SG11201503659QA - Method and apparatus for cleaning semiconductor wafer - Google Patents
Method and apparatus for cleaning semiconductor waferInfo
- Publication number
- SG11201503659QA SG11201503659QA SG11201503659QA SG11201503659QA SG11201503659QA SG 11201503659Q A SG11201503659Q A SG 11201503659QA SG 11201503659Q A SG11201503659Q A SG 11201503659QA SG 11201503659Q A SG11201503659Q A SG 11201503659QA SG 11201503659Q A SG11201503659Q A SG 11201503659QA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor wafer
- cleaning semiconductor
- cleaning
- wafer
- semiconductor
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2012/085403 WO2014082212A1 (en) | 2012-11-28 | 2012-11-28 | Method and apparatus for cleaning semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201503659QA true SG11201503659QA (en) | 2015-06-29 |
Family
ID=50827023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201503659QA SG11201503659QA (en) | 2012-11-28 | 2012-11-28 | Method and apparatus for cleaning semiconductor wafer |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10297472B2 (en) |
| JP (1) | JP6275155B2 (en) |
| KR (1) | KR101992660B1 (en) |
| CN (1) | CN104813438B (en) |
| SG (1) | SG11201503659QA (en) |
| WO (1) | WO2014082212A1 (en) |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103987664B (en) | 2011-12-06 | 2017-03-08 | 德尔塔阀门公司 | Ozone distribution in tap |
| KR101919122B1 (en) * | 2014-08-12 | 2018-11-15 | 주식회사 제우스 | Apparatus and method treating substrate for seperation process |
| WO2017112795A1 (en) | 2015-12-21 | 2017-06-29 | Delta Faucet Company | Fluid delivery system including a disinfectant device |
| CN105977187B (en) * | 2016-05-27 | 2018-05-15 | 湖南新中合光电科技股份有限公司 | A kind of wet-cleaning device and its cleaning method for fiber waveguide wafer production |
| CN108022855A (en) * | 2016-11-03 | 2018-05-11 | 上海新昇半导体科技有限公司 | A kind of semiconductor wafer wet clean equipment |
| TWI645913B (en) * | 2016-11-10 | 2019-01-01 | 辛耘企業股份有限公司 | Liquid processing device |
| CN108109935A (en) * | 2016-11-24 | 2018-06-01 | 隆基绿能科技股份有限公司 | Silicon chip inserting piece device, Wafer Cleaning equipment and silicon wafer cleaning method |
| CN106694443B (en) * | 2016-11-30 | 2019-04-05 | 北京七星华创电子股份有限公司 | The dispatching method and scheduling system of Wafer Cleaning |
| CN107516694A (en) * | 2017-07-31 | 2017-12-26 | 常州市杰洋精密机械有限公司 | A pre-dehydration method for wet cleaning object carrier and the lifting mechanism used |
| CN107622936A (en) * | 2017-08-23 | 2018-01-23 | 东方环晟光伏(江苏)有限公司 | Method for solar silicon wafers cleaning |
| KR102414340B1 (en) * | 2017-09-08 | 2022-06-29 | 에이씨엠 리서치 (상하이) 인코포레이티드 | Method and apparatus for cleaning semiconductor wafers |
| CN107999458B (en) * | 2017-11-30 | 2020-09-22 | 北京南轩兴达电子科技有限公司 | Full-automatic silicon wafer cleaning machine |
| CN108198770B (en) * | 2017-12-27 | 2020-04-28 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Method and device for transmitting wafer |
| CN108091597B (en) * | 2018-01-10 | 2023-11-24 | 池州海琳服装有限公司 | A silicon wafer double-sided cleaning machine |
| CN108321108B (en) * | 2018-04-08 | 2023-07-04 | 通威太阳能(安徽)有限公司 | A solar battery cycle synchronization inserting device |
| US11742196B2 (en) * | 2018-05-24 | 2023-08-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for metallic deionization |
| SG11202011718XA (en) * | 2018-06-07 | 2020-12-30 | Acm Research Shanghai Inc | Apparatus and method for cleaning semiconductor wafers |
| CN111029272A (en) * | 2018-10-10 | 2020-04-17 | 沈阳芯源微电子设备股份有限公司 | Wafer soaking device capable of overturning wafers at large angles |
| US11342204B2 (en) * | 2018-12-14 | 2022-05-24 | Xia Tai Xin Semiconductor (Qing Dao) Ltd. | Method and apparatus for cleaning semiconductor wafers |
