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SG11201408451WA - Use of vacuum chucks to hold a wafer or wafer sub-stack - Google Patents

Use of vacuum chucks to hold a wafer or wafer sub-stack

Info

Publication number
SG11201408451WA
SG11201408451WA SG11201408451WA SG11201408451WA SG11201408451WA SG 11201408451W A SG11201408451W A SG 11201408451WA SG 11201408451W A SG11201408451W A SG 11201408451WA SG 11201408451W A SG11201408451W A SG 11201408451WA SG 11201408451W A SG11201408451W A SG 11201408451WA
Authority
SG
Singapore
Prior art keywords
wafer
stack
international
sub
singapore
Prior art date
Application number
SG11201408451WA
Inventor
Hartmut Rudmann
Stephan Heimgartner
John A Vidallon
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG11201408451WA publication Critical patent/SG11201408451WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2551/00—Optical elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Bakery Products And Manufacturing Methods Therefor (AREA)

Abstract

(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 9 January 2014 (09.01.2014) WIPOIPCT (10) International Publication Number WO 2014/007758 A1 (51) International Patent Classification: H01L 21/67 (2006.01) B65G 49/07 (2006.01) H01L 21/683 (2006.01) B25B 11/00 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/SG2013/000269 28 June 2013 (28.06.2013) English (30) Priority Data: 61/667,659 3 July 2012 (03.07.2012) English US (71) Applicant: HEPTAGON MICRO OPTICS PTE. LTD. [SG/SG]; 26 Woodlands Loop, Singapore 738317 (SG). (72) Inventors: RUDMANN, Hartmut; Ruetiwiesstrasse 20, 8645 Jona (CH). HEIMGARTNER, Stephan; Kuenzli- mattstrasse 4, 5032 Aarau Rohr (CH). VIDALLON, John A.; Block 117, Simei Street 1, #04-552, Singapore 520117 (SG). (74) Agent: ALLEN & GLEDHILL LLP; One Boulevard #28-00, Singapore 018989 (SG). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: Marina — with international search report (Art. 21(3)) (54) Title: USE OF VACUUM CHUCKS TO HOLD A WAFER OR WAFER SUB-STACK 00 i> i> o o 60A OW o CJ o & (57) Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub- stack. In some implementations, wafer a or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
SG11201408451WA 2012-07-03 2013-06-28 Use of vacuum chucks to hold a wafer or wafer sub-stack SG11201408451WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261667659P 2012-07-03 2012-07-03
PCT/SG2013/000269 WO2014007758A1 (en) 2012-07-03 2013-06-28 Use of vacuum chucks to hold a wafer or wafer sub-stack

Publications (1)

Publication Number Publication Date
SG11201408451WA true SG11201408451WA (en) 2015-01-29

Family

ID=49882364

Family Applications (3)

Application Number Title Priority Date Filing Date
SG11201408451WA SG11201408451WA (en) 2012-07-03 2013-06-28 Use of vacuum chucks to hold a wafer or wafer sub-stack
SG10201610943TA SG10201610943TA (en) 2012-07-03 2013-06-28 Use of vacuum chucks to hold a wafer or wafer sub-stack
SG10201800482RA SG10201800482RA (en) 2012-07-03 2013-06-28 Use of vacuum chucks to hold a wafer or wafer sub-stack

Family Applications After (2)

Application Number Title Priority Date Filing Date
SG10201610943TA SG10201610943TA (en) 2012-07-03 2013-06-28 Use of vacuum chucks to hold a wafer or wafer sub-stack
SG10201800482RA SG10201800482RA (en) 2012-07-03 2013-06-28 Use of vacuum chucks to hold a wafer or wafer sub-stack

Country Status (5)

Country Link
US (2) US9793152B2 (en)
CN (1) CN104471695B (en)
SG (3) SG11201408451WA (en)
TW (1) TWI591753B (en)
WO (1) WO2014007758A1 (en)

Families Citing this family (15)

