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SG11201503354XA - Heat actuated and projected lithography systems and methods - Google Patents

Heat actuated and projected lithography systems and methods

Info

Publication number
SG11201503354XA
SG11201503354XA SG11201503354XA SG11201503354XA SG11201503354XA SG 11201503354X A SG11201503354X A SG 11201503354XA SG 11201503354X A SG11201503354X A SG 11201503354XA SG 11201503354X A SG11201503354X A SG 11201503354XA SG 11201503354X A SG11201503354X A SG 11201503354XA
Authority
SG
Singapore
Prior art keywords
methods
lithography systems
heat actuated
projected lithography
projected
Prior art date
Application number
SG11201503354XA
Inventor
Chad A Mirkin
Xing Liao
Keith A Brown
Guoliang Liu
Abrin L Schmucker
Shu He
Wooyoung Shim
Daniel J Eichelsdoerfer
Boris Rasin
Original Assignee
Univ Northwestern
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Northwestern filed Critical Univ Northwestern
Publication of SG11201503354XA publication Critical patent/SG11201503354XA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
    • G02B13/143—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation for use with ultraviolet radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2049—Exposure; Apparatus therefor using a cantilever
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201503354XA 2012-10-29 2013-10-15 Heat actuated and projected lithography systems and methods SG11201503354XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261719907P 2012-10-29 2012-10-29
US201261719918P 2012-10-29 2012-10-29
PCT/US2013/064959 WO2014070444A1 (en) 2012-10-29 2013-10-15 Heat actuated and projected lithography systems and methods

Publications (1)

Publication Number Publication Date
SG11201503354XA true SG11201503354XA (en) 2015-06-29

Family

ID=50627937

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201503354XA SG11201503354XA (en) 2012-10-29 2013-10-15 Heat actuated and projected lithography systems and methods

Country Status (5)

Country Link
US (2) US9766551B2 (en)
EP (1) EP2926197A4 (en)
CN (1) CN104903793A (en)
SG (1) SG11201503354XA (en)
WO (1) WO2014070444A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105631810B (en) * 2016-01-20 2018-09-11 北京邮电大学 A kind of printing process and system based on the multiplexing of pixel site
US10060736B1 (en) * 2016-04-21 2018-08-28 Appled Materials Israel Ltd. Near-field sensor height control
KR102510967B1 (en) * 2016-12-07 2023-03-16 노오쓰웨스턴 유니버시티 Liquid Masks for Micromanufacturing Processes
US10228670B2 (en) * 2016-12-15 2019-03-12 Woodward, Inc. Characterization using multiplexed resistance reading
CN110720108A (en) * 2017-06-02 2020-01-21 泰拉印刷有限责任公司 Fabrication of micro/nano-scale barcodes using cantilever-free scanning probe lithography
US11640152B2 (en) 2017-09-28 2023-05-02 Siemens Aktiengesellschaft Method and device for providing service for a programmable logic controller
KR102098867B1 (en) * 2018-09-12 2020-04-09 (주)아이테드 Imprinting apparatus and imprinting method
DE102019001137B3 (en) 2019-02-15 2020-08-06 Karlsruher Institut für Technologie Patterned, dendrimeric substrate surfaces and their manufacture and use
JP7587863B2 (en) * 2019-05-30 2024-11-21 マイクロタウ アイピー ピーティーワイ リミテッド Systems and methods for manufacturing microstructures - Patents.com
CN111710754B (en) * 2020-05-11 2023-01-06 桂林理工大学 A two-phase one-step solvothermal preparation method of Bi2S3-graphene-ZnS optoelectronic composite materials
DE102021108647A1 (en) 2021-04-07 2022-10-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung DEVICE AND METHOD FOR MEASURING AT LEAST ONE CHARACTERISTIC OF AN OPTOELECTRONIC COMPONENT
WO2023224652A2 (en) * 2021-10-01 2023-11-23 Northwestern University Methods of forming bioactive patterns using beam pen lithograpy-controlled cross-linking photopolymerization
WO2025206969A1 (en) * 2024-03-29 2025-10-02 Institutul Naţional De Cercetare-Dezvoltare Pentru Microtehnologie - Imt Bucureşti Nanolithography system based on electric current