| CN109759937A (en) * | 2019-01-30 | 2019-05-17 | 西安奕斯伟硅片技术有限公司 | A kind for the treatment of method and apparatus of silicon wafer |
| TWI837116B (en) * | 2019-03-06 | 2024-04-01 | 大陸商盛美半導體設備(上海)股份有限公司 | Method and apparatus for cleaning semiconductor wafer |
| KR102636979B1 (en) | 2019-04-26 | 2024-02-14 | 삼성전자주식회사 | Multi-chamber equipment |
| JP7336956B2 (en) * | 2019-10-10 | 2023-09-01 | 東京エレクトロン株式会社 | Substrate processing system and substrate processing method |
| TWI840464B (en) * | 2019-12-06 | 2024-05-01 | 大陸商盛美半導體設備(上海)股份有限公司 | Apparatus and method for cleaning semiconductor wafers |
| KR20230040946A (en) * | 2020-04-21 | 2023-03-23 | 에이씨엠 리서치 (상하이), 인코포레이티드 | Method and apparatus for removing particles or photoresist on a substrate |
| US20210407824A1 (en) | 2020-06-30 | 2021-12-30 | Applied Materials, Inc. | Spm processing of substrates |
| US12154810B2 (en) * | 2020-07-21 | 2024-11-26 | Globalwafers Co., Ltd. | Automated semiconductor substrate polishing and cleaning |
| JP7550589B2 (en) * | 2020-09-30 | 2024-09-13 | 東京エレクトロン株式会社 | Substrate Processing System |
| JP7475252B2 (en) * | 2020-10-02 | 2024-04-26 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| CN112371612B (en) * | 2020-10-13 | 2021-08-24 | 江苏亚电科技有限公司 | Basket-free wafer cleaning method |
| KR102586016B1 (en) * | 2020-11-25 | 2023-10-11 | 세메스 주식회사 | Apparatus for treatng a substrate, a supporting unit and method for assembling a supporting unit |
| TWI835028B (en) * | 2020-11-30 | 2024-03-11 | 南韓商細美事有限公司 | Apparatus for treating substrate |
| KR102550896B1 (en) * | 2020-11-30 | 2023-07-05 | 세메스 주식회사 | Apparatus for treating substrate |
| CN112670222A (en) * | 2020-12-24 | 2021-04-16 | 北京北方华创微电子装备有限公司 | Wafer cleaning system |
| CN112735999B (en) * | 2020-12-30 | 2022-12-16 | 上海至纯洁净系统科技股份有限公司 | A general-purpose wafer transfer mechanism and transfer method thereof |
| CN112588689B (en) * | 2021-03-01 | 2021-05-18 | 常州江苏大学工程技术研究院 | Silicon chip washs piles up and carries integrated system |
| CN113097099A (en) * | 2021-03-08 | 2021-07-09 | 长江存储科技有限责任公司 | Cleaning machine table |
| JP7583651B2 (en) * | 2021-03-11 | 2024-11-14 | キオクシア株式会社 | Substrate cleaning apparatus and substrate cleaning method |
| CN113013070B (en) * | 2021-03-16 | 2024-08-02 | 无锡锐思智能焊接装备有限公司 | Wafer cleaning and spin-drying method |
| JP7645703B2 (en) | 2021-04-30 | 2025-03-14 | 株式会社Screenホールディングス | Substrate Processing Equipment |
| JP7650719B2 (en) | 2021-05-17 | 2025-03-25 | 株式会社Screenホールディングス | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS |
| JP7730661B2 (en) | 2021-05-17 | 2025-08-28 | 株式会社Screenホールディングス | Substrate processing method and substrate processing apparatus |
| JP7650722B2 (en) | 2021-05-20 | 2025-03-25 | 株式会社Screenホールディングス | Substrate processing method |
| JP7669241B2 (en) * | 2021-09-17 | 2025-04-28 | キオクシア株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
| JP7720209B2 (en) | 2021-09-24 | 2025-08-07 | 株式会社Screenホールディングス | Substrate processing method and substrate processing apparatus |
| CN114005774B (en) * | 2021-10-28 | 2025-08-22 | 西安奕斯伟材料科技股份有限公司 | Silicon wafer transfer device and silicon wafer transfer method |
| CN116646273A (en) * | 2022-02-15 | 2023-08-25 | 盛美半导体设备(上海)股份有限公司 | Substrate cleaning equipment and its turning device |
| JP2024001576A (en) * | 2022-06-22 | 2024-01-10 | 株式会社Screenホールディングス | Substrate processing equipment |
| JP2024029982A (en) * | 2022-08-23 | 2024-03-07 | 株式会社Screenホールディングス | Substrate processing equipment |
| JP2024030376A (en) | 2022-08-24 | 2024-03-07 | 株式会社Screenホールディングス | Substrate processing equipment |
| JP2024044507A (en) | 2022-09-21 | 2024-04-02 | 株式会社Screenホールディングス | Substrate Processing Equipment |
| JP2024046367A (en) | 2022-09-22 | 2024-04-03 | 株式会社Screenホールディングス | Substrate processing equipment |
| JP2024046366A (en) | 2022-09-22 | 2024-04-03 | 株式会社Screenホールディングス | Substrate processing apparatus |
| JP2024046368A (en) * | 2022-09-22 | 2024-04-03 | 株式会社Screenホールディングス | Substrate treating apparatus |
| JP2024046369A (en) | 2022-09-22 | 2024-04-03 | 株式会社Screenホールディングス | Substrate treating apparatus |
| JP2024046372A (en) | 2022-09-22 | 2024-04-03 | 株式会社Screenホールディングス | Substrate processing equipment |
| JP2024046370A (en) * | 2022-09-22 | 2024-04-03 | 株式会社Screenホールディングス | Substrate Processing Equipment |
| JP2024047292A (en) * | 2022-09-26 | 2024-04-05 | 株式会社Screenホールディングス | Substrate Processing Equipment |
| CN115709196A (en) * | 2022-10-17 | 2023-02-24 | 杭州中欣晶圆半导体股份有限公司 | Apparatus for improving particle contamination after final cleaning and method for controlling the same |
| KR102880737B1 (en) * | 2022-12-28 | 2025-11-07 | 세메스 주식회사 | Apparatus and method for treating substrate |
| CN115938999B (en) * | 2022-12-29 | 2023-11-07 | 徐州威聚电子材料有限公司 | Loading device for cleaning semiconductor silicon wafer |
| CN116387238B (en) * | 2023-06-05 | 2023-08-11 | 盛奕半导体科技(无锡)有限公司 | Ozone cleaning equipment and application thereof in semiconductor wet cleaning process |
| JP7733061B2 (en) | 2023-06-08 | 2025-09-02 | 株式会社Screenホールディングス | Submerged posture change device and substrate processing apparatus equipped with same |
| TWI864951B (en) * | 2023-08-10 | 2024-12-01 | 弘塑科技股份有限公司 | System and method for wafer wet processing and cleaning |
| CN117059530B (en) * | 2023-10-11 | 2023-12-08 | 恒超源洗净科技(深圳)有限公司 | Silicon wafer cleaning tank and cleaning equipment with same |
| JP2025076103A (en) | 2023-11-01 | 2025-05-15 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
| CN119388400A (en) * | 2024-12-02 | 2025-02-07 | 英木精工科技(苏州)有限公司 | An automated silicon wafer cleaning truss robot |
| CN120998820A (en) * | 2025-04-24 | 2025-11-21 | 拓思精工科技(苏州)有限公司 | Wafer cleaning equipment and wafer cleaning methods |
Family Cites Families (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4493606A (en) * | 1982-05-24 | 1985-01-15 | Proconics International, Inc. | Wafer transfer apparatus |
| USRE33341E (en) * | 1983-05-23 | 1990-09-18 | ASQ Technology, Inc. | Wafer transfer apparatus |
| JPH0247046U (en) * | 1988-09-28 | 1990-03-30 | ||
| US5505577A (en) * | 1990-11-17 | 1996-04-09 | Tokyo Electron Limited | Transfer apparatus |
| JP2919054B2 (en) * | 1990-11-17 | 1999-07-12 | 東京エレクトロン株式会社 | Transfer device and transfer method |
| JPH04259222A (en) * | 1991-02-14 | 1992-09-14 | Hitachi Ltd | cleaning equipment |
| JP2756734B2 (en) * | 1991-03-22 | 1998-05-25 | 大日本スクリーン製造株式会社 | Wafer transfer equipment for surface treatment equipment |
| US5327921A (en) * | 1992-03-05 | 1994-07-12 | Tokyo Electron Limited | Processing vessel for a wafer washing system |
| US5240557A (en) * | 1992-06-01 | 1993-08-31 | Texas Instruments Incorporated | Semiconductor wafer stacking apparatus and method |
| JP3131750B2 (en) * | 1992-10-20 | 2001-02-05 | 東京エレクトロン株式会社 | Object detection apparatus and method |
| US5503171A (en) * | 1992-12-26 | 1996-04-02 | Tokyo Electron Limited | Substrates-washing apparatus |
| JPH06275585A (en) * | 1993-03-18 | 1994-09-30 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
| KR100241292B1 (en) * | 1993-08-05 | 2000-02-01 | 다카시마 히로시 | Positioning method and apparatus for semiconductor processing system and its transfer mechanism |
| US5482068A (en) * | 1993-08-18 | 1996-01-09 | Tokyo Electron Limited | Cleaning apparatus |
| JP2758558B2 (en) * | 1993-12-10 | 1998-05-28 | 信越半導体株式会社 | Wafer handling equipment |
| JPH07183268A (en) | 1993-12-21 | 1995-07-21 | Kyushu Komatsu Denshi Kk | Washer of semiconductor wafer |
| US5544421A (en) * | 1994-04-28 | 1996-08-13 | Semitool, Inc. | Semiconductor wafer processing system |
| AU2368495A (en) * | 1994-04-28 | 1995-11-29 | Semitool, Incorporated | Semiconductor processing system with wafer container docking and loading station |
| US5664337A (en) * | 1996-03-26 | 1997-09-09 | Semitool, Inc. | Automated semiconductor processing systems |
| US6712577B2 (en) * | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
| US6833035B1 (en) * | 1994-04-28 | 2004-12-21 | Semitool, Inc. | Semiconductor processing system with wafer container docking and loading station |
| JPH0817894A (en) * | 1994-06-27 | 1996-01-19 | Dainippon Screen Mfg Co Ltd | Substrate surface treatment device |
| US5762084A (en) * | 1994-07-15 | 1998-06-09 | Ontrak Systems, Inc. | Megasonic bath |
| US5730162A (en) * | 1995-01-12 | 1998-03-24 | Tokyo Electron Limited | Apparatus and method for washing substrates |
| US5887602A (en) * | 1995-07-31 | 1999-03-30 | Tokyo Electron Limited | Cleaning machine and method of controlling the same |
| US5853496A (en) * | 1995-08-08 | 1998-12-29 | Tokyo Electron Limited | Transfer machine, transfer method, cleaning machine, and cleaning method |
| JP3328481B2 (en) * | 1995-10-13 | 2002-09-24 | 東京エレクトロン株式会社 | Processing method and apparatus |
| JPH09199461A (en) | 1996-01-17 | 1997-07-31 | Nec Corp | Substrate cleaning device and method |
| US6279724B1 (en) * | 1997-12-19 | 2001-08-28 | Semitoll Inc. | Automated semiconductor processing system |
| US6942738B1 (en) * | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
| US6672820B1 (en) * | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
| US6091498A (en) * | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US6752584B2 (en) * | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
| US6645355B2 (en) * | 1996-07-15 | 2003-11-11 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US8028978B2 (en) * | 1996-07-15 | 2011-10-04 | Semitool, Inc. | Wafer handling system |
| US6050275A (en) * | 1996-09-27 | 2000-04-18 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| WO2004075285A1 (en) * | 1997-03-07 | 2004-09-02 | Takuya Shibao | Substrate treating device |
| JP3548373B2 (en) * | 1997-03-24 | 2004-07-28 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| US20030051972A1 (en) * | 1997-05-05 | 2003-03-20 | Semitool, Inc. | Automated immersion processing system |
| KR100707107B1 (en) * | 1997-07-17 | 2007-12-27 | 동경 엘렉트론 주식회사 | Cleaning and drying method and appratus |
| JP3510463B2 (en) * | 1997-11-10 | 2004-03-29 | 東京エレクトロン株式会社 | Substrate alignment apparatus and alignment method |
| US6368040B1 (en) * | 1998-02-18 | 2002-04-09 | Tokyo Electron Limited | Apparatus for and method of transporting substrates to be processed |
| JP3111979B2 (en) | 1998-05-20 | 2000-11-27 | 日本電気株式会社 | Wafer cleaning method |
| US6021791A (en) * | 1998-06-29 | 2000-02-08 | Speedfam-Ipec Corporation | Method and apparatus for immersion cleaning of semiconductor devices |
| US6410436B2 (en) * | 1999-03-26 | 2002-06-25 | Canon Kabushiki Kaisha | Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate |
| US6532975B1 (en) * | 1999-08-13 | 2003-03-18 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
| US6457199B1 (en) * | 2000-10-12 | 2002-10-01 | Lam Research Corporation | Substrate processing in an immersion, scrub and dry system |
| US6745783B2 (en) * | 2000-08-01 | 2004-06-08 | Tokyo Electron Limited | Cleaning processing method and cleaning processing apparatus |
| JP4180787B2 (en) * | 2000-12-27 | 2008-11-12 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| KR100513397B1 (en) * | 2001-01-12 | 2005-09-09 | 삼성전자주식회사 | semiconductor wafer washing system and washing-solution supply method thereof |
| US20020100496A1 (en) * | 2001-02-01 | 2002-08-01 | Chang Hong Tai | Apparatus for cleaning wafers |
| EP1446828A2 (en) * | 2001-11-13 | 2004-08-18 | Fsi International, Inc. | Reduced footprint tool for automated processing of substrates |
| US6808589B2 (en) * | 2002-06-14 | 2004-10-26 | Taiwan Semiconductor Manufacturing Co. Ltd | Wafer transfer robot having wafer blades equipped with sensors |
| EP1577421A1 (en) * | 2002-11-15 | 2005-09-21 | Ebara Corporation | Substrate processing apparatus and method for processing substrate |
| JP3978393B2 (en) * | 2002-12-02 | 2007-09-19 | 株式会社カイジョー | Substrate processing equipment |
| KR100529432B1 (en) | 2003-02-04 | 2005-11-17 | 동부아남반도체 주식회사 | Apparatus for cleaning substrate of semiconductor |
| JP2004327962A (en) * | 2003-04-07 | 2004-11-18 | Matsushita Electric Ind Co Ltd | Resist stripping device and stripping method |
| EP1614150B1 (en) * | 2003-04-11 | 2007-08-29 | Dynamic Microsystems Semiconductor Equipment GmbH | Device and method for cleaning and drying objects used to produce semiconductors, especially transport and cleaning containers for wafers |
| JP4291034B2 (en) * | 2003-04-25 | 2009-07-08 | 大日本スクリーン製造株式会社 | Cleaning apparatus and substrate processing apparatus |
| JP4413562B2 (en) * | 2003-09-05 | 2010-02-10 | 東京エレクトロン株式会社 | Processing system and processing method |
| JP4498893B2 (en) * | 2004-11-11 | 2010-07-07 | 大日本スクリーン製造株式会社 | Substrate processing method and substrate processing apparatus |
| US7396412B2 (en) * | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
| JP4410121B2 (en) * | 2005-02-08 | 2010-02-03 | 東京エレクトロン株式会社 | Coating and developing apparatus and coating and developing method |
| CN100495652C (en) * | 2005-04-11 | 2009-06-03 | 斗山Mecatec株式会社 | Semiconductor chip cleaning system |
| CN100385618C (en) | 2005-09-08 | 2008-04-30 | 联华电子股份有限公司 | Wafer protection system of wafer cleaning device and wafer cleaning process |
| JP4688637B2 (en) * | 2005-10-28 | 2011-05-25 | 東京エレクトロン株式会社 | Substrate processing apparatus, batch knitting apparatus, batch knitting method, and batch knitting program |
| JP5188952B2 (en) * | 2006-02-22 | 2013-04-24 | 株式会社荏原製作所 | Substrate processing equipment |
| US20070221254A1 (en) * | 2006-03-24 | 2007-09-27 | Akira Izumi | Substrate processing apparatus and substrate processing method |
| US7833351B2 (en) * | 2006-06-26 | 2010-11-16 | Applied Materials, Inc. | Batch processing platform for ALD and CVD |
| JP5154102B2 (en) * | 2007-03-07 | 2013-02-27 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| JP5466638B2 (en) * | 2007-07-05 | 2014-04-09 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | Apparatus and method for cleaning semiconductor substrate |
| JP4828503B2 (en) * | 2007-10-16 | 2011-11-30 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate transfer method, computer program, and storage medium |
| KR101226954B1 (en) * | 2008-08-06 | 2013-01-28 | 세메스 주식회사 | Substrate processing apparatus and method for transferring substrate of the same |
| KR101015227B1 (en) * | 2008-08-06 | 2011-02-18 | 세메스 주식회사 | Substrate processing apparatus and substrate transfer method thereof |
| KR101181560B1 (en) * | 2008-09-12 | 2012-09-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Substrate processing apparatus and substrate conveying apparatus for use in the same |
| CN201375944Y (en) | 2009-02-27 | 2010-01-06 | 深圳市捷佳创精密设备有限公司 | Follow-up spraying device |
| JP5293459B2 (en) * | 2009-07-01 | 2013-09-18 | 東京エレクトロン株式会社 | Substrate processing equipment |