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US10014228B2 (en) * 2014-11-24 2018-07-03 Rudolph Technologies, Inc. Method and apparatus to assist the processing of deformed substrates
TWI735562B (en) * 2016-04-08 2021-08-11 新加坡商新加坡恒立私人有限公司 Thin optoelectronic modules with apertures and their manufacture
JP6510461B2 (en) * 2016-05-25 2019-05-08 日本特殊陶業株式会社 Substrate holding device
CN106129028B (en) * 2016-07-13 2018-10-19 京东方科技集团股份有限公司 A kind of diode displaying array and preparation method thereof, wearable device
CN108074848B (en) * 2016-11-10 2020-07-03 致茂电子(苏州)有限公司 Spacer, wafer stacking structure, suction type moving device and wafer moving method
TWI628134B (en) * 2017-02-18 2018-07-01 捷惠自動機械有限公司 Plate and spacer moving stacking method and structure thereof
US10879102B2 (en) * 2017-08-07 2020-12-29 Boston Process Technologies, Inc Flux-free solder ball mount arrangement
US10254214B1 (en) 2018-02-20 2019-04-09 Nanotronics Imaging, Inc. Systems, devices, and methods for combined wafer and photomask inspection
DE112019006375T5 (en) * 2018-12-20 2021-09-02 Ams Sensors Singapore Pte. Ltd. OPTOELECTRONIC MODULES WITH AN OPTICAL TRANSMITTER AND AN OPTICAL RECEIVER
JP7590332B2 (en) 2019-02-15 2024-11-26 キューリック・アンド・ソファ・ネザーランズ・ベーフェー Dynamic Release Tape for Assembling Discrete Components
SE1930124A1 (en) * 2019-04-12 2020-10-13 Epiluvac Ab Device and method for ensuring flatness of wafer during growth
KR20220116003A (en) * 2019-12-17 2022-08-19 쿨리케 & 소파 네덜란드 비.브이. Adhesive tape to accommodate individual components
CN111085954A (en) * 2019-12-24 2020-05-01 深圳市华星光电半导体显示技术有限公司 Substrate adsorption device
US11794314B2 (en) * 2021-08-30 2023-10-24 Kla Corporation Quick swap chuck with vacuum holding interchangeable top plate
CN113715466B (en) * 2021-08-31 2023-06-06 艾尔玛科技股份有限公司 Manufacturing device and process of nano texture transfer printing decoration panel

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07169660A (en) * 1993-09-09 1995-07-04 Xerox Corp Equipment and method for joining wafer pair
US6164633A (en) * 1999-05-18 2000-12-26 International Business Machines Corporation Multiple size wafer vacuum chuck
JP2006054286A (en) * 2004-08-11 2006-02-23 Seiko Epson Corp Vacuum chuck jig, vacuum chuck method, and manufacturing method of liquid-droplet discharging head
US20070216049A1 (en) 2006-03-20 2007-09-20 Heptagon Oy Method and tool for manufacturing optical elements
TW200937642A (en) * 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
JP2011516658A (en) 2008-03-31 2011-05-26 ヘンケル コーポレイション Multilayer UV curable adhesive film
TW201033641A (en) 2008-09-18 2010-09-16 Tessera North America Inc Recessed optical surfaces
US9159595B2 (en) 2010-02-09 2015-10-13 Suss Microtec Lithography Gmbh Thin wafer carrier

Also Published As

Publication number Publication date
CN104471695B (en) 2017-09-19
SG10201800482RA (en) 2018-03-28
TW201409606A (en) 2014-03-01
CN104471695A (en) 2015-03-25
WO2014007758A1 (en) 2014-01-09
US9899251B2 (en) 2018-02-20
US9793152B2 (en) 2017-10-17
US20180005864A1 (en) 2018-01-04
SG10201610943TA (en) 2017-02-27
US20150340265A1 (en) 2015-11-26
TWI591753B (en) 2017-07-11

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