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166520A (en) 1991-05-13 1992-11-24 The Regents Of The University Of California Universal, microfabricated probe for scanning probe microscopes
JP3268797B2 (en) 1991-10-09 2002-03-25 オリンパス光学工業株式会社 Light introduction device
US5472881A (en) 1992-11-12 1995-12-05 University Of Utah Research Foundation Thiol labeling of DNA for attachment to gold surfaces
US5776748A (en) 1993-10-04 1998-07-07 President And Fellows Of Harvard College Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor
JPH07106229A (en) * 1993-10-05 1995-04-21 Hitachi Ltd Optical lithography method and apparatus
US6339217B1 (en) 1995-07-28 2002-01-15 General Nanotechnology Llc Scanning probe microscope assembly and method for making spectrophotometric, near-field, and scanning probe measurements
US5846909A (en) 1995-05-22 1998-12-08 University Of Texas System Molecular level, precision control over the interfacial properties of high-TC superconductor structures and devices
US5942397A (en) 1996-12-11 1999-08-24 Tarlov; Michael J. Surface immobilization of biopolymers
US5859937A (en) 1997-04-04 1999-01-12 Neomecs Incorporated Minimally invasive sensor
JP3194363B2 (en) 1997-06-25 2001-07-30 財団法人神奈川科学技術アカデミー Patterning method and patterning apparatus
JP3524343B2 (en) 1997-08-26 2004-05-10 キヤノン株式会社 Method for forming minute opening, projection having minute opening, probe or multi-probe using the same, surface observation apparatus, exposure apparatus, and information processing apparatus using the probe
JP3697034B2 (en) 1997-08-26 2005-09-21 キヤノン株式会社 Method of manufacturing protrusions having minute openings, and probes or multiprobes using them
SE9800665D0 (en) * 1998-03-02 1998-03-02 Micronic Laser Systems Ab Improved method for projection printing using a micromirror SLM
WO1999048682A1 (en) 1998-03-27 1999-09-30 University Of Pittsburgh Tarnish resistant article, preparation, manufacture and methods of use of same
US6930754B1 (en) * 1998-06-30 2005-08-16 Canon Kabushiki Kaisha Multiple exposure method
US6794296B1 (en) 1998-09-12 2004-09-21 Universitat Gesamthochschule Kassel Aperture in a semiconductor material, and the production and use thereof
DE69939005D1 (en) 1998-10-13 2008-08-14 Gambro Lundia Ab BIOKOMPATIBLE POLYMER FILM
JP4020225B2 (en) 1998-10-27 2007-12-12 セイコーインスツル株式会社 Near-field optical probe
US6236033B1 (en) 1998-12-09 2001-05-22 Nec Research Institute, Inc. Enhanced optical transmission apparatus utilizing metal films having apertures and periodic surface topography
DE60016761T2 (en) 1999-08-02 2005-12-15 Zetetic Institute, Tucson INTERFEROMETRIC CONFOCUS NEAR FIELD SCREENING MICROSCOPY
US6455334B1 (en) 1999-09-30 2002-09-24 Advanced Micro Devices, Inc. Probe grid for integrated circuit analysis
TWI300856B (en) 1999-10-21 2008-09-11 Konica Minolta Opto Inc
SE522531C2 (en) * 1999-11-24 2004-02-17 Micronic Laser Systems Ab Method and apparatus for labeling semiconductors
JP4472863B2 (en) 1999-12-20 2010-06-02 セイコーインスツル株式会社 Near-field optical probe and near-field optical device using the near-field optical probe
JP4313517B2 (en) 2000-01-26 2009-08-12 セイコーインスツル株式会社 Recording medium, near-field optical head, optical recording apparatus, and manufacturing method thereof
JP2002005810A (en) 2000-06-16 2002-01-09 Canon Inc Probe and manufacturing method thereof, surface observation device, exposure device, information processing device
