8119537B2 (en) 2004-09-02 2012-02-21 Micron Technology, Inc. Selective etching of oxides to metal nitrides and metal oxides
US20060133754A1 (en) 2004-12-21 2006-06-22 Vipulkumar Patel Ultra low-loss CMOS compatible silicon waveguides
US7454102B2 (en) 2006-04-26 2008-11-18 Honeywell International Inc. Optical coupling structure
US7628932B2 (en) * 2006-06-02 2009-12-08 Micron Technology, Inc. Wet etch suitable for creating square cuts in si
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US7709341B2 (en) 2006-06-02 2010-05-04 Micron Technology, Inc. Methods of shaping vertical single crystal silicon walls and resulting structures
ITMI20070062A1 (en) * 2007-01-18 2008-07-19 St Microelectronics Srl PROCESS OF MANUFACTURE OF AN INTEGRATED OPTICAL DEVICE
US7920770B2 (en) 2008-05-01 2011-04-05 Massachusetts Institute Of Technology Reduction of substrate optical leakage in integrated photonic circuits through localized substrate removal
US8877616B2 (en) 2008-09-08 2014-11-04 Luxtera, Inc. Method and system for monolithic integration of photonics and electronics in CMOS processes
US8791405B2 (en) * 2009-12-03 2014-07-29 Samsung Electronics Co., Ltd. Optical waveguide and coupler apparatus and method of manufacturing the same
US8506829B2 (en) 2010-02-04 2013-08-13 The United States Of America As Represented By The Secretary Of The Army Semiconductor hollow-core waveguide using photonic crystal gratings
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US20110260297A1 (en) * 2010-04-27 2011-10-27 Shian-Jyh Lin Through-substrate via and fabrication method thereof
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CN103091774A (en) * 2012-11-13 2013-05-08 东北大学秦皇岛分校 Floating type lithium niobate optical waveguide

Also Published As

Publication number Publication date
TW201443499A (en) 2014-11-16
TW201539073A (en) 2015-10-16
EP2962139A1 (en) 2016-01-06
US9005458B2 (en) 2015-04-14
JP6244380B2 (en) 2017-12-06
TWI499817B (en) 2015-09-11
KR101842758B1 (en) 2018-03-27
CN105026966A (en) 2015-11-04
US9568674B2 (en) 2017-02-14
EP2962139B1 (en) 2019-09-25
JP2016509262A (en) 2016-03-24
US20150192737A1 (en) 2015-07-09
WO2014133760A1 (en) 2014-09-04
TWI574069B (en) 2017-03-11
US20140241682A1 (en) 2014-08-28
CN105026966B (en) 2019-10-01
KR20150113095A (en) 2015-10-07

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