| JP5454108B2 (en) * | 2009-11-30 | 2014-03-26 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
| JP5458857B2 (en) * | 2009-12-14 | 2014-04-02 | 株式会社Sumco | Cleaning method |
| CN201956323U (en) | 2010-09-25 | 2011-08-31 | 王敬 | Wafer cleaning equipment |
| US20120305192A1 (en) * | 2011-06-03 | 2012-12-06 | Arthur Keigler | Parallel single substrate processing fluid jet module |
| JP5646419B2 (en) * | 2011-09-09 | 2014-12-24 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
| JP5993625B2 (en) * | 2012-06-15 | 2016-09-14 | 株式会社Screenホールディングス | Substrate reversing apparatus and substrate processing apparatus |
-
2012
- 2012-11-28 CN CN201280077256.1A patent/CN104813438B/en active Active
- 2012-11-28 JP JP2015544287A patent/JP6275155B2/en active Active
- 2012-11-28 SG SG11201503659QA patent/SG11201503659QA/en unknown
- 2012-11-28 KR KR1020157012686A patent/KR101992660B1/en active Active
- 2012-11-28 WO PCT/CN2012/085403 patent/WO2014082212A1/en not_active Ceased
- 2012-11-28 US US14/647,996 patent/US10297472B2/en active Active
-
2019
- 2019-04-08 US US16/377,894 patent/US11462423B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016502275A (en) | 2016-01-21 |
| WO2014082212A1 (en) | 2014-06-05 |
| KR20150088792A (en) | 2015-08-03 |
| US20190273003A1 (en) | 2019-09-05 |
| US11462423B2 (en) | 2022-10-04 |
| CN104813438A (en) | 2015-07-29 |
| US20150332940A1 (en) | 2015-11-19 |
| US10297472B2 (en) | 2019-05-21 |
| KR101992660B1 (en) | 2019-09-30 |
| JP6275155B2 (en) | 2018-02-07 |
| CN104813438B (en) | 2017-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201503659QA (en) | Method and apparatus for cleaning semiconductor wafer | |
| SG11201405431TA (en) | Method and apparatus for manufacturing semiconductor device | |
| ZA201401306B (en) | Apparatus and method for cleaning photovoltaic devices | |
| SG11201702033VA (en) | Apparatus and method for cleaning semiconductor wafer | |
| TWI562367B (en) | Semiconductor device and method for manufacturing semiconductor device | |
| SG11201504078TA (en) | Wafer dicing apparatus and wafer dicing method | |
| IL238967A0 (en) | Cleaning liquid for semiconductor elements and cleaning method using same | |
| SG11201504734VA (en) | Semiconductor device and method for manufacturing the same | |
| TWI561317B (en) | Substrate cleaning apparatus and substrate processing apparatus | |
| GB201506267D0 (en) | Advanced handler wafer debonding method | |
| EP2854160A4 (en) | Substrate processing apparatus and substrate processing method | |
| IL222480A0 (en) | Device and method for inspecting moving semiconductor wafers | |
| SG10201406877WA (en) | Method for chemical mechanical polishing silicon wafers | |
| SG2013087671A (en) | Method for polishing a semiconductor wafer | |
| SG11201503763PA (en) | Wire-bonding apparatus and method of manufacturing semiconductor device | |
| KR102002042B9 (en) | Substrate processing apparatus and substrate processing method | |
| GB201213673D0 (en) | Semiconductor device and fabrication method | |
| SG11201401955YA (en) | Wafer support apparatus and semiconductor processing device having same | |
| SG11201503849YA (en) | Wire-bonding apparatus and method of manufacturing semiconductor device | |
| SG11201604486XA (en) | Semiconductor wafer processing methods and apparatus | |
| SG11201404426YA (en) | Semiconductor device and method for producing same | |
| SG10201404086XA (en) | Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus | |
| TWI563559B (en) | Method and apparatus for substrate rinsing and drying | |
| SG11201401991PA (en) | Device and method for treating wafer-shaped articles | |
| SG11201400619QA (en) | Methods and apparatus for cleaning flip chip assemblies |