US6596346B2 (en) 2000-09-29 2003-07-22 International Business Machines Corporation Silicone elastomer stamp with hydrophilic surfaces and method of making same
JP2002296169A (en) 2001-03-30 2002-10-09 Canon Inc Near-field optical probe, near-field optical microscope having the near-field optical probe, near-field optical lithography apparatus, and near-field optical storage apparatus
JP4570363B2 (en) 2001-10-02 2010-10-27 ノースウエスタン ユニヴァーシティ Protein and peptide nanoarrays
US20030085351A1 (en) 2001-11-08 2003-05-08 Ken Nakajima Optical fiber probe and scanning probe microscope provided with the same
JP2003305700A (en) 2002-04-12 2003-10-28 Canon Inc Nanostructure and method for manufacturing the same
US7019312B2 (en) * 2002-06-20 2006-03-28 Mapper Lithography Ip B.V. Adjustment in a MAPPER system
JP4326190B2 (en) 2002-07-10 2009-09-02 スリーエム イノベイティブ プロパティズ カンパニー Flexible mold and manufacturing method thereof
US7507293B2 (en) 2002-10-28 2009-03-24 Hewlett-Packard Development Company, L.P. Photonic crystals with nanowire-based fabrication
US7034854B2 (en) * 2002-11-12 2006-04-25 Nanoink, Inc. Methods and apparatus for ink delivery to nanolithographic probe systems
WO2004107321A2 (en) 2003-05-28 2004-12-09 Tufts University High density optical data storage
US7016018B2 (en) * 2003-06-04 2006-03-21 Fuji Photo Film Co., Ltd. Exposure device
US7016015B2 (en) * 2003-06-20 2006-03-21 Asml Netherlands B.V Lithographic apparatus and device manufacturing method
US7697807B2 (en) 2006-06-01 2010-04-13 Ut-Battelle, Llc Multi-tipped optical component
CA2579603A1 (en) * 2004-09-08 2006-03-16 Nil Technology Aps A flexible nano-imprint stamp
US7476787B2 (en) 2005-02-23 2009-01-13 Stc.Unm Addressable field enhancement microscopy
US7586583B2 (en) 2005-09-15 2009-09-08 Franklin Mark Schellenberg Nanolithography system
KR100792385B1 (en) 2005-12-14 2008-01-09 주식회사 하이닉스반도체 Nano tip electron emission source, method for manufacturing the same, and nano tip lithography apparatus having the same
EP2013662B1 (en) * 2006-04-19 2013-08-14 Northwestern University Article for parallel lithography with two-dimensional pen arrays
US7932993B2 (en) * 2006-09-16 2011-04-26 Wenhui Mei Divided sub-image array scanning and exposing system
KR100829565B1 (en) 2006-10-02 2008-05-14 삼성전자주식회사 Semiconductor probe with wedge-shaped resistive tip and manufacturing method
JP2011519168A (en) * 2008-04-25 2011-06-30 ノースウェスターン ユニヴァーシティ Polymer pen lithography
WO2010096593A2 (en) * 2009-02-18 2010-08-26 Northwestern University Beam pen lithography
US8753813B2 (en) 2009-12-07 2014-06-17 Northwestern University Generation of combinatorial patterns by deliberate tilting of a polymer-pen array
KR101345337B1 (en) * 2011-06-13 2013-12-30 한국생명공학연구원 Preparation apparatus and method of nanopositioning for one-tip multicomponent nano-inking system in the dip-pen nanolithography
US20150309073A1 (en) * 2012-07-13 2015-10-29 Northwestern University Multifunctional graphene coated scanning tips

Also Published As

Publication number Publication date
US20150286148A1 (en) 2015-10-08
EP2926197A1 (en) 2015-10-07
EP2926197A4 (en) 2016-09-07
WO2014070444A1 (en) 2014-05-08
US20180059550A1 (en) 2018-03-01
US9766551B2 (en) 2017-09-19
CN104903793A (en) 2015-09-